Abstract: A nitride semiconductor light-emitting element includes an active layer comprising at least one well layer, a p-type semiconductor layer located on one side of the active layer, and an electron blocking stack body located between the active layer and the p-type semiconductor layer. The electron blocking stack body includes a first electron blocking layer and a second electron blocking layer that is located on the p-type semiconductor layer side relative to the first electron blocking layer and has a lower Al composition ratio than that of the first electron blocking layer. When a total number of the well layers in the active layer is N, a film thickness of the first electron blocking layer is a film thickness d [nm] and an Al composition ratio of the second electron blocking layer is an Al composition ratio x [%], relationships 0.1N+0.9?d?0.2N+2.0 and 10N+40?x?10N+60 are satisfied.

Abstract: A stacked body may include a support, a buffer layer, and an electrode layer, in this order, wherein the buffer layer may include one or more metals selected from the group consisting of Ga, Al, In, and Zn, and oxygen, the electrode layer comprises an oxide of magnesium and an oxide of zinc, and the electrode layer has a half width of a diffraction peak observed at 2?=34.8±0.5 deg in X-ray diffraction measurement of 0.43 deg or smaller.

Abstract: A nitride semiconductor light-emitting element includes a first semiconductor layer; an active layer provided on the first semiconductor layer on one side; a second semiconductor layer provided on the active layer on the opposite side to the first semiconductor layer so as to be in contact with the active layer; and a reflective electrode provided on the second semiconductor layer on the opposite side to the active layer so as to be in contact with the second semiconductor layer and reflects light emitted from the active layer. When an optical film thickness of the second semiconductor layer is an optical film thickness L [nm], a central wavelength of the light emitted from the active layer is a wavelength ? [nm], and an arbitrary number between 1 and 2 is a value m, a relationship 0.48 m ??L?0.5 m ?+(?0.05 m+0.3)? is satisfied.

Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element that emits ultraviolet radiation at a wavelength of not more than 360 nm, a package substrate that houses the semiconductor light-emitting element, a thin film layer that is formed on the package substrate and has a predetermined thickness, and a sealing material made of a silicone resin which is provided on the thin film layer so as to have a lens shape and seals the semiconductor light-emitting element, in which the sealing material forms a contact angle of not less than 15° with the thin film layer.

Abstract: When a pipe pressure of a common discharge pipe during an independent discharge step in which only one reciprocating pump among a plurality of reciprocating pumps discharges a fluid to the common discharge pipe differs from internal pressures in pump chambers of the respective reciprocating pumps at discharge step start point angles, a stroke adjustment mechanism adjusts, on the basis of a pressure difference ?P therebetween, effective stroke lengths of cross heads connected to plungers of the predetermined reciprocating pumps so that the internal pressures in the pump chambers reach the pipe pressure at the discharge step start point angles.

Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. The light extraction layer includes: a plurality of cone-shaped parts formed in an array on the light extraction surface, and a plurality of granular parts formed both on a side part of the cone-shaped part and in a space between adjacent cone-shaped parts. A method of manufacturing the semiconductor light emitting device includes: forming a mask having an array pattern on the light extraction layer; and etching the mask and the light extraction layer from above the mask. The etching includes first dry-etching performed until an entirety of the mask is removed and second dry-etching performed to further dry-etch the light extraction layer after the mask is removed.

Abstract: A nitride semiconductor light-emitting element includes an n-type cladding layer including n-type AlGaN, and an active layer that includes AlGaN and is located on the n-type cladding layer. Si concentration distribution in a direction of stacking the n-type cladding layer and the active layer has a local peak in the active layer.

Abstract: A dialysate solution container includes a flexible first bag body. The dialysate solution container further includes a second bag body which has a mixing region for mixing a first powdered pharmaceutical agent and water at a lower end portion of a second interior. The second bag body further has a communication pipe that places the exterior of the second bag body and the second interior in communication, and a first filter which is in communication with a first interior of the first bag body. A first end of the communication pipe is capable of being connected to a dialysis circuit, and a second end thereof is disposed within the mixing region.

Abstract: A nitride semiconductor light-emitting element includes an n-type cladding layer including n-type AlGaN and having a first Al composition ratio, and a multiple quantum well layer in which a plurality (number N) of barrier layers including AlGaN having a second Al composition ratio more than the first Al composition ratio and a plural (number N) well layers having an Al composition ratio less than the second Al composition ratio are stacked alternately in this order, wherein the second Al composition ratio of the plurality of barrier layers of the multiple quantum well layer increases at a predetermined increase rate from an n-type cladding layer side toward an opposite side to the n-type cladding layer side.

Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element that emits ultraviolet radiation at a wavelength of not more than 360 nm, a package substrate that houses the semiconductor light-emitting element, a thin film layer that is formed on the package substrate and has a predetermined thickness, and a sealing material made of a silicone resin which is provided on the thin film layer so as to have a lens shape and seals the semiconductor light-emitting element, in which the sealing material forms a contact angle of not less than 15° with the thin film layer.

Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface of the semiconductor light emitting device. A proportion of an area occupied by the multiple cone-shaped parts per a unit area of the light extraction surface is not less than 65% and not more than 95% in a plan view of the light extraction surface, and an aspect ratio h/p defined as a proportion of a height h of the cone-shaped part relative to a distance p between apexes of adjacent cone-shaped parts is not less than 0.3 and not more than 1.0.

