Abstract: A chemically amplified photosensitive composition used for forming a patterned resist film by photolithography on a metal surface of a substrate which at least partly has a surface consisting of metal. The composition includes an acid generator which generates an acid by irradiation of active rays or radioactive rays; and a compound and/or a precursor compound, in which the molar absorption coefficient ? at a wavelength of 365 nm of the compound is at least 3000, the compound has a metal coordination group, and the compound can be formed from the precursor compound during formation of the patterned resist film.

Abstract: A resin composition for forming a phase-separated structure includes a block copolymer having a block (b1) formed of a repeating structure of styrene units, the block (b1) being partially substituted with a constituent unit represented by the following General Formula (c1) and a block (b2) having a repeating structure of methyl methacrylate units.

Abstract: An alternating copolymer including a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a0-2) represented by general formula (a0-2) in which Rp01 represents a hydrogen atom or the like; Vp01 represents a single bond or a divalent linking group; Rp02 and Rp03 each independently represents a hydrocarbon group which may have a substituent, or Rp02 and Rp03 are mutually bonded to form a ring; Rp04 represents a hydrogen atom, a C1-C5 alkyl group or a C1-C5 halogenated alkyl group; Rp05 represents an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a cyano group or a hydroxy group; Rp06 represents a linear or branched aliphatic hydrocarbon group; and m represents an integer of 0 to 4

Abstract: A semiconductor processing liquid including hydrofluoric acid, and an organic solvent, in which the organic solvent contains a compound represented by the formula below in which X1 is a single bond or an alkylene group having 1 to 6 carbon atoms, in which an ether bond may be interposed, Y10 is one of —O—, —(C?O)—, —O—(C?O)—, and —(C?O)—O—, Y20 is one of —(C?O)—, —O—(C?O)—, and —(C?O)—O—, and Y11 and Y21 are each independently a single bond or an alkylene group having 1 to 6 carbon atoms in which an ether bond may be interposed, provided that, X1, Y11, and Y21 do not contain hydroxyl groups in structures thereof, and when X1 is a single bond, Y10 is not —O—) H3C—Y11—Y10—X1—Y20—Y21—CH3??(1).

Abstract: A method for forming a coating that is less uneven and more uniform, and has good stability after being formed, by applying a coating-forming composition including a metal compound and/or a halogen-containing compound. The coating is formed by a method including forming a coating by applying a coating-forming composition onto a substrate. The coating-forming composition is a solution including a metal compound and/or a halogen-containing compound, and an amine compound. The metal compound includes one or more metal elements selected from period 2 elements to period 6 elements in the periodic table.

Abstract: A resist composition that generates an acid upon exposure and whose solubility in a developing solution is changed by action of an acid.

Abstract: A method of forming a resist pattern, including forming a resist composition using a resist film; exposing the resist film; and alkali-developing the exposed resist film to form a positive-tone resist pattern, wherein the resist composition includes a first resin component and a second resin component which satisfies a specific relationship DRMIX<DRP1 and DRMIX<DRP2, wherein DRP1 is the dissolution rate of the first resin component (P1) in an alkali developing solution, DRP2 is the dissolution rate of the second resin component (P2) in an alkali developing solution, and DRMIX is the dissolution rate of a mixed resin of the first resin component (P1) and the second resin component (P2).

Abstract: A resist composition containing a resin component (A1) having a constitutional unit derived from a compound represented by General Formula (a01-1).

Abstract: A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like

Abstract: A resist composition including a base component and a fluorine additive component (F), the component (F) including a copolymer having a structural unit (f1) represented by general formula (f1-1) or (f1-2), and a structural unit (f2) represented by general formula (f2-1) (in formula (f1-1) and (f2-1), R represents a hydrogen atom or the like; at least one of Raf11 and Raf12, and at least one of Raf13 and Raf14 represents a hydrocarbon group substituted with a fluorine atom, and the total number of carbon atoms is 3 or more, provided that a hydrocarbon group forming a bridge structure is excluded; and the structural unit (f2) has a specific acid dissociable group containing an aliphatic cyclic group having no bridge structure

Abstract: Organically modified metal oxide nanoparticles containing two or more cores including a plurality of metal atoms and a plurality of oxygen atoms covalently bonded to the plurality of metal atoms; a first modifying group that is a ligand coordinated to each of the cores and selected from the group consisting of a carboxylic acid carboxylate, a sulfonic acid sulfonate, and a phosphonic acid phosphonate; and a second modifying group that is coordinated to each of the cores and is a ligand having a structure different from that of the first modifying group and/or an inorganic anion, in which organically modified metal oxide nanoparticles have a structure in which the cores are crosslinked through a coordinate bond by at least the first modifying group.

