Abstract: The present invention is a laser irradiation apparatus which is capable of selecting a laser light of a wavelength among a plurality of laser lights having different wavelengths according to a purpose of irradiation and irradiating an object to be irradiated with the laser light having the wavelength. The laser irradiation apparatus includes, on an optical path of a mixed light beam of the plurality of laser lights having different wavelengths, a slit having a width corresponding to a diffraction limit of the laser light having the shortest wavelength among the plurality of laser lights having different wavelengths, and an objective lens for focusing a laser light that has passed through the slit on the object to be irradiated.

Abstract: An alignment correction method includes: the step of detecting coordinates of a first observation point 14 and a second observation point 15 set in advance on a substrate to be exposed 1 that is being scanned in a scanning direction A, in order to observe an alignment deviation of the substrate to be exposed 1; the step of computing a correction amount based on a deviation between the detected coordinates and a reference line set in advance according to the first observation point 14 and the second observation point 15; and the step of correcting alignment of a subsequent substrate to be exposed 1 based on the computed correction amount.

Abstract: The present invention employs a plurality of photomasks each having first and second apertures of which widths are set so that adjacent end regions of the adjacent first and second alignment regions overlap with each other with an overlapping dimension approximately equal to a tracking accuracy of an alignment device. The photomasks are arranged alternately in a direction intersecting the scanning direction of the substrate so that the first and the second apertures are arranged at a constant pitch. In this state, two polarized lights, that are different in at least one of polarization direction and incident angle to a substrate, are made to be incident into the first and the second apertures, respectively, to irradiate an alignment film on the substrate with the two lights that have passed through the first and the second apertures, respectively, to form the first and the second alignment regions adjacently to each other.

Abstract: A light-receiving element includes a semiconductor layer with a pn junction part and a pair of electrodes that interpose the pn junction part. Near field light is generated in the vicinity of the pn junction part by applying a forward bias voltage between the pair of electrodes and irradiating the pn junction with light that has a specific wavelength, and an electrode of the irradiated pair of electrodes is configured with a wire grid polarizer that transmits the light that has the specific wavelength.

Abstract: A deposition mask for forming a thin film pattern having a predetermined shape on a substrate by deposition, includes a resin film that transmits visible light and has an opening pattern penetrating through the resin film and having the same shape and dimension as those of the thin film pattern so as to correspond to a preliminarily determined forming region of the thin film pattern on the substrate.

Abstract: A member having an arbitrary shape having a closed curve can be easily subjected to laser processing within a short time. A lens and a laser processing apparatus equipped with the lens are for cutting a material to be cut into a member having an arbitrary shape having a closed curve and include a convex cylindrical lens which is molded to have a closed path so that a line that connects vertices of a cylindrical surface of the convex cylindrical lens has the same form as the arbitrary shape having the closed curve.

Abstract: An exposure apparatus and an optical member wherein impurities can be prevented from infiltrating between microlens arrays and a substrate, and microlenses can be prevented from being scratched by the impurities and by getting abnormally close to the substrate. Microlens arrays in which pluralities of microlenses are formed are arranged above a transparent substrate, and the microlens arrays are bonded and the end surfaces to a mask. Alignment mark supports are bonded to the mask at both sides of the microlens arrays, and alignment marks are formed in the surfaces of the alignment mark supports that face the substrate. The spaces between the alignment mark supports and the substrate are smaller than the spaces between the microlens arrays and the substrate.

Abstract: This alignment device is furnished with an alignment light source for emitting alignment light, and is housed with a camera for example. The alignment light source emits alignment light, doing so, for example, coaxially with respect to the optical axis of light detected by the camera. The alignment light illuminates a substrate and mask, and reflected light is detected by the camera. A microlens array for exposure use is present between a mask alignment mark and a substrate alignment mark, whereby an erect unmagnified image reflected from the substrate alignment mark is formed on the mask. A control device then uses the mask alignment mark and the substrate alignment mark detected by the camera to perform alignment of the substrate and the mask. Alignment of the substrate and the mask can be performed with high accuracy thereby.

Abstract: The present invention relates to a laser processing apparatus for irradiating a printed wiring board 9 with a laser beam L so as to form holes 22 at a plurality of predetermined positions on the printed wiring board 9. The device includes, from upstream on an optical path of the laser beam: a second fly eye lens 6 that achieves the uniform intensity distribution of the laser beam L; a second condenser lens 7 that collimates the laser beam L emitted from the second fly eye lens 6; and a micro lens array 8 positioned in a manner facing the printed wiring board 9 and having a plurality of micro lenses 19 formed in a manner corresponding to the plurality of positions on the printed wiring board 9.

Abstract: A photo-alignment exposure method divides each unit image area of a liquid crystal display into a plurality of divided areas and photo-aligns an alignment material film of each of the divided areas in mutually different directions. The method includes a first exposure process that radiates light at an inclined photo-irradiation angle onto an exposed surface of entire the unit image area; and a second exposure process that radiates light onto one area of the divided areas at an inclined photo-irradiation angle different from the photo-irradiation angle in the first exposure process. In the second exposure process, the light is radiated through a mask pattern corresponding to one area of the divided areas, and transmitted light of the mask pattern is condensed by condensing element and radiated onto the area.

Abstract: An exposure apparatus includes a first mark-forming unit further upstream than an irradiation region for exposure light in a direction of conveyance of a member to be exposed. A mark for meandering detection is detected, and a detection unit detects the mark for meandering detection in a direction intersecting a direction of movement of the member to be exposed. A second mark-forming unit is moved so as to negate an amount of meandering by the member to be exposed, computed on the basis thereof, and an alignment mark is formed rectilinearly in a relative fashion with respect to the member to be exposed. This enables highly accurate, stable exposure whereby, even in a case where the member is supplied continuously, an alignment mark for mask position adjustment can be changed in accordance with the meandering of the member to be exposed and the position of the mask with respect to the member to be exposed can be accurately adjusted.

Abstract: A laser processing apparatus that condenses a laser beam into an annular shape to irradiate the condensing position of the laser beam within a thickness range of a substrate, and shifts the condensing position in such a manner that the center of the condensing position that is annular moves in a circular manner, at a stage of shifting the condensing position in a thickness direction of the substrate and a planar direction of the substrate.

Abstract: Signal transmission crosstalk between substrates is suppressed even when light emitting elements or light receiving elements are densely arranged. Provided is an optical interconnection device 1 in which optical signals are sent and received between a plurality of semiconductor substrates arranged in a laminated manner. A light emitting element 2 or a light receiving element 3 arranged in one semiconductor substrate 10 includes a pn junction part 10pn that uses the semiconductor substrate 10 as a common semiconductor layer, and is formed on one surface side of the semiconductor substrate 10. For a pair of the light emitting element 2 and the light receiving element 3 respectively sending and receiving optical signals between the different semiconductor substrates 10, light emitted by the light emitting element 2 is transmitted through the semiconductor substrate 10 and received by the light receiving element 3.

Abstract: When a visible light image and an image of a long-wavelength region with a near-infrared wavelength or longer are acquired using one imaging sensor, a clear image of the long-wavelength region with the near-infrared wavelength or longer is obtained. In an imaging sensor 1 in an imaging device, a plurality of photoelectric conversion parts 2 (2A, 2B) are formed on one semiconductor substrate 10. The respective photoelectric conversion parts 2A in a group of the plurality of photoelectric conversion parts 2 (2A, 2B) exhibit spectral sensitivity characteristics that peak in a long-wavelength region with a near-infrared wavelength or longer. The plurality of photoelectric conversion parts 