Abstract: A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

Abstract: A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

Abstract: A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.

Abstract: A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.

Abstract: A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.

Abstract: A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.

Abstract: A dispensing head comprises: a body structure including a first z-axis motor attachment location, a second z-axis motor attachment location, a first linear track and a second linear track; a first z-axis motor attached to the body structure at the first z-axis motor attachment location; a second z-axis motor attached to the body structure at the second z-axis motor attachment location; a first body attached to the first linear track and operably connected to the first z-axis motor such that the first body moves along the first linear track when the first z-axis motor is actuated; a second body attached to the second linear track and operably connected to the second z-axis motor such that the second body moves along the second linear track; a first theta motor operably connected to the first body; and a second theta motor operably connected to the second body.

Abstract: A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.

Abstract: Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.

Abstract: A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.

Abstract: An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from

Abstract: Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.

Abstract: A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.

Abstract: A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.

Abstract: A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.

Abstract: Disclosed is a dispensing head that includes a first spindle configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispensing head. The heater device includes a heat source and an opening configured to receive the first nozzle. The heat source is configured to heat the first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle.

Abstract: A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.

Abstract: An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Abstract: Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.

Abstract: Disclosed herein is a household type sewing machine that includes a transmitter configured to connect to a local device such as a Wi-Fi device, and an image capture device configured to capture a video of a workpiece being sewn by the household type sewing machine. The transmitter is configured to send the video captured by the image capture device to the local device. Further disclosed is a method that includes capturing, by the image capture device, a video of a workpiece being sewn by the household type sewing machine and sending the video captured by the image capture device to a mobile device. A sewing system is further disclosed.