Abstract: Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.

Abstract: A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure.

Abstract: To provide a method for producing a porous film in which even when minute fine particles are used, fine particles can be satisfactorily dispersed, a method for producing a composition for producing a porous film, and a porous film that can be produced by the method for producing a porous film. When a porous film is formed using a varnish including at least one resin component selected from the group consisting of polyamide acid, polyimide, a polyamide-imide precursor, polyamide-imide and polyethersulfone, and fine particles, varnish is produced by dispersing the fine particles by using a pressure device that pressurizes slurry including the fine particles and a dispersing device provided with a flow path whose cross-sectional area is 1960 ?m2 or more and 785000 ?m2 or less, and allowing the slurry pressurized to 50 MPa or more to pass through the flow path.

Abstract: A resist composition including: a compound including an anion moiety and a cation moiety and represented by the following Formula (bd1); and an organic solvent having a hydroxyl group in which Rx1 to Rx4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Ry1 and Ry2 each independently represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Rz1 to Rz4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; at least one of Rx1 to Rx4, Ry1 and Ry2 and Rz1 to Rz4 has an anionic group; and Mm+ represents an organic cation)

Abstract: A resist composition including: a base material component (A), a compound (B1) represented by Formula (b1-1), and a fluorine additive component (F) which contains a fluororesin component (F1) having a constitutional unit (f1) represented by Formula (f-1) and a constitutional unit (f2) represented by Formula (f-2); in Formula (b1-1), Vb01 represents a fluorinated alkylene group, Rb02 represents a fluorine atom or a hydrogen atom, a total number of fluorine atoms as Vb01 and Rb02 is 2 or 3; in Formula (f-1), Rf1 represents a monovalent organic group having a fluorine atom; in Formula (f-2), Rf2 represents a group represented by Formula (f2-r-1), which is a group containing a polycyclic aliphatic cyclic group.

Abstract: A resist composition including a compound represented by formula (bd1), a total amount of the acid-generator component and the basic component being 20 to 70 parts by weight, relative to 100 parts by weight of the base material component. In the formula, Rx1 to Rx4 represents a hydrogen atom or a hydrocarbon group, or two or more of Rx1 to Rx4 may be mutually bonded to form a ring structure; Ry1 and Ry2 represents a hydrogen atom or a hydrocarbon group, or Ry1 and Ry2 may be mutually bonded to form a ring structure; Rz1 to Rz4 represents a hydrogen atom or a hydrocarbon group, or two or more of Rz1 to Rz4 may be mutually bonded to form a ring structure; provided that at least one of Rx1 to Rx4, Ry1, Ry2 and Rz1 to Rz4 has an anionic group; and Mm+ represents an m-valent organic cation).

Abstract: A resist composition including a compound (D0) represented by general formula (d0) and a polymeric compound (A10) having a structural unit (a0) derived from a compound represented by general formula (a0-1) shown below (in formula (d0), n represents an integer of 2 or more; in formula (a0-1), W1 represents a polymerizable group-containing group; Ct represents a tertiary carbon atom, and the ?-position of Ct is a carbon atom which constitutes a carbon-carbon unsaturated bond; R11 represents an aromatic hydrocarbon group which may have a substituent, or a chain hydrocarbon group; R12 and R13 each independently represents a chain hydrocarbon group, or R12 and R13 are mutually bonded to form a cyclic group

Abstract: A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a01-1) and a constitutional unit derived from a compound represented by General Formula (a02-1), and an acid generator component composed of an anion moiety and a cation moiety. In General Formula (a01-1), W1 represents a polymerizable group-containing group, Ct represents a tertiary carbon atom, R11 represents an unsaturated hydrocarbon group which may have a substituent, R12 and R13 represent a chain saturated hydrocarbon group which may have a substituent, and a carbon atom at an ?-position of Ct constitutes a carbon-carbon unsaturated bond.