Abstract: An electronic device includes a substrate semiconductor wafer with semiconductor portions separated from one another by through-passages. Electronic circuits and a dielectric layer with a network of electrical connections are formed at a front face of the substrate semiconductor wafer. Electrically conductive fillings are contained within the through-passages and are connected to the network of electrical connections. Interior dielectric layers for anti-diffusion protection are provided in the through-passages between the electrically conductive fillings and the semiconductor portions. Back side dielectric layers are joined to the interior dielectric layers.

Abstract: In an embodiment, a method includes: resetting respective count values of a plurality of analog counters to an initial count value, each analog counter of the plurality of analog counters corresponding to a histogram bin of a time-of-flight (ToF) histogram; after resetting the respective count values, receiving a plurality of digital addresses from a time-to-digital converter (TDC); during an integration period, for each received digital address, selecting one analog counter based on the received digital address, and changing the respective count value of the selected one analog counter towards a second count value by a discrete amount, where each analog counter has a final count value at an end of the integration period; and after the integration period, determining an associated final bin count of each histogram bin of the ToF histogram based on the final count value of the corresponding analog counter.

Abstract: A processing system includes a plurality of circuits configured to generate a plurality of error signals. The processing system further includes a plurality of error pads and a fault collection circuit configured to receive the plurality of error signals and to generate a respective combined error signal for each of the plurality of error pads. The fault collection circuit includes a combinational logic circuit configured to generate the combined error signal by selectively routing the plurality of error signals to the plurality of error pads as a function of a set of configuring bits.

Abstract: An integrated circuit includes a substrate having at least one first domain and at least one second domain that is different from the at least one first domain. A trap-rich region is provided in the substrate at the locations of the at least one second domain only. Locations of the at least one first domain do not include the trap-rich region.

Abstract: A non-emissive display includes a backlight controller sending a pulse during each sub-frame of a plurality of frames to row and column drivers that drive backlight zones. The row drivers count each pulse to keep a pulse count total, and reset the pulse count total when it is equal to a first number indicating how many row drivers are present. Each row driver activates its channels and waits for a next pulse if the pulse count total is not equal to the first number and if the pulse count total is equal to a second number indicating in which sub-frame that first driver is to be activated. Each row driver waits for a next pulse if the pulse count total is not equal to the first number and the second number. Each column driver activates its channel in response to receipt of each pulse.

Abstract: Display elements, each having anode and cathode terminals, are arranged into rows and columns. Each row has an anode-line coupled to the anode terminals for its display elements. Each column has a cathode-line coupled to the cathode terminals for its display elements. A switch for each anode-line selectively couples that anode-line to a storage capacitor, and a switch for each cathode-line selectively couples that cathode-line to the storage capacitor. A display driver activates the row driver for a given row and the column driver for a given column. A switch driver closes the switch for the cathode-line for the given column, then opens the switch for that cathode-line. The display driver deactivates the row driver for the given row, after closing the switch for the cathode-line for the given column. The switch driver closes the switch for the anode-line for the given row.

Abstract: A system on chip includes a programmable logic array. The system on chip also includes a signal conditioner coupled to a data input of the programmable logic array and configured to condition a data signal prior to processing the data signal with the programmable logic array. The signal conditioner can selectively condition the signal by one or both of synchronizing the data signal with a clock signal of the programmable logic array and generating a pulse from the data signal with an edge detector.

Abstract: A circuit includes a high-side transistor pair and a low-side transistor pair having a common intermediate node. The high-side transistor pair includes a first transistor having a control node and a current flowpath therethrough configured to provide a current flow line between a supply voltage node and the intermediate node, and a second transistor having a current flowpath therethrough coupled to the control node of the first transistor. The low-side transistor pair includes a third transistor having a control node and a current flowpath therethrough configured to provide a current flow line between the intermediate node and the reference voltage node, and a fourth transistor having a current flowpath therethrough coupled to the control node of the third transistor. Testing circuitry is configured to be coupled to at least one of the second transistor and the fourth transistor to apply thereto a test-mode signal.

Abstract: The present disclosure is directed to a device that includes a headphone speaker housing that includes a coil having a first terminal and a second terminal that is configured to operate in a sound generation mode and a battery charging mode. A class D amplifier circuit is configured to rectify in a battery charging mode and amplify in a sound generation mode, the class D amplifier is coupled to the first terminal and the second terminal of the coil. The class D amplifier including a first, second, third, and fourth switch, the first terminal coupled between the first and second switch, the second terminal coupled between the third and fourth switch. An audio generation circuit having a third terminal and a fourth terminal, the third terminal coupled between the first and third switch of the class D amplifier and the fourth terminal coupled between the second and fourth switch of the class D amplifier. A battery charging circuit coupled to the third terminal and the fourth terminal.

Abstract: Laser direct structuring, LDS material is molded onto semiconductor dice arranged on die pads in a leadframe and the semiconductor dice are electrically coupled with electrically conductive leads in the leadframe via electrical connections that comprise electrically conductive formations exposed at the front surface of the LDS material, electrically conductive vias between the semiconductor dice and the front surface of the LDS material, as well as electrically conductive lines over the front surface of the LDS material that couple selected ones of the electrically conductive formations with selected ones of the second electrically conductive vias. The electrically conductive vias and lines are provided applying laser beam energy to the front surface of the laser direct structuring material at spatial positions located as a function of the electrically conductive formations exposed at the front surface of the LDS material acting as fiducials.

