Patents Assigned to Lintec Corporation
  • Patent number: 11512200
    Abstract: A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: November 29, 2022
    Assignee: LINTEC CORPORATION
    Inventor: Yasunori Karasawa
  • Patent number: 11512231
    Abstract: This gas barrier laminate comprises a base layer; a gas barrier layer laminated on one surface (A) of the base layer, directly or with another layer sandwiched therebetween; a protective film (?) laminated directly on the gas barrier layer; and a protective film (?) laminated on a surface (B) opposite to the surface (A) of the base layer, directly or with another layer sandwiched therebetween, wherein the gas barrier layer contains a specific inorganic compound, and an adhesion at the time of peeling the protective film (?) and an adhesion at the time of peeling the protective film (?) under specific conditions are both less than or equal to specific values.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: November 29, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Takumi Furuya, Wataru Iwaya, Takehiro Ohashi
  • Publication number: 20220355419
    Abstract: A method of manufacturing a thinned wafer by separating a residual wafer from the thinned wafer, the method including: a weak layer forming step of forming a planar weak layer WL along one surface WFA of a semiconductor wafer WF to divide the semiconductor wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary; and a separating step of supporting at least one of a thinned wafer WF1 side and a residual wafer WF2 side of the semiconductor wafer WF and separating the thinned wafer WF1 and the residual wafer WF2 from each other, wherein the separation of the thinned wafer WF1 and the residual wafer WF2 gradually progresses from one end WFF in an outer edge of the semiconductor wafer WF toward the other end WFR in the outer edge of the semiconductor wafer WF.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Applicant: LINTEC CORPORATION
    Inventor: Naofumi IZUMI
  • Publication number: 20220351991
    Abstract: A device includes: a separating unit 10 which forms a weak layer WL in a semiconductor wafer WF supported by a base support unit BS to divide the wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary, and separates the wafer WF2 from the wafer WF1; a first transfer unit 20 which transfers the wafer WF1 from which the wafer WF2 is separated by the unit 10; a processing unit 30 which applies predetermined processing to the WF1 transferred by the unit 20; a second transfer unit 40 which transfers the wafer WF1 to which the predetermined processing is applied by the unit 30; and a reinforcing member pasting unit 50 which pastes a reinforcing member AS on the wafer WF1 transferred by the unit 40. The unit 20 and the unit 40 transfer the wafer WF1 with the unit BS.
    Type: Application
    Filed: July 16, 2022
    Publication date: November 3, 2022
    Applicant: LINTEC CORPORATION
    Inventor: Naofumi IZUMI
  • Patent number: 11479020
    Abstract: A carbon nanotube sheet structure includes: a carbon nanotube sheet; a first base material including a first base material surface facing the carbon nanotube sheet; and a first spacer providing a gap between the carbon nanotube sheet and the first base material. A first base material surface of the first base material includes a first region on which the first spacer is provided and a second region on which the first spacer is not provided. The first base material is spaced apart from the carbon nanotube sheet at the second region on the first base material surface.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 25, 2022
    Assignees: LINTEC CORPORATION, LINTEC OF AMERICA, INC.
    Inventors: Akio Kabuto, Masaharu Ito, Kanzan Inoue
  • Patent number: 11467323
    Abstract: A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film has an indentation elastic modulus of 30 MPa or more as measured at a maximum load of 2 mN by a nanoindentation method.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: October 11, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Tatsuki Kuramoto, Kentaro Kusama, Baku Katagiri
  • Publication number: 20220317507
    Abstract: An external light use type display body including: a light diffusion control layer; a display layer; and a reflective layer. The light diffusion control layer has a regular internal structure that comprises a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The reflective layer has a patterned indented structure when at least one cross section cut in a thickness direction is viewed. When the entrance plane is irradiated with light rays that travel on the light ray traveling plane with a predetermined incident angle while being scanned along an intersection line of the light ray traveling plane and the entrance plane, the ratio of the light rays satisfying the following Formula (1) or Formula (2) is 50% or more.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 6, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Baku KATAGIRI, Kentaro KUSAMA, Tatsuki KURAMOTO
  • Patent number: 11453804
    Abstract: A pressure sensitive adhesive sheet for batteries that includes a base material and a pressure sensitive adhesive layer provided on one surface side of the base material and containing inorganic fine particles. When D50 and D90 are defined as a volume-based accumulated 50% particle diameter of the inorganic fine particles and a volume-based accumulated 90% particle diameter of the inorganic fine particles, respectively, in a particle size distribution of the inorganic fine particles in the pressure sensitive adhesive layer, the D50 is 0.5 ?m or more and 2.8 ?m or less, and the ratio of the D90 to the D50 (D90/D50) is 1.3 or more and 2.0 or less. The particle size distribution is measured by image analysis on a surface of the pressure sensitive adhesive layer opposite to the base material.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: September 27, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Takeshi Ansai, Yuichi Kurata
  • Patent number: 11443985
