Patents Assigned to TSMC Solar Ltd.
  • Publication number: 20140109958
    Abstract: A method of fabricating a photovoltaic device includes forming an absorber layer for photon absorption over a substrate, forming a buffer layer above the absorber layer, wherein both the absorber layer and the buffer layer are semiconductors, and forming a layer of intrinsic zinc oxide above the buffer layer through a hydrothermal reaction in a solution of a zinc-containing salt and an alkaline chemical.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 24, 2014
    Applicant: TSMC SOLAR LTD.
    Inventors: Shih-Wei CHEN, Wei-Lun XU, Wen-Tsai YEN, Chung-Hsien WU, Wen-Chin LEE
  • Patent number: 8703524
    Abstract: A solar cell includes an absorber layer formed of a CIGAS, copper, indium, gallium, aluminum, and selenium. A method for forming the absorber layer provides for using an indium-aluminum target and depositing an aluminum-indium film as a metal precursor layer using sputter deposition. Additional metal precursor layers such as a CuGa layer are also provided and a thermal processing operation causes the selenization of the metal precursor layers. The thermal processing operation/selenization operation converts the metal precursor layers to an absorber layer. In some embodiments, the absorber layer includes a double graded chalcopyrite-based bandgap.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 22, 2014
    Assignee: TSMC Solar Ltd.
    Inventors: Wen-Tsai Yen, Chung-Hsien Wu, Shih-Wei Chen, Wen-Chin Lee
  • Patent number: 8697478
    Abstract: A removable cover system for protecting solar cells from exposure to moisture during fabrication processes. The cover system includes a cover having a configuration that complements the configuration of a solar cell substrate to be processed in an apparatus where moisture is present. A resiliently deformable seal member attached to the cover is positionable with the cover to engage and seal the top surface of the substrate. In one embodiment, the cover is dimensioned and arranged so that the seal member engages the peripheral angled edges and corners of the substrate for preventing the ingress of moisture beneath the cover. An apparatus for fabricating a solar cell using the cover and associated method are also disclosed.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: April 15, 2014
    Assignee: TSMC Solar Ltd.
    Inventors: Chih-Wei Huang, Keng-Hsin Chi, Chien-Nan Lin, Hua-Tso Wei
  • Publication number: 20140076392
    Abstract: A thin film solar cell and process for forming the same. The solar cell includes a bottom electrode layer, semiconductor light absorbing layer, and a TCO top electrode layer. In one embodiment, a TCO seed layer is formed between the top electrode and absorber layers to improve adhesion of the top electrode layer to the absorber layer. In one embodiment, the seed layer is formed at a lower temperature than the TCO top electrode layer and has a different microstructure.
    Type: Application
    Filed: September 18, 2012
    Publication date: March 20, 2014
    Applicant: TSMC SOLAR LTD.
    Inventors: Chih Ching LIN, Yong-Ping CHAN, Wei-Chun HSU, Chen-Yun WANG
  • Publication number: 20140065758
    Abstract: A removable cover system for protecting solar cells from exposure to moisture during fabrication processes. The cover system includes a cover having a configuration that complements the configuration of a solar cell substrate to be processed in an apparatus where moisture is present. A resiliently deformable seal member attached to the cover is positionable with the cover to engage and seal the top surface of the substrate. In one embodiment, the cover is dimensioned and arranged so that the seal member engages the peripheral angled edges and corners of the substrate for preventing the ingress of moisture beneath the cover. An apparatus for fabricating a solar cell using the cover and associated method are also disclosed.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 6, 2014
    Applicant: TSMC SOLAR, LTD.
    Inventors: Chih-Wei HUANG, Keng-Hsin CHI, Chien-Nan LIN, Hua-Tso WEI
  • Publication number: 20130269778
    Abstract: A method for manufacturing a CIGS thin film photovoltaic device includes forming a back contact layer on a substrate, forming an Se-rich layer on the back contact layer, forming a precursor layer on the Se-rich layer by depositing copper, gallium and indium resulting in a first interim structure, annealing or selenizing the first interim structure, thereby forming Cu/Se, Ga/Se or CIGS compounds along the interface between the back contact layer and the precursor layer and resulting in a second interim structure, and selenizing the second interim structure, thereby converting the precursor layer into a CIGS absorber layer on the back contact layer.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 17, 2013
    Applicant: TSMC SOLAR LTD.
    Inventors: Hsuan-Sheng YANG, Wen-Chin LEE, Li-Huan ZHU
  • Publication number: 20130231797
    Abstract: A solar string includes first and second solar modules coupled to first and second filters by an electric transmission line. The second solar module includes a solar panel including a plurality of photovoltaic cells configured to convert photon energy to electrical energy. A processor is coupled to the solar panel and is in communication with the first solar module. The processor is configured to monitor an output of the solar panel and to transmit a status signal including an environmental condition of the second solar module to the first solar module by way of the electric transmission line. The first and second filters are configured to pass electrical power to a central inverter of a solar array in which the solar string is disposed and to prevent the status signal transmitted from the second solar module to the first solar module from being transmitted to the central inverter.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 5, 2013
    Applicant: TSMC Solar Ltd.
    Inventors: Szu-Han LI, Chih-Chieh HSIEH, Tong Hong FU
  • Publication number: 20130206201
    Abstract: A solar cell assembly provides a solar cell with a reduced size potting ring that retains the conductive contact strips that extend through the solar cell substrate and are coupled to the solar cell circuitry on the front surface of the solar cell substrate. A reduced volume of potting material is required and the solar cells are advantageously packed, shipped and stored in this configuration. Diode connections and power cable connections are made external the potting box once the solar cell assemblies are received at their installation location.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Applicant: TSMC Solar Ltd.
    Inventors: Szu-Han Li, Tong Hong Fu, Wei-Wen Chen
  • Publication number: 20130210190
    Abstract: A method and apparatus for forming a solar cell. The apparatus includes a housing defining a vacuum chamber and a rotatable substrate apparatus configured to hold a plurality of substrates on a plurality of surfaces wherein each of the plurality of surfaces are disposed facing an interior surface of the vacuum chamber. A first sputtering source is configured to deposit a plurality of absorber layer atoms of a first type over at least a portion of a surface of each one of the plurality of substrates. An evaporation source is disposed in a first subchamber of the vacuum chamber and configured to deposit a plurality of absorber layer atoms of a second type over at least a portion of the surface of each one of the plurality of substrates. A first isolation source is configured to isolate the evaporation source from the first sputtering source.
    Type: Application
    Filed: June 1, 2012
    Publication date: August 15, 2013
    Applicant: TSMC SOLAR, LTD.
    Inventors: Edward TENG, Ying-Chen CHAO, Chih-Jen YANG, Kuo-Jui HSIAO