Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Abstract: A microelectromechanical system (MEMS) structure includes at least first and second metal vias. Each of the first and second metal vias includes a respective planar metal layer having a first thickness and a respective post formed from the planar metal layer. The post has a sidewall, and the sidewall has a second thickness greater than 14% of the first thickness.

Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

Abstract: Techniques for context-adaptive binary arithmetic coding (CABAC) coding with a reduced number of context coded and/or bypass coded bins are provided. Rather than using only truncated unary binarization for the syntax element representing the delta quantization parameter and context coding all of the resulting bins as in the prior art, a different binarization is used and only part of the resulting bins are context coded, thus reducing the worst case number of context coded bins for this syntax element. Further, binarization techniques for the syntax element representing the remaining actual value of a transform coefficient are provided that restrict the maximum codeword length of this syntax element to 32 bits or less, thus reducing the number of bypass coded bins for this syntax element over the prior art.

Abstract: A packaged semiconductor device includes a molded interconnect substrate having a signal layer including a first channel and a second channel on a dielectric layer with vias, and a bottom metal layer for providing a ground return path. The signal layer includes contact pads, traces of the first and second channel include narrowed trace regions, and the bottom metal layer includes a patterned layer including ground cut regions. DC blocking capacitors are in series within the traces of the first and second channel for providing AC coupling that have one plate over one of the ground cuts. An integrated circuit (IC) includes a first and a second differential input channel coupled to receive an output from the DC blocking capacitors, with a bump array thereon flip chip mounted to the contact pads to provide first and second differential output signals.

Abstract: Methods and apparatus for parsing friendly and error resilient merge flag coding in video coding are provided. In some methods, in contrast to merging candidate list size dependent coding of the merge flag in the prior art, a merge flag is always encoded in the encoded bit stream for each inter-predicted prediction unit (PU) that is not encoded using skip mode. In some methods, in contrast to the prior art that allowed the merging candidate list to be empty, one or more zero motion vector merging candidates formatted according to the prediction type of the slice containing a PU are added to the merging candidate list if needed to ensure that the list is not empty and/or to ensure that the list contains a maximum number of merging candidates.

Abstract: An analog-to-digital converter (ADC) includes: a set of comparators configured to provide comparison results based on an analog signal and respective reference thresholds for comparators of the set of comparators; digitization circuitry configured to provide a digital output code based on the comparison results and a mapping; and calibration circuitry. The calibration circuitry is configured to: receive the comparison results; determine if the analog signal is proximate to one of the respective reference thresholds based on the comparison results; in response to determining the analog signal is proximate to one of the respective reference thresholds, receive ADC values based on different pseudorandom binary sequence (PRBS) values being applied to the analog signal; determine an offset error based on the ADC values; and provide a comparator input offset calibration signal at a calibration circuitry output if the estimated offset error is greater than an offset error threshold.

Abstract: Disclosed embodiments include an integrated circuit (IC) comprising a silicon wafer, first and second conductive lines on the silicon wafer. There are first, second and third insulation blocks with portions on the first and second conductive lines and the silicon wafer, a metal pillar on the surface of the first conductive line opposite the silicon wafer, and a conductive adhesive block on the surface of the second conductive line opposite the silicon wafer. The IC also has a lead frame having first and second leads, and a capacitor having first and second capacitor terminals in which the first capacitor terminal is connected to the second lead using conductive adhesive, the second capacitor terminal is connected to the second conductive line through the conductive adhesive block, and the first lead is coupled to the first conductive line.

Abstract: A system includes a display subsystem. The display subsystem includes a shared buffer having allocated portions, each allocated to one of a plurality of display threads, each display thread associated with a display peripheral. The display subsystem also includes a direct memory access (DMA) engine configured to receive a request from a main processor to deallocate an amount of space from a first allocated portion associated with a first display thread. In response to receiving the request, the DMA engine deallocates the amount of space from the first allocated portion and shifts the allocated portions of at least some of other display threads to maintain contiguity of the allocated portions and concatenate free space at an end of the shared buffer.

Abstract: Trimming components within an oscillator comprising: a trim-capable current source, wherein the trim-capable current source comprises a trimmable resistor and a trimmable current component, a comparator comprising a first input terminal that couples to the trim-capable current source and the second input terminal that couples to a reference voltage source, a switch coupled to the first input terminal and the trim-capable current source, and a trim-capable capacitor coupled to the switch, wherein the switch is coupled between the trim-capable capacitor and the trim-capable current source.

