Abstract: An optical module includes: a wiring substrate that has a wiring pattern including a connecting portion and is arranged on an optical subassembly so as to be electrically connected thereto; and a flexible insulating layer formed between the optical subassembly and the wiring substrate. The optical subassembly includes: a conductive stem that has a surface opposed to the wiring substrate, the conductive stem being shaped so that the surface has a through hole opened therein and being connected to a reference potential; and a signal lead for transmitting a signal, the signal lead passing through the through hole while being electrically insulated from the conductive stem. The signal lead passes through the flexible insulating layer to be joined to the connecting portion. The flexible insulating layer is in contact with the connecting portion, the signal lead, and the surface of the conductive stem.

Abstract: An optical receiver module includes a light receiving element that has a first electrode and a second electrode for receiving a bias and converts an optical signal inputted into an electrical signal to output the electrical signal via the first electrode. A signal line extends from the first electrode through the light receiving element-side signal pad and the second wire to the amplifier-side signal pad. A bias line extends from the second electrode through the light receiving element-side bias pad, the first wire, and the third wire to the first and second amplifier-side bias pads. The signal line three-dimensionally intersects with the bias line at an interval in a direction of the loop height of the first wire and that of the second wire.

Abstract: A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.

Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.

Abstract: Provided are a printed circuit board configured to achieve reduction in impedance of a differential transmission line extending in a stacking direction, and an optical module. The printed circuit board includes a stacking-direction differential transmission line extending in the stacking direction, including: a differential signal via pair including a first signal via and a second signal via; and a plurality of conductor plate pairs each including a first conductor plate expanding outward from the first signal via, and a second conductor plate expanding outward from the second signal via. With respect to a perpendicular bisector of a center-of-gravity line segment connecting centers of gravity of the first and second signal vias, in each of the plurality of conductor plate pairs, centers of gravity of contours of the first and second conductor plates are located on inner sides of the centers of gravity.

Abstract: An optical module includes: a photonic device emitting or receiving a light wave; an optical waveguide for transmitting the light wave; a lens focusing the light wave; a mirror for changing a traveling direction of the light wave to optically couple the photonic device with the optical waveguide; a manipulation lever for manipulating an orientation of the mirror; a support spring for supporting the mirror; and a substrate integrated with the mirror, the manipulation lever, and the support spring. The support spring couples the mirror with the substrate so as to allow the mirror to change the orientation thereof with movement or rotation along at least two axes. The manipulation lever extends from the mirror in a direction in which the manipulation lever avoids approaching the optical waveguide.

Abstract: Provided is an optical transmission module in which noise is further reduced. The optical transmission module includes a first semiconductor layer having a first electrode arranged thereon, an active layer with a stripe shape formed on the first semiconductor layer, and a second semiconductor layer with a stripe shape formed on the active layer. The second semiconductor layer has a second electrode arranged thereon and includes a diffraction grating arranged along an extending direction of the active layer. The active layer includes a first portion having first stripe width, a second portion having a second stripe width smaller than the first stripe width, and a connection portion having a varying stripe width so as to connect the first portion and the second portion to each other. The diffraction grating overlaps with the first portion and does not overlap with the second portion in planar view.

Abstract: An optical receiver module includes: a lens array including a plurality of condenser lenses arranged in one direction to define a plane with optical axes in parallel to each other; and a light receiving element array including a plurality of light receiving elements each configured to receive light emitted from each of the condenser lenses. The light receiving element array includes: a semiconductor substrate to which the light from each of the condenser lenses is input and through which the light is transmitted; and light receiving portions each configured to receive the light transmitted through the semiconductor substrate and convert the light into an electrical signal. A shift of the optical axis of each of the condenser lenses from a center of each corresponding one of the light receiving portions is larger in a direction perpendicular to the one direction within the plane than in the one direction.

Abstract: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.

Abstract: The optical module includes a housing having a first opening for inputting or outputting a first electric signal, a second opening for inputting or outputting a second electric signal, and an optical signal port, one or more substrates disposed in the housing, to/from which the first electric signal is input/output and to/from which the second electric signal is input/output, an optical subassembly disposed in the housing and optically connected to the optical signal port, and a control circuit disposed in the housing and mounted on the substrate for controlling the optical subassembly, wherein the first electric signal is an electric signal input to or output from the optical subassembly, the second electric signal is an electric signal input to or output from the control circuit, and the second opening is provided on one side different from other side of the housing on which the first opening is provided.

Abstract: An optical transmission module that converts an electric signal to an optical signal and outputs the optical signal, including: a package; a plurality of light-emitting elements each emitting light in the interior of the package; a plurality of light-receiving elements each including a light-receiving surface on which a portion of the light is incident in the interior of the package, for monitoring light outputs of the plurality of light-emitting elements; and light-shielding members provided on the plurality of light-receiving elements while avoiding the light-receiving surfaces.

