Abstract: Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.

Abstract: An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Abstract: An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Abstract: Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.

Abstract: Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.

Abstract: A vacuum nozzle for a pick and place machine that includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of wood. The tip may also be made of a material that is at least one of polar and porous. Further, a method of picking up and placing a light emitting diode includes providing a pick and place machine having a vacuum nozzle, wherein the vacuum nozzle includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of a material that is at least one of polar and porous. The method includes picking up the light emitting diode and placing the light emitting diode on an electronic assembly.

Abstract: Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus.

Abstract: A pick and place machine is described which uses an imprint left in a layer of fluid by a component that has been dipped in the fluid to guide a placement process. An apparatus for placing a component is disclosed, which includes a surface that receives a layer of fluid, an imprint of a component in the layer of fluid, and a camera that captures an image of the imprint in the fluid. A method of placing a component with a pick and place machine is disclosed which includes dipping a component in a layer of fluid, capturing an image of the layer of fluid, analyzing the image of the layer of fluid, and placing the component based on results of the analysis of the image of the layer of fluid. The image can be used to determine the status of the component or where to place the component.

Abstract: A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.

Abstract: A component placement machine that includes a movable housing that is adapted for movement in an X and a Y axis above a printed circuit board. The housing includes a rotatable frame having at least one pick and place head configured to pick up a component and place the component on the printed circuit board. The housing further includes a fluid application station configured to apply fluid to the component after being picked up by the pick and place head and before being placed on the printed circuit board.

Abstract: A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder bank system separate from the head, wherein the feeder system includes a first feeder bank and a second feeder bank and a positioning system for moving both the entire first feeder bank and the entire second feeder bank in both a horizontal X direction and a perpendicular horizontal Y direction, wherein the feeder bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: A spindle assembly drive system that includes a rack unit, a drive gear, a motor, and a plurality of bearings, such that said rack unit laterally moves in a first axis with little or no movement in or rotation about any other axis.

Abstract: A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.

Abstract: Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus.

Abstract: The present invention features a method whereby each vacuum nozzle in a multi-spindle component placement machine is inspected placement cycle. This process also allows for updating calibration of the nozzle position as well as immediate feedback regarding the condition of the vacuum nozzle. A chipped orifice or otherwise damaged nozzle is detected using a vision system and comparing the currently acquired image of each nozzle with the image of an “ideal” nozzle. Likewise, contamination such as adhesive on the nozzle is detected before that contamination can affect placement accuracy. Because of the nozzle inspection during the placement cycle, there is no slowdown of the placement machine cycle rate.

Abstract: A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder/nozzle bank system, wherein the feeder/bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product. The component placement machine facilitates methodology for product changeover on a production line.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: A structure and associated method to accurately read an encoder tape in an encoder system. The encoder system comprises, a read head, a shoe structure adjacent the read head, and an encoder tape. The encoder tape is adapted to be read by the read head. The shoe structure is adapted to locally support the encoder tape and locally dampen a vibration of the encoder tape as the encoder tape is read by the read head.

Abstract: The present invention features a system to generate vacuum for picking up and holding a component in a component placement machine wherein the arrangement of the elements comprising the system prevents the flow of foreign matter back through the system. One arrangement locates a venturi between a valve and nozzle, thereby minimizing where vacuum exists within the system.