Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including a polymer compound (A1) which has a constitutional unit (a0) derived from a compound represented by Formula (a0-1) and a constitutional unit (a10) derived from a compound represented by Formula (a10-1) and does not have a constitutional unit represented by Formula (1). In the formulas, Rax0 and Rax1 represent a polymerizable group-containing group; Wax0 and Wax1 represent an (nax0+1)-valent or (nax1+1)-valent aromatic hydrocarbon group; nax0 and nax1 represent an integer of 1 to 3; and Z2 represents Fe, Co, Ni, Cr, or Ru.

Abstract: A surface treatment liquid capable of hydrophobizing a surface of a treatment target without including a silylation agent, a surface treatment method using the liquid, and a method for suppressing pattern collapse, including surface treatment by the surface treatment method. The liquid contains a nitrogen-containing heterocyclic compound as a water-repelling agent. A compound including one or more hydrocarbon groups which may be substituted with a halogen atom in which a total number of carbon atoms of the one or more hydrocarbon group is three or more, is used as the nitrogen-containing heterocyclic compound. The liquid may include only a nitrogen-containing heterocyclic compound having the above-described predetermined structure, as a water-repelling agent.

Abstract: A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

Abstract: Provided is a deep ultraviolet LED with a design wavelength ?, including a reflecting electrode layer, an ultra-thin metal layer, and a p-type contact layer that are arranged in this order from a side opposite to a substrate; and a hemispherical lens bonded to a rear surface of the substrate on a side of the p-type contact layer, the hemispherical lens being transparent to light with the wavelength ?. The refractive index of the hemispherical lens is greater than or equal to the average value of the refractive index of the substrate and the refractive index of air and is less than or equal to the refractive index of the substrate. The hemispherical lens has a radius that is greater than or equal to the radius of an inscribed circle of the substrate and is about equal to the radius of a circumscribed circle of the substrate.

Abstract: A block copolymer including a first block and a second block, the first block consisting of a polymer (P1) having a repeating structure of a structural unit (u1) containing in a side chain thereof a hyperbranched structure containing a silicon atom.

Abstract: A surface treatment method for a substrate surface; a surface treatment agent used for the surface treatment method; and a method for forming a film on a substrate in a region-selective manner. The method includes exposing the surface to a surface treatment agent including a silylation agent and a nitrogen-containing heterocyclic compound, the surface including two or more regions, adjacent regions in the two or more regions having different materials, and a reaction between the silylation agent and the two or more regions causing contact angles of water to differ from each other with respect to adjacent regions in the two or more regions.

Abstract: To provide a surface treatment method for hydrophilizing a surface of a treatment target and preventing charging by a simple and easy method and an anti-static agent. The present invention provides a surface treatment method. The method comprises an anti-static treatment step of coating a treatment target with an anti-static agent comprising an electrolyte (e1), a hydrophilic polymer (a) and water, and having electrical conductivity of 15 mS/m or more to obtain a coated film (A), drying the coated film (A) to obtain an anti-static layer, and a hydrophilizing treatment step of coating the anti-static layer with a hydrophilizing treatment agent comprising a hydrophilic polymer (b) and an alcohol to obtain a coated film (B), and drying the coated film (B), followed by rinsing thereof.

Abstract: A method for producing a chip for cell culture that enables production of a microchannel structure, enables mass production at low cost, and also has functions suited to cell culture. The method includes forming a photosensitive adhesive layer by applying a photosensitive adhesive to a first substrate having transparency, thus obtaining a 3D printing substrate, 3D printing steps that employ vat photopolymerization, forming a first adhesive layer by depositing a first adhesive on a second substrate having transparency, thus obtaining a cell culture channel top plate, and bonding the cell culture channel and the cell culture channel top plate together via the first adhesive layer, and then performing thermocompression bonding to obtain a microchannel structural body having a hollow structure, wherein the first adhesive is a polyester-based resin having a Tg value of 5° C. or higher.

Abstract: Provided is a separator which can make the electric field on the surface of a negative electrode for a metal secondary battery homogeneous to thereby prevent the formation of dendrites. A porous separator for metal secondary batteries, which has a polymer electrolyte layer formed on the surface layer of at least one main surface of a porous polyimide film. It is preferred that the polymer electrolyte layer is composed of both a polymer electrolyte material which is supported on at least one main surface of the porous polyimide film and a polymer electrolyte material which is supported in voids in a layered region that extends from the main surface.

Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1), a constitutional unit (a02) represented by Formula (a0-2), and a constitutional unit (a03) which is represented by Formula (a0-3) and has a structure different from the constitutional unit (a02).