Abstract: A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.

Abstract: The invention provides a dust cap which allows for performing operation test of an optical transceiver without removing the dust cap from the optical transceiver. The dust cap 100 comprises: a connector 110a having an opening on a distal end of the connector 110a, which is pressed into a transmission adapter of the optical transceiver 300; a connector 110b having an opening on a distal end of the connector 110b, which is pressed into a reception adapter of the optical transceiver 300 adjacent to the transmission adapter; a support member 140 connected with proximal ends of the connectors 110a, 110b and configured to support the connectors 110a, 110b; and an optical transmission path 130 configured to pass through the connector 110a, the support member 140, and the connector 110b in that order and to transmit light from the opening of the connector 110a to the opening of the connector 110b.

Abstract: The second wiring pattern includes extended regions from the main body side to the projecting portions as seen in a direction in which the pair of leads extend, and wiring regions continuously spreading from the extended regions in a direction away from the main body. Supposing that a length of the wiring region from an end of the projecting portion as a reference point to a farthest position in a direction away from the main body is a first width and a width of the extended region in a direction parallel to a side opposed to the main body side through the end of the projecting portion is a second width, the first width is smaller than the second width. The second insulating substrate is sandwiched between the second wiring pattern and a base, and thereby, a capacitance is formed.

Abstract: An electrical interface includes an insulating body, first electrodes, and second electrodes. The insulating body includes a first front edge surface and a second front edge surface facing in a direction along a transmission direction of an optical signal at an optical interface and having different heights. The first electrode and the second electrode are provided on the insulating body so as to have a thickness from the first front edge surface and the second front edge surface in a direction of the height. A first flexible wiring board and a second flexible wiring board include a first area and a second area extending in directions along the first front edge surface and the second front edge surface, respectively, of the insulating body, and include, in the first area and the second area, first pads and second pads electrically connected with the first electrodes and the second electrodes.

Abstract: An optical transmission module includes: a package; a plurality of light-emitting elements each emitting light in the interior of the package; a beam splitter splitting the light into transmitted light and split light; a plurality of light-receiving elements each including a light-receiving surface on which the split light is incident in the interior of the package, for monitoring light outputs of the plurality of light-emitting elements; and a first light-shielding film provided between the plurality of light-emitting elements and the beam splitter and including a plurality of first holes for the light to propagate to the beam splitter, wherein the plurality of light-receiving elements are disposed with the light-receiving surfaces facing the beam splitter.

Abstract: Multilevel optical intensity modulation high in accuracy is performed using electro-absorption optical modulators. There is provided a plurality of EA modulators connected in series in a path of an optical signal from a light source, and a multilevel-coded modulated optical signal is generated by modulating an intensity of an input optical signal from the light source based on a modulation signal using the EA modulators. Each of the EA modulators is switched between an ON state and an OFF state of optical absorption in accordance with the modulation signal. Regarding an extinction ratio of the ON state to the OFF state in each of the EA modulators, the EA modulators have respective values difference from each other, and are arranged in ascending order of the extinction ratio from the light source side.

Abstract: In order to prevent non-uniformity in emission wavelength among different sites along an optical axis direction, provided is a resonator portion including: a waveguide which includes a first area and a second area being adjacent to the first area; and diffraction gratings formed along an optical axis direction. The effective refraction index in the first area is larger than the one in the second area, and the thickness in the first area is larger than the one in the second area. A pitch at the adjacent diffraction gratings at a boundary between the first area and the second area is narrower both than pitches of the diffraction gratings that are formed in the first area and than pitches of the diffraction gratings that are formed in the second area.

Abstract: A differential transmission circuit includes: a dielectric layer for embedding a plurality of first strip conductor pairs arranged side by side in the same layer above a ground conductor layer, each of the plurality of first strip conductor pairs including a first right strip conductor and a first left strip conductor, the dielectric layer being formed from an upper side of the ground conductor layer up to a region above the plurality of first strip conductor pairs, the dielectric layer having a flat upper surface. A region between adjacent two of the plurality of first strip conductor pairs is embedded in the dielectric layer without arranging a conductor in the region.

Abstract: Provided is a butt-jointed (BJ) semiconductor integrated optical device having a high manufacturing yield. A semiconductor integrated optical device, which is configured such that, on a semiconductor substrate, a first semiconductor optical element including an active layer and a second semiconductor optical element including a waveguide layer are butt-jointed to each other with their optical axes being aligned with each other, includes: a semiconductor regrowth layer including at least one of a diffraction grating layer or an etching stop layer, which is formed by one epitaxial growth across an entire surface above the active layer and the waveguide layer; and a cladding layer formed above the semiconductor regrowth layer.