    Abstract: A discrete piece forming device that forms discrete pieces by dividing a work. The device includes a modified part forming unit which forms modified parts in the work having a pre-pasted adhesive sheet containing swell grains which swell by application of a predetermined energy, to form, in the work, predefined discrete piece areas each surrounded by the modified parts. The device further includes a dividing unit which divides the work into pieces by forming, in the work, cracks starting from the modified parts by applying external force to the work, to form the discrete pieces. The dividing unit applies the energy to parts of the adhesive sheet to swell the swell grains contained in adhesive sheet parts to which the energy has been applied, thereby displacing the predefined discrete piece areas pasted on the adhesive sheet parts to form the discrete pieces.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: September 13, 2022
    Assignee: LINTEC CORPORATION
    Inventor: Yoshiaki Sugishita
  • Publication number: 20220269356
    Abstract: A writing feel improving sheet comprising a base material and a writing feel improving layer with which a touch pen is brought into contact, wherein the writing feel improving layer contains an antiviral agent, and a number of peaks with an amplitude of 1.5 or more in a frequency range of 1 to 2 Hz is 3 or more and 20 or less.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 25, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Akihira WATANABE, Minami NAKANISHI, Hiroki HOSHINO
  • Patent number: 11420255
    Abstract: A film-shaped firing material 1 is provided, including sinterable metal particles 10 and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: August 23, 2022
    Assignee: LINTEC Corporation
    Inventors: Isao Ichikawa, Hidekazu Nakayama
  • Patent number: 11424397
    Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: August 23, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Wataru Morita, Tsuyoshi Muto, Yuma Katsuta
  • Patent number: 11422401
    Abstract: A light diffusion film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The light diffusion film has an indentation elastic modulus of 30 MPa or more at 23° C.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: August 23, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Tatsuki Kuramoto, Kentaro Kusama, Baku Katagiri
  • Patent number: 11405985
    Abstract: The present disclosure provides a heat-generating sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged spaced apart from each other, each of the electrically conductive linear bodies having a diameter of from 7 ?m to 75 ?m; and a resin protective layer provided at a side of one surface of the pseudo-sheet structure. In this heat-generating sheet for use in three-dimensional molding, the total thickness of layers provided at the side of the pseudo-sheet structure at which the resin protective layer is provided is from 1.5 times to 80 times the diameter of the electrically conductive linear bodies. The present disclosure also provides a surface heat-generating article in which the heat-generating sheet for use in three-dimensional molding is used.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 2, 2022
    Assignees: LINTEC OF AMERICA, INC., LINTEC CORPORATION
    Inventors: Masaharu Ito, Kanzan Inoue
  • Patent number: 11385166
    Abstract: [Problems] Objects include providing a cover film for testing which can be well fixed to a substrate having a groove and with which a material that constitutes an adhesive layer does not invade into the groove and a specimen can be easily stored in the groove, providing a testing member including the cover film for testing, and providing a method of manufacturing the cover film for testing. [Solution] The cover film for testing (1) comprises a base material (10), a hydrophilic coating layer (20) laminated on a surface of the base material (10), and an adhesive layer (30) partially laminated on a surface of the hydrophilic coating layer (20) opposite to the base material (10), whereby the cover film for testing (1) has a region in which the adhesive layer (30) is absent and the hydrophilic coating layer (20) is exposed.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: July 12, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Hiroki Hoshino, Masaya Todaka, Tomoo Orui
  • Publication number: 20220180773
    Abstract: The present invention relates to a peel detection label that is a laminate having a backing, a pattern layer formed on a part of a surface of the backing, and a pressure sensitive adhesive laminate in this order, the pressure sensitive adhesive laminate having at least an intermediate layer and a pressure sensitive adhesive layer, wherein a tensile modulus Et at 23° C. of the backing is 50 MPa or greater and 1000 MPa or less.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 9, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Yumiko AMINO, Naoki TAYA
  • Publication number: 20220146719
    Abstract: A reflective display body configured such that the up-down direction of display content on a display surface can be changed. The reflective display body includes a light diffusion control layer, a display device, and a reflective layer. The light diffusion control layer has a diffusion angle width of 5° or more and 80° or less in which a haze value (%) is 90% or more as measured when one surface of the light diffusion control layer is irradiated with light rays at an incident angle of ?70° to 70° with respect to the normal direction of the one surface being 0°. The light diffusion control layer has an acute angle of 7° or more and 83° or less.
    Type: Application
    Filed: November 10, 2021
    Publication date: May 12, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Baku KATAGIRI, Tatsuki KURAMOTO, Tetsuya ARAZOE, Kentaro KUSAMA
  • Patent number: 11328631
    Abstract: In various embodiments, the present invention is directed to an interior-light-utilizing display obtained by laminating a reflection structure and a light diffusion film, in which the light diffusion film has an internal structure including a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index in the film. The interior-light-utilizing display provides improved luminance and is capable of stably maintaining constant display characteristics even where the incident angle of the external light changes.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: May 10, 2022
    Assignee: LINTEC Corporation
    Inventors: Kentaro Kusama, Tatsuki Kuramoto
  • Patent number: 11322385
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 3, 2022
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11315899
    Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m?n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: April 26, 2022
    Assignees: LINTEC CORPORATION, NICHIA CORPORATION
    Inventors: Akiko Umeda, Manabu Miyawaki, Hidekazu Nakayama, Hiroki Inoue, Toshifumi Imura