Abstract: An information recording tag contains: an IC module in which a resonance circuit and an IC chip 3 are packaged on a substrate 1 where the resonance circuit has an antenna coil 2 and a film condenser 5; and an adhesive 17 that is applied to the IC module in order to adhere said IC module onto an adherend, wherein an empty portion 18 that is adhesive-free has been formed in the adhesive 17 so as to distinguish an area on the IC module where the area contains the film condenser 5 from other areas on the IC module.

Abstract: A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5 and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.

Abstract: A protective element contains a heat-generating member and a low melting metal member on a substrate, in which the low melting metal member is molten by the heat generated by the heat-generating member and flows onto electrodes, which causes the low melting metal member to blow out, Formula (1) below is satisfied: (cross-sectional area of the low melting metal member)/(surface area of the blowout-effective electrode)≦0.15  (1) Alternatively, Formula (2) below is satisfied: 2.5≦(inter-electrode distance)/(cross-sectional area of the low melting metal member)≦30  (2) wheren the inter-electrode distance is defined as the distance between two electrodes, among the low melting metal member electrodes onto which the molten low melting metal member flows, which are adjacent to each other with the low melting metal member interposed therebetween.

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.

Abstract: The present invention provides a lowly-adhesive coating material comprising 99 to 33% by weight of a fluorine-containing acrylic polymer obtained by polymerizing a monomer composition mainly comprising acrylate or methacrylate having C6-16 perfluoroalkyl groups and 1 to 67% by weight of a fluorine-type oil.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: A connection structure is configured such that electrodes formed on an overcoat layer on a substrate are connected to other electrode terminals using an anisotropically electroconductive adhesive 30 comprising electroconductive particles dispersed in an insulating adhesive, wherein the angle of encroachment A of the electroconductive particles 32 into the overcoat layer 4 is made to be at least 135°.

Abstract: A protective element includes at least three electrodes provided on one PTC material. The PTC material operates as at least two PTC elements. This protective element can be manufactured, with fewer components, in an easy manner, and at lower cost, and can cope with overcurrent and overvoltage.

Abstract: A low temperature-curable connecting material for anisotropically electroconductive connection, which can be cured at lower temperature with reduction of shrinkage of the material upon curing, whereby an accumulation of internal stresses is avoided to thereby increase the bonding strength and the reliability of electric continuity in the connection while securing an electrically insulating separation between the neighboring electrodes, the connection material comprising an adhesive mass for bonding and connecting elements having electrodes thereon in a correspondingly confronting relationship, wherein the adhesive mass comprises a polymerizable component subject to radical polymerization and to cross-linking, a polymerization initiator and a block copolymer having a segment compatible with the polymerizable component and a segment incompatible with the polymerizable component.

Abstract: A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30° C. in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100° C. and a tensile elongation percentage of at least 3%.

Abstract: An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a connecting material containing an adhesive component constituted mainly of a thermosetting resin, the connecting material being interposed between the two elements to be connected, and an extraneous portion of the connecting material protruding from the periphery of one of the elements on the other one of the elements, wherein the degree of hardening of the thermosetting resin in the connecting material in the extraneous portion is at least 60%.

Abstract: The present invention aims to connect metal films without forming any opening in a resin film.

Abstract: A process for producing a fluorine-containing acrylic or methacrylic polymer, comprises polymerizing a fluorine-containing acrylate or methacrylate in a solution phase formed of an organic solvent and dissolved therein a monomer containing a fluorine-containing acrylate or methacrylate having a polyfluoroalkyl group having 6 to 16 carbon atoms. A non-halogen type solvent is used as the organic solvent and the fluorine-containing acrylate or methacrylate is so polymerized that a polymer-containing liquid phase comprised of the fluorine-containing acrylic or methacrylic polymer formed with progress of polymerization and the organic solvent is separated from the solution phase. This process enables production of a fluorine-containing acrylic or methacrylic polymer having a fluorine monomer in a high proportion by the use of a commonly available general-purpose solvent, without using any fluorine type solvent.

Abstract: A radiation-curable ink, a method of making the ink, a thermal transfer printer ribbon having a radiation-curable ink layer, and a thermal transfer printer with an actinic energy source are provided. A method of thermal transfer printing using an ink ribbon having radiation-curable components is also provided. The radiation curable components of the ink can be thermally dried and are cured after printing of an image on a receiving article.

Abstract: A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes recessed from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechanical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer, even if the passivation layer is made of a resin.

Abstract: It is an object of the present invention to provide a BGA package substrate capable of forming a thin and light BGA package which causes no crack in solder balls during temperature cycling tests and which permits fine-pitch packaging. According to the present invention, a conductive pattern 3 is formed on a solder resist layer 2 made of polyimide and a cover film 4 is formed on the conductive pattern 3. The conductive pattern 3 includes a land 3a for connection to a mother board and a bonding pad 3b for connection to an IC. The solder resist layer 2 has an opening 5 to leave an overlap on the periphery of the land 3a, and an end of the opening 5 is tapered. A solder ball 6 is formed on the land 3a.

Abstract: An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol type epoxy resin (A) as an active ingredient, epoxy resin (B) shown in the following formula and cationic polymerization catalyst (C). The epoxy resin composition can improve the thermal resistance of the adhesive layer in an optical information recording medium, and the adhesive property of the adhesive layer is not lowered even if its hardness is increased or it is in high humidity.

Abstract: A GPS receiver is disclosed wherein GPS position measurement can be performed in a short time without the necessity to wait for periodical time information from a GPS satellite and power consumption is minimized also with a minimized position measurement time. The GPS receiver includes a GPS antenna section for receiving a signal having a signal frequency of a high accuracy from a GPS satellite, a GPS block including a frequency oscillator for generating a frequency and operable to use the frequency from the frequency oscillator to read orbit information placed in the signal from the GPS satellite in synchronism with the signal and enter itself into a standby mode, and a GPS control block having a timer function for rendering the GPS block after entered into the standby mode into an activated mode based on the timer function.

Abstract: A flexible printed board is which has increased bonding strength, with which dispersion of the bonding strength can be prevented, the quality of which can be uniformed, with which curling can satisfactorily be prevented, which exhibits excellent dimensional stability and with which a precise circuit can satisfactorily be formed. A flexible printed board has a copper foil on which first and second polyimide-resin layers are sequentially laminated. The first polyimide layer made contact with the copper foil is formed by forming, turning into an imide, a polyimide precursor which contains polyamic acid components prepared owing to reactions of acid anhydride and amine and polyimide components prepared owing to reactions of acid anhydride and isocyanate.

Abstract: A flexible wiring board piece which can prevent a short circuit because of scattering of the connecting terminal parts and facilitate cutting when cut at an intermediate connecting terminal part. A constitution wherein circuit wiring patterns 13 [131-134] are coated with insulating films 11 and 14; connecting terminal parts 17 of the circuit wiring patterns 13 and cut parts 18 of the circuit wiring patterns 13, which are located apart form the connecting terminal parts 17, are exposed in both faces via openings 20a, 20b, 21a and 21b formed in insulating films 11 and 14; and narrow parts for cutting are formed in the cut parts 18 facing the openings 20b and 20b.