Abstract: A nitride semiconductor light-emitting element includes an active layer including an AlGaN-based barrier layer, a p-type contact layer located on an upper side of the active layer, and an electron blocking stack body located between the active layer and the p-type contact layer. The electron blocking stack body includes a first electron blocking layer and a second electron blocking layer. The first electron blocking layer is located on the active layer side and has a higher Al composition ratio than an Al composition ratio in the barrier layer. The second electron blocking layer is located on the p-type contact layer side and has a lower Al composition ratio than an Al composition ratio in the barrier layer.

Abstract: A semiconductor light-emitting element is configured to emit ultraviolet light having a wavelength of 320 nm or shorter. Denoting a total area of a principal surface of a substrate as S0, an area on a p-type semiconductor layer in which a p-side contact electrode is formed as S1, an area on an n-type semiconductor layer in which an n-side contact electrode is formed as S2, a reflectivity of the p-side contact electrode for ultraviolet having a wavelength of 280 nm incident from a side of the p-type semiconductor layer as R1, and a reflectivity of the n-side contact electrode for ultraviolet light having a wavelength of 280 nm incident from a side of the n-type semiconductor layer as R2, (S1/S0)×R1+(S2/S0)×R2?0.5, S1>S2, and R1?R2.

Abstract: A fluid sterilization apparatus includes: a flow passage tube in which a processing passage where a passing fluid is sterilized is formed; a first light source that irradiates the processing passage with ultraviolet light; an inflow passage formed in a direction that intersects an outer circumferential surface of the flow passage tube; and a communication passage that causes the inflow passage to communicate with the processing passage. The communication passage has a narrow passage in the middle of a path from the inflow passage toward an opening of a first end, the narrow passage being narrower than a passage toward the inflow passage.

Abstract: A semiconductor light-emitting element includes: an n-type semiconductor layer made of an n-type AlGaN-based semiconductor material; an active layer made of an AlGaN-based semiconductor material provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; a p-side contact electrode made of Rh and in contact with the p-type semiconductor layer; a p-side electrode covering layer made of TiN that covers the p-side contact electrode; a dielectric protective layer that covers the n-type semiconductor layer, the active layer, the p-type semiconductor layer, and the p-side electrode covering layer; and a p-side pad electrode in contact with the p-side electrode covering layer in a p-side opening that extends through the dielectric protective layer on the p-side contact electrode.

Abstract: A semiconductor light emitting element includes: an n-type semiconductor layer; an active layer provided in a first region on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; a first covering layer that is provided to cover a second region on the n-type semiconductor layer different from the first region, a side of the active layer, and the p-type semiconductor layer and that is made of aluminum oxide (Al2O3); an n-side contact electrode that extends through the first covering layer and is in contact with the n-type semiconductor layer; a p-side contact electrode that extends through the first covering layer and is in contact with the p-type semiconductor layer; and a second covering layer provided to cover the first covering layer, the n-side contact electrode, and the p-side contact electrode.

Abstract: A nitride semiconductor light emitting element includes a multi-quantum well layer including AlGaN, and including a plurality of well layers and producing light by combining carriers and emitting deep ultraviolet light with a central wavelength of 250 nm to 350 nm, a metal electrode part including Al that is located above the multi-quantum well layer and reflects a first light that is a part of the light produced by the multi-quantum well layer and travels upward, a multi-stacked semiconductor layer that is located between the multi-quantum well layer and the metal electrode part, includes a plurality of p-type semiconductor layers including p-type AlGaN, and is configured in such a manner that the first light travels out and back therewithin via reflection at the metal electrode part until meeting a second light that is a part of the light produced by the multi-quantum well layer and travels downward, and an ITO contact electrode part provided between the metal electrode part and the multi-quantum well layer

Abstract: A blood purification device used with a blood circuit includes an arterial-side line and a venous-side line attached to a blood purifier to which, at the ends thereof, the arterial-side line and the venous-side line are connected, the blood purification device including: a supply line connected to a supply unit which supplies a priming fluid, and which is capable of being connected to a leading end of the venous-side line; a discharge line connected to a discharge unit which discharges the priming fluid after use, and which is capable of being connected to a leading end of the arterial-side line; and a blood pump which is disposed upon the arterial-side line. By driving the blood pump in a state of the supply line being connected to the venous-side line and the discharge line being connected to the arterial-side line, the blood circuit and the blood purifier are primed.

Abstract: A deep ultraviolet light emitting device includes: a light extraction surface; an n-type semiconductor layer provided on the light extraction surface; an active layer having a band gap of 3.4 eV or larger; and a p-type semiconductor layer provided on the active layer. Deep ultraviolet light emitted by the active layer is output outside from the light extraction surface. A side surface of the active layer is inclined with respect to an interface between the n-type semiconductor layer and the active layer, and an angle of inclination of the side surface is not less than 15° and not more than 50°.

Abstract: A nitride semiconductor light-emitting element includes a substrate, a buffer layer formed on the substrate, an n-type semiconductor layer formed on the buffer layer, and an active layer being formed on the n-type semiconductor layer and comprising a single quantum well structure. A full width at half maximum of an X-ray rocking curve for a (102) plane of the buffer layer is not less than 369.4 arcsec and not more than 492.5 arcsec.