Abstract: Offset calibration for an analog front-end system is provided. The analog front-end system includes a variable-gain amplifier, and the calibration mitigates an offset error of the variable-gain amplifier. Calibration is based on a difference-based estimation technique combined with digital iteration. Difference-based estimation includes measuring different digital output signals from an analog-to-digital converter for different respective gains of the variable-gain amplifier. The digital iteration is utilized to estimate offsets values which converge a digital output difference to a target of zero volts.

Abstract: An array of single photon avalanche diodes (SPADs) includes a plurality of pixels. Each pixel includes a SPAD having a cathode connected to a first intermediate node and an anode coupled to first negative voltage, a quench circuit connected between the first intermediate node and the low voltage supply node, an AC coupling element connected between the first intermediate node and a second intermediate node, a filter component connected between the high voltage node and the second intermediate node, and an inverter having its input connected to the second intermediate node and its output providing an output signal. A resistance associated with the quench circuit, a capacitance associated with the SPAD, a capacitance associated with the AC coupling element, and a resistance associated with the filter component form a variable second order filter.

Abstract: A method of manufacturing an electronic chip includes the following successive steps: a) forming of a first layer on top of and in contact with a second semiconductor layer, the second layer being on top of and in contact with a third semiconductor layer; b) doping of the first layer to form, on the second layer, a first doped sub-layer of the first conductivity type and a second doped sub-layer of the second conductivity type; c) forming of islands in the first layer organized in an array of rows and of columns at the surface of the second layer; and d) forming of memory cells based on a phase-change material on the islands of the first layer.

Abstract: Articles such as substrates for semiconductor products comprising metal and resin portions with adhesion promoter material are processed in a plating bath, wherein the adhesion promoter material is exposed to dissolution as a result of prolonged exposure to the plating bath. The articles are processed by dipping them in the processing bath so that they have opposed surfaces exposed to the processing bath. The movement of the articles through the processing bath B may occur to be halted. In that case a gas flow is provided lapping the opposed surfaces of the articles to shield the opposed surfaces of the articles from exposure to the processing bath.

Abstract: The present disclosure is directed to a method for detecting a liquid on a main surface of a body. The method is performed through a detection device including a processing module, a reference electrode at a reference electric voltage and a first sensing electrode on the main surface and configurated to detect an environmental electric and/or electrostatic charge variation indicative of the presence of the liquid. The method includes the steps of: biasing the first sensing electrode to a bias electric voltage; while the first sensing electrode is at the bias electric voltage, acquiring a first charge variation signal indicative of the electric and/or electrostatic charge variation detected by the first sensing electrode; verifying whether the first charge variation signal is indicative of the presence of the liquid on the main surface, at the first sensing electrode; and, if it is, determining the presence of the liquid on the main surface at the first sensing electrode.

Abstract: A device includes a first pixel, based on quantum dots, configured to deliver event-based data for generating an event-based image, and second pixels, each second pixel based on quantum dots, configured to deliver light intensity data for generating a light intensity image.

Abstract: The present disclosure is directed to at least one semiconductor package including a die within an encapsulant having a first sidewall, an adhesive layer on the encapsulant and having a second sidewall coplanar with the first sidewall of the encapsulant, and an insulating layer on the adhesive layer having a third sidewall coplanar with the first sidewall and the second sidewall. A method of manufacturing the at least one semiconductor package includes forming an insulating layer on a temporary adhesion layer of a carrier, forming an adhesive layer on the insulating layer, and forming a plurality of openings through the adhesive layer and the insulating layer. The plurality of openings through the adhesive layer and the insulating layer may be formed by exposing the adhesive layer and the insulating layer to a laser.

Abstract: Disclosed herein is a DC-DC converter including a power section and a bootstrap circuit for driving the gate of the high-side transistor of the power section. The bootstrap circuit includes an adaptive clamp circuit that maintains a proper voltage differential across the bootstrap capacitor within the bootstrap circuit for recharge during off-times regardless of whether the mode of operation of the DC-DC converter continuous conduction mode (CCM), discontinuous conduction mode (DCM), or pulse-skip mode. This voltage differential is established as being between a bootstrap voltage and a voltage at a tap between the high and low side transistors of the power section. The adaptive clamp circuit maintains the bootstrap voltage as following the lesser of the output voltage and the voltage at the tap.

Abstract: A semiconductor die is arranged on a first surface of a leadframe having a first thickness between the first surface and a second surface opposite the first surface and an array of electrically conductive leads. Terminal recesses are provided in the electrically conductive leads in the array at the first surface. At the terminal recesses, the electrically conductive leads have a second thickness less than the first thickness. The semiconductor die is coupled with the electrically conductive leads via wires or ribbons having ends coupled to the electrically conductive leads arranged in the terminal recesses. The leadframe is partially cut starting from the second surface at the terminal recesses with a cutting depth between the first thickness and the second thickness. The partial cut produces exposed surfaces of the electrically conductive leads and the ends of the electrically conductive elongated formations providing wettable flanks for solder material.

Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.