Abstract: A method of de-mosaicing pixel data from an image processor includes generating a pixel block that includes a plurality of image pixels. The method also includes determining a first image gradient between a first set of pixels of the pixel block and a second image gradient between a second set of pixels of the pixel block. The method also includes determining a first adaptive threshold value based on intensity of a third set of pixels of the pixel block. The pixels of the third set of pixels are adjacent to one another. The method also includes filtering the pixel block in a vertical, horizontal, or neutral direction based on the first and second image gradients and the first adaptive threshold value utilizing a plurality of FIR filters to generate a plurality of component images.

Abstract: In an example, a scan flip-flop includes a first transistor and a second transistor coupled to a data input. The scan flip-flop includes a third transistor coupled to a clock input and a fourth transistor coupled to an inverse clock input. The scan flip-flop includes a fifth transistor coupled to a scan enable input and the first transistor, and includes a sixth transistor coupled to an inverse scan enable input and the second transistor. The scan flip-flop includes an input multiplexer that includes a seventh transistor and eighth transistor coupled to the scan data input, a ninth transistor coupled to the scan enable input, and a tenth transistor coupled to the inverse scan enable input. The input multiplexer includes a first diode-connected transistor coupled between a first voltage rail and the seventh transistor, and includes a second diode-connected transistor coupled between a second voltage rail and the eighth transistor.

Abstract: A controller for a voltage converter, such as a buck converter, includes: a switching regulator circuit having high side and low side switches; comparators configured to compare a voltage of an output circuit to reference voltages; and a control circuit coupled to the current comparators, configured to receive outputs from the comparators, and configured to generate a control signal for alternatingly switching the high side and low side switches off and on, such that the low side switch is off when the high side switch is on, and the high side switch is off when the low side switch is on, and wherein the control circuit includes a latching circuit configured to latch a signal corresponding to at least one of the outputs from the comparators. A method of operating a buck converter in connection with a fixed high-frequency automotive radar system, with reliable over-current detection, is also disclosed.

Abstract: A radar transceiver includes a receiver. The receiver includes a low noise amplifier a mixer, a baseband filter, an integrator, and a phase shifter. The mixer includes an input coupled to an output of the low noise amplifier. The baseband filter includes an input coupled to an output of the mixer. The integrator includes an input coupled to an output of the baseband filter. The phase shifter includes a control input and an output. The control input is coupled to an output of the integrator.

Abstract: A method for controlling a stepper motor includes calculating a duty cycle of a current provided to the stepper motor and comparing a difference, between the calculated duty cycle and a base duty cycle of current provided to the stepper motor under a base load condition, to a reference duty cycle value. The method also includes adjusting a peak current level of the current provided to the stepper motor responsive to the comparison.

Abstract: The invention relates to an apparatus and method for tracking energy consumption. An energy tracking system comprises at least one switching element, at least one inductor and a control block to keep the output voltage at a pre-selected level. The switching elements are configured to apply the source of energy to the inductors. The control block compares the output voltage of the energy tracking system to a reference value and controls the switching of the switched elements in order to transfer energy for the primary voltage into a secondary voltage at the output of the energy tracking system. The electronic device further comprises an ON-time and OFF-time generator and an accumulator wherein the control block is coupled to receive a signal from the ON-time and OFF-time generator and generates switching signals for the at least one switching element in the form of ON-time pulses with a constant width ON-time.

Abstract: A device includes a current mirror, a switch, first and second current paths, first and second buffers, a variable resistor, a temperature-sensing circuit, and a controller. The first current path is coupled between the current mirror's input and the switch. The switch switches between ground and a transistor based on a control signal. The second current path is coupled between a first current mirror output and ground. The first buffer is coupled to a second current mirror output. The second buffer is coupled to the variable resistor, which is coupled to the first buffer. The temperature-sensing circuit provides a device temperature to the controller, which is coupled to a first buffer output and determines a first adjustment to the first and second current paths and a second adjustment to the variable resistor based on the device temperature.

Abstract: An integrated circuit is presented. The integrated circuit has a set of sensor input interfaces and an output interface. The integrated circuit further has a memory with a first and second memory locations. The integrated circuit further has a multi-chip hub module which has a transaction buffer with both a real-time and a non-real-time buffer. The multi-chip hub module has a context mapper, a re-formatter module and an error handling module. The context mapper is configured to map data to the first or second memory location. The multi-chip hub module is configured to process data through the modules and provide processed data to the output interface.

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

Abstract: A system and method for controlling clock generation. A system includes a processor configured to execute instructions retrieved from memory, and a clock generation system coupled to the processor. The clock generation system is configured to generate a clock signal that the processor applies to execute the instructions. The clock generation system includes a plurality of configuration registers and selection circuitry. Each of the configuration registers includes fields that control a frequency of the clock signal. The selection circuitry selects which of the plurality of configuration registers determines the frequency at a given time.