Abstract: A cleaning solution that is used, inter alia, for removal of residue of a photoresist pattern or etching residue, and has exceptional anticorrosion properties with respect to silicon nitride; and a method for cleaning a substrate using the cleaning solution. In a cleaning solution containing a hydrofluoric acid and a solvent, a polymer that includes units derived from a compound of a specific structure having a carboxylic acid amide bond (—CO—N<) and an unsaturated double bond is blended as an anticorrosive agent. Polyvinylpyrrolidone is preferred as the polymer used as the anticorrosive agent.

Abstract: A resist composition including a resin component having a structural unit derived from a compound represented by formula (a0-1), in which W represents a polymerizable group-containing group; Ra01 represents an alkyl group or an aromatic heterocyclic group containing an oxygen atom or a sulfur atom; in the case where Ra01 is an aromatic heterocyclic group containing an oxygen atom or a sulfur atom, Ra02 is a group which forms an aliphatic cyclic group containing an electron-withdrawing group, together with the tertiary carbon atom (*C) to which Ra01 is bonded; and when Ra01 is an alkyl group, Ra02 is a group in which an aliphatic cyclic group containing an electron-withdrawing group forms a condensed ring together with an aromatic heterocyclic group containing an oxygen atom or a sulfur atom.

Abstract: A chemically amplified positive-type photosensitive resin composition capable of suppressing occurrence of footing in which the width of the bottom becomes narrower than that of the top in a nonresist section, denaturation of the surface of the metal substrate, and occurrence of a development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of the substrate having the metal surface by using the composition; a method for manufacturing a substrate with a template by using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the chemically resin composition which includes an acid generator, and a resin whose solubility in alkali increases under the action of acid.

Abstract: A composition for forming a separation layer that separates a support base that transmits light from a laminate including the support base, a substrate, the separation layer and an adhesive layer between the support base and the substrate by irradiating the separation layer with light from the support base side and modifying the separation layer. The composition contains a resin component which has a phenol skeleton.

Abstract: To provide a method for manufacturing a polyimide and/or a polyamide imide porous membrane with which it is possible to prepare a varnish in which microparticles are satisfactorily dispersed, even when minute microparticles are used, and to manufacture a porous membrane using the varnish. The method for manufacturing a polyimide and/or a polyamide imide porous membrane comprises a step for preparing a porous membrane manufacturing composition containing microparticles and at least one resin component selected from the group consisting of polyamic acids, polyimides, polyamide imide precursors, polyamide imides, and polyethersulfones, the preparation step including a dispersion step for causing a slurry containing the microparticles to disperse by shear and compression or shock.

Abstract: A resist composition including a polymeric compound having a structural unit represented by formula (a0-1) and an acid generator consisting of a compound represented by general formula (b1-1) in which Ra00 represents an acid dissociable group represented by general formula (a0-r1-1); Ra01, Ra02, Ra031, Ra032 and Ra033 represent a hydrocarbon; Ya0 represents a quaternary carbon atom; R101 represents a hydrocarbon group having at least 1 hydroxy group as a substituent; Y101 represents a single bond or a divalent linking group containing an oxygen atom; and V101 represents a single bond, an alkylene group or a fluorinated alkylene group).

Abstract: A particle capture device includes a first substrate; and a second substrate that is disposed parallel to and facing first side of the first substrate, in which the first substrate has a plurality of recessed portions that are open on the second side of the first substrate and that have a size capable of capturing one particle, the recessed portion has connection holes that connect the first side to the second side and that have a size allowing a dispersion medium of the particles to move therethrough, a flow path that has the connection holes of the first substrate as an inlet port of the dispersion medium and has an end portion of the first side of the first substrate as an outlet port of the dispersion medium is formed between the first substrate and the second substrate, the total opening area of the connection holes is 1 mm2 or more and less than 10 mm2, and a cross-sectional area of the flow path at the outlet port is 0.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including: a base component which exhibits changed solubility in a developing solution under action of acid and a fluorine additive component which exhibits decomposability to an alkali developing solution, the fluorine additive component including a fluorine resist component having a structural unit derived from a compound represented by general formula (f1-1) in which W represents a polymerizable group-containing group; Rf1 and Rf2 each independently represents a hydrogen atom or an electron-withdrawing group; and Rf3 represents a hydrocarbon group

Abstract: A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

Abstract: Provided are a porous film having excellent surface smoothness and a method for producing the same. The surface roughness of a porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide is Ra 30,000 ? or less. The opening diameter of the porous film is preferably from 100 nm to 5000 nm. The method for producing a porous film preferably includes a step for kneading a varnish containing fine particles and at least one resin selected from the group consisting of polyvinylidene fluoride, polyether sulfone, polyamic acid, polyimide, polyamide-imide precursor, and polyamide-imide. The varnish preferably has a viscosity at 25° C. of 0.1-3 Pa·s, a solids fraction concentration of 10-50 mass %, and a fine particle average particle size of 10-5000 nm.