Abstract: A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.

Abstract: With the hardener particle of the present invention, because siloxane or an alkoxy group is bonded to a central metal located on a surface, an adhesive prepared by dispersing the hardener particles in an epoxy resin together with a silane coupling agent hardly causes reaction between the hardener particles and the silane coupling agent at ambient temperature whereby the preserving property of the adhesive is high. Because no siloxane is bonded to metal chelate or metal alcoholate at the part other than the surface of the hardener particles, the hardener particles are broken when the adhesive is heated, and the metal chelate and the metal alcoholate on the part other than the surface of the hardener particles reacts with the silane coupling agent to form cation, thereby polymerizing the epoxy resin with the cation to harden the adhesive even at low temperature within shorter time.

Abstract: The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 181 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.

Abstract: A printing medium is manufactured by forming a primer layer 12 and an adhesive layer 13 successively on the rubbed surface of a base film 11 and wound into a roll 15. When the printing medium is delivered from roll 15, adhesive layer 13 does not remain on the roll 15 side even if adhesive layer 13 has a low adhesive power because the adhesion between adhesive layer 13 and primer layer 12 is strong while the adhesion between adhesive layer 13 and base film 11 in roll 15 is weak. The printing medium can be run in a printer without using a release film because adhesive layer 13 has a low adhesive power.

Abstract: In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer adjacent thereto, holes A being provided in the insulating layer so as to reach the conductive layer, metal plugs being formed in these holes by an electrolytic plating method, metal bumps being produced by making the tips of these metal plugs project from the insulating layer. In this way, as many as possible flexible printed wiring boards can be obtained from a laminated sheet for flexible printed wiring of prescribed size.

Abstract: A heat-resistant film includes a film substrate and a heat-resistant slip layer. The heat-resistant slip layer is disposed on one surface of the film substrate and contains a binder and a slip additive, which is a higher fatty acid metal salt composition containing a free higher fatty acid in an amount of 3 to 30 wt % and a metal salt of a higher fatty acid. With this heat-resistant film, a good heat-resistivity and slipperiness are obtained even when the slip additive is contained in the heat-resistant slip layer in relatively small amounts. The slip additive improves the solution stability of the coating composition used to form the heat-resistant slip layer. Preferably, the free higher fatty acid is stearic acid and the metal salt of higher fatty acid is aluminum stearate.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: There is provided an adhesive which hardens under the condition of low temperature within short time and has a high preserving property. The latent hardener of the present invention has hardener particles mainly comprising metal chelate and capsules covering the surface of the hardener particles where, in the surface part of the hardener particles, substituent of the resin component constituting the capsule is bonded to the metal chelate. Accordingly, mechanical strength of the capsule is high whereby the capsule is not broken in a step of kneading the latent hardener with an epoxy resin.

Abstract: An improved detectable spool for use with a ribbon includes an improved hub which includes a core and an indication member. The indication member is a generally planar metallic member that is substantially embedded in the core, with the indication member including a support and a plurality of tabs. In at least one embodiment the indication member is a monolithically formed single-piece member, while in another embodiment the indication member is a multi-component member.

Abstract: An adhesive composition is obtained which has high reactivity and is able to connect even plastic substrates with high connection reliability. The adhesive composition is constituted of insulating resin, photopolymerization initiator, and oxetan compound.

Abstract: The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.

Abstract: A fire-retardant adhesive and a fire-retardant adhesive film, which are suitable for producing flat cables using a non-halogen flame-retardant and have fire-retardant properties rivaling those of halogen flame-retardants while maintaining good electrical insulating properties, comprises (A) a polyester resin, (B) a nitrogen-containing organic flame-retardant and (C) a boron compound.

Abstract: Flame-retardant adhesives for circuit materials which are harmless to the environment, show excellent thermo-humidity resistant electrical characteristics and have high flame retardancy. These flame-retardant adhesives contain a saturated polyester resin and a flame retarder containing a component having P—C bond in its molecule and a component having nitrogen in its molecule, and the content of the flame retardant amounts to 90 parts by weight or more per 100 parts by weight of the saturated polyester resin.

Abstract: Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the second metal film or both is (are) patterned while the bumps are in contact with the first metal film, and the first resin film is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone, and cure the first resin film. After curing, the bumps and the first metal film may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.

Abstract: In a thermal ink-transfer recording material comprising a support, and a primer layer and a thermal transferring ink layer which are superposed on the support in this order, the thermal transferring ink layer comprising a binder and a colorant dispersed in the binder, the primer layer is constituted of at least two types of resins that are not compatible with each other so that the recording material is separable at the interface between the support and the primer layer.

Abstract: (a) A method of manufacturing a magnetic head suspension includes a polyimide precursor layer 2 that is formed over a springy material layer 1, (b) a metal layer 3 for lines is formed over the polyimide precursor layer 2, (c) the metal layer 3 is patterned by the subtractive process to produce lines 4, (d) the polyimide precursor layer 2 is patterned by a photolithographic technique to give the configuration corresponding to a polyimide insulating base layer 5, (e) the patterned polyimide precursor layer 2 is imidated to produce the polyimide insulating base layer 5, and (f) a cover coat layer 6 is formed over the lines 4.

Abstract: A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm2 or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.

Abstract: A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.