Abstract: An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, with each light emitting pixel including at least one subpixel formed by one or more light emitting diodes positioned on a substrate. At least one photodetector is positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.

Abstract: An electronic device integrates an antenna. To fabricate such an electronic device, first antenna elements are formed on a first surface of a first substrate. The first substrate is then diced to form antenna chips. Each antenna chip includes, on a first surface corresponding to the first surface of the first substrate, one of the first antenna elements. One of the antenna chips is then bonded onto a transfer substrate. This bonding is made between a second surface of the antenna chip, orthogonal to its first surface, and an upper surface of the transfer substrate.

Abstract: An integrated-circuit package includes a flexible electrical-connection element sandwiched between a first face of a first multilayer support substrate and a second face of a second multilayer support substrate. The flexible electrical-connection element laterally projects with respect to, and is in electrical contact with at least one of, the multilayer support substrates. The flexible electrical-connection element and the first multilayer support substrate include, at a first region, respectively two first mutually facing orifices defining together a first cavity. The first cavity is at least partially closed off by a first part of the second face of the second multilayer support substrate. A first component is located in the first cavity, attached at the first part of the second face of the second multilayer support substrate and in electrical contact with the flexible electrical-connection element through the second multilayer support substrate.

Abstract: An indirect time-of-flight measurement sensor includes a photosensitive pixel array configured to acquire a succession of images of a scene during a given exposure time. The sensor includes a control unit configured to control the acquisition of the succession of images by the pixel array and to define an exposure time for this acquisition based on a pixel saturation rate of the array, distances between the sensor and elements of the scene, and a standard deviation of the distances between the sensor and the elements of the scene.

Abstract: This disclosure relates to a time-of-flight sensor including, on a same base substrate, a light emitter configured to emit light into an image scene, a reference sensor configured to detect light emitted by the light emitter, and a signal reception sensor array separated from the light emitter by an optical barrier. The optical barrier is configured to prevent light emitted by the light emitter from directly reaching the signal reception sensor array, with the signal reception sensor array being configured to detect light reflected by the image scene. The reference sensor and the signal reception sensor array are based on semiconductor nanoparticles.

Abstract: A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

Abstract: In an embodiment a method for measuring ambient light includes successively synchronizing optical signal acquisition phases with extinction phases of a disruptive light source, wherein the disruptive light source periodically provides illumination phases and the extinction phases, accumulating, in each acquisition phase, photo-generated charges by at least one photosensitive pixel comprising a pinned photodiode, transferring the accumulated photo-generated charges to an integration node and integrating, for each pixel, the transferred charges on the integration node during a series of the successive acquisition phases.

Abstract: An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.

Abstract: A method includes receiving a histogram output from a detector sensor, and calculating a median point of a pulse waveform within the histogram. The pulse waveform has an even probability distribution over at least one quantization step of the histogram around the median point. A corresponding apparatus can include a detector sensor and a co-processor coupled to the detector sensor.

Abstract: In accordance with an embodiment, a method verifies contents of a plurality of registers having two first registers, where each of the plurality of registers is configured to store a data word and a verification bit. The method includes determining whether a value of the verification bit of each respective register of the plurality of registers corresponds to the data word of its respective register. The data words stored in the two first registers are selected so that the bits of a same rank of the two first registers include two complementary bits, each bit of a common binary word is associated with a respective register of the plurality of registers, and the value of the verification bit of each respective register depends on the data word of the respective register and the bit of the common binary word associated with the respective register.

Abstract: An optical sensor includes pixels. Each pixel has a photodetector. A readout circuit performs a process over an exposure time where the photodetector is connected to a reverse bias voltage supply to reset a voltage across the photodetector, and the photodetector is disconnected from the reverse bias voltage supply until that the voltage across the photodetector decreases in response to received ambient light. An ambient light level is then determine an based on a number of times the voltage across the photodetector is reset over the exposure time.

Abstract: A measurement of the rotation speed of an object is made using a time-of-flight sensor configured to detect a passing of one or more of elements of the object through a given position. The time-of-flight sensor is further mounted on a one-person vehicle configured to protect the one-person vehicle against collisions through the making a time-of-flight measurement of a relative speed between the one-person vehicle and an obstacle.

Abstract: An imaging device includes an array of photosensors. A film of semiconductor nanoparticles is common to the photosensors of the array. The nanoparticles are configured to be excited by light with wavelengths in a range from 280 to 1500 nanometers. Each photosensor includes a top electrode and a bottom electrode positioned on opposite sides of the film of semiconductor nanoparticles. At least some of the photosensors further include a filter configured to transmit light with wavelengths in a range from 280 to 400 nanometers, and to at least partially filter out light with wavelengths greater than 400 nanometers from reaching the photosensor. A transistor level is electrically coupled to the top and bottom electrodes of the photosensors.

Abstract: An electronic device includes an electronic integrated circuit chip assembled on a first region of a substrate. A radiation element of an antenna is mounted to the substrate in a manner where it is separated from the substrate by a second layer of a second dielectric material, and i\s further offset with respect to the first region of the substrate so that the radiation element does not cover the electronic integrated circuit chip. A first coating layer of a first coating material covers at least a surface of the electronic integrated circuit chip facing away from the substrate further covers a surface of the radiation element facing away from the substrate.

Abstract: The method for resetting a master device, configured to initiate transactions on a bus of a system on a chip, includes monitoring a completed or not state of the transactions initiated by the master device. In the case of reception of a command to reset the master device, the method includes a transmission of an effective reset command to the master device when the transactions initiated by the master device are in the completed state.

Abstract: An apparatus is for testing a device to be supplied with power via USB Power Delivery (USB-PD). The apparatus includes at least one USB Type-C connector configured to be connected to the device to be supplied with power to be tested, the at least one USB Type-C connector including a power supply terminal. Processing circuitry of the apparatus is configured to verify that a voltage at the power supply terminal is lower than a first threshold, verify a role of the device, generate requests representative of power supply configurations supported by the role of the device, and verify compatibility of the power supply configurations supported by the device with standardized power supply configurations.

Abstract: In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.

Abstract: The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

Abstract: The present disclosure relates to a circuit and method for determining a sign indicator bit of a binary datum including a step for processing of the binary datum masked with a masking operation, and not including any processing step of the binary datum.