Abstract: A chemically amplified photosensitive composition which forms a resist pattern whose cross-sectional shape is rectangular, and which has a wide depth of focus margin; a photosensitive dry film having a photosensitive layer made from the composition; a method of manufacturing a patterned-resist film using the composition; a method of manufacturing a substrate with a template using the composition; a method of manufacturing a plated article using the substrate with a template; and a novel compound. An acid diffusion suppressing agent having a specific structure is blended into the composition including an acid generator which generates acid upon exposure to an irradiated active ray or radiation.

Abstract: A resin composition for forming a phase-separated structure containing a block copolymer having a first block and a second block, in which the first block is formed of a constituent unit represented by Formula (b1), the second block is formed of a constituent unit represented by Formula (b2m) and a random copolymer having a constituent unit represented by Formula (b2g), and a ratio of a volume of the first block is 20% to 80% by volume.

Abstract: Provided are a curable composition that provides a cured film excellent in antifogging properties, an antifogging coating agent containing the composition, and a cured film formed from a cured product of the composition. A curable composition according to an embodiment of the invention contains a (meth)acrylate compound (A), and a surfactant (B), wherein the component (A) contains a (meth)acrylate compound (A1) having an HLB value of 15.2 or more, and the content of the component (B) with respect to 100 parts by mass of the component (A) is 0.1 parts by mass or more and 20 parts by mass or less.

Abstract: A composition for forming a phase-separated structure contains a block copolymer having a block (b1) consisting of a repeating structure of a styrene unit and a block (b2) consisting of a repeating structure of a methyl methacrylate unit, in which the block (b2) is disposed at least at one terminal portion of the block copolymer, the block copolymer has a structure (e1) represented by General Formula (e1) at least at one main chain terminal, and the structure (e1) is bonded to the main chain terminal of the block (b2) disposed at a terminal portion of the block copolymer. Ree0 represents a hydrocarbon group containing a hetero atom, and Re1 represents a hydrogen atom or a halogen atom.

Abstract: A resist composition containing a base material component of which solubility in a developing solution is changed due to an action of an acid and a compound represented by Formula (bd1); in the formula, Rbd1 to Rbd3 each independently represent an aryl group which may have a substituent, provided that one or more of Rbd1 to Rbd3 are aryl groups having a fluorinated alkyl group which may have a substituent, and at least one of the fluorinated alkyl groups which may have a substituent in these aryl groups is bonded to a carbon atom adjacent to a carbon atom that is bonded to a sulfur atom in the formula, and a total number of the fluorinated alkyl groups which may have a substituent is 2 or more; X? represents a counter anion.

Abstract: A cell screening device having a bottom plate part; a cell placement membrane provided on the bottom plate part and forming a cell placement surface; a pair of fluid injection parts provided on the bottom plate part and partitioned from the cell placement membrane; and a flow channel provided between the bottom plate part and the cell placement membrane and having flow channel end portions extending to the fluid injection parts. On the cell placement surface of the cell placement membrane are formed a plurality of wells having a size that enables the wells to individually accommodate cells to be screened, and through holes extending from the inner bottom surfaces of the wells and communicating with the flow channel.

Abstract: An information processing system includes a storage unit configured to store correspondence information in which material information indicating a material of a composition and a process condition in a process using the composition are associated with performance information of a composition obtained by the process, a performance estimation unit configured to acquire the performance information on the basis of the input material information and processing condition, and the correspondence information, and an output unit configured to output the performance information.

Abstract: A cleaning composition which can remove a layer of interest using a conventional apparatus, such as a coater, a baking furnace and a cleaning chamber, installed in semiconductor manufacturing equipment while preventing the damage or deformation of layers other than the layer of interest, such as a substrate and an interlayer insulation film; a cleaning method using the cleaning composition; and a method for producing a semiconductor employing the cleaning method. A layer of interest formed on a substrate is cleaned with a cleaning composition containing a component capable of decomposing the layer of interest and a film-forming polymer. An example of the layer of interest is a hard mask film. An example of the component is at least one of a basic compound and an acidic compound.

Abstract: To provide a method for producing surface-modified metal oxide fine particles, which can produce surface-modified metal oxide fine particles having excellent dispersion stability in dispersion liquids having various compositions; a method for producing improved metal oxide fine particles, suitable as a method for producing metal oxide fine particles to be surface-modified in production of the surface-modified metal oxide fine particles; surface-modified metal oxide fine particles which can be produced by the method for producing surface-modified metal oxide fine particles; and a metal oxide fine particle dispersion liquid including the surface-modified metal oxide fine particles. Surface-modified metal oxide fine particles are produced by a method including coating at least a part of surfaces of metal oxide fine particles with a carboxylic acid compound having a certain structure substituted with an amino group which may be cyclic, and/or carboxylate thereof.

Abstract: A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.

Abstract: A protective film forming agent for dicing of semiconductor wafers for forming a protective film on the surface of the semiconductor wafers and capable of forming a protective film of high absorbance index, and a production method of semiconductor chips using the protective film forming agent. In a protective film forming agent containing a water-soluble resin, light absorber and solvent, a compound having a specific structure is used as the light absorber. The content of the light absorber in the protective film forming agent is 0.1% by mass or more and 10% by mass or less.

Abstract: There is provided a production method for a resist composition purified product, which includes a step (i) of filtering a resist composition with a filter having a porous structure in which adjacent spherical cells are connected to each other. The filter includes a porous membrane containing at least one resin selected from the group consisting of polyimide and polyamide imide. The resist composition contains a base material component (A) that exhibits changed solubility in a developing solution under action of acid, an onium salt, and an organic solvent component (S), where the content of the organic solvent component (S) is 97% by mass or more.

Abstract: A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an acid generator, a resin, and a sulfur-containing compound including a sulfur-containing compound and a thiol compound that is different from the sulfur-containing compound.

Abstract: A resist composition including a resin component whose solubility in a developing solution is changed due to the action of the acid, in which the resin component has a constitutional unit derived from a compound represented by Formula (a0-1) and a constitutional unit containing an acid decomposable group whose polarity is increased due to the action of the acid. In the formula, W represents a polymerizable group-containing group, Ya0 represents a carbon atom, Xa0 represents a group that forms a monocyclic aliphatic hydrocarbon group together with Ya0, some or all hydrogen atoms in the monocyclic aliphatic hydrocarbon group may be substituted with substituents, and Ra00 represents an aromatic hydrocarbon group which may have a substituent.

Abstract: A resist stripping process liquid including a basic compound containing a nitrogen atom, an organic solvent, and water, the organic solvent including a cyclic amide compound, and the cyclic amide compound including 0.5% by mass or more of a compound represented by the following formula (1), based on the total amount of the process liquid. In formula (1), n represents an integer of 1 to 5, and R represents a C2-C10 organic group.

Abstract: A particle capture device includes first and second substrates. The first substrate has recessed portions that have a size capable of capturing one particle. Each recessed portion has connection holes that have a size capable of allowing a dispersion medium of particles to move therethrough. A flow path that has the connection holes as an inlet port and an end portion of a first side of the first substrate as an outlet port is defined between the first substrate and the second substrate. A total opening area of the connection holes is 1 mm2 or more and less than 10 mm2, and a cross-sectional area of the flow path at the outlet port is 0.8 times or more the total opening area; or the total opening area is 10 mm2 or more and 1000 mm2 or less, and the cross-sectional area is 0.1 times or more the total opening area.

Abstract: Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.

Abstract: A silicon-containing polymer which results in a composition that forms a coated film having good adhesive properties to a substrate and does not easily peel off the substrate, a film-forming composition including the polymer, a method for forming a silicon-containing polymer coating using the composition, a method for forming a silica-based coating using the composition, and a production method for the polymer. In a silicon-containing polymer including at least one of poly- or oligo-siloxane chain and poly- or oligo-silane chain in a molecular chain, a group having a silyl group and a sulfide group, which can be subjected to a condensation reaction, is introduced into the molecular chain, for example, by an ene-thiol reaction.

Abstract: A resist composition including a polymeric compound having a structural unit in which a compound represented by formula (a0-1) has a polymerizable group within the W1 portion converted into a main chain, and a compound represented by formula (b1-1) in which W1 represents a polymerizable group-containing group; Ct represents a tertiary carbon atom, and the ?-position of Ct is a carbon atom which constitutes a carbon-carbon unsaturated bond; R11 represents an aromatic hydrocarbon group or a chain hydrocarbon group; R12 and R13 are mutually bonded to form a 5-membered aliphatic monocyclic group, or a condensed polycyclic hydrocarbon group containing a 5-membered aliphatic monocyclic ring; Rb11 represents a cyclic group; Rb10, Rb20 and Rb30 each independently represents a substituent; nb1 represents an integer of 0 to 4; nb2 represents an integer of 0 to 5; nb3 represents an integer of 0 to 5; and X? represents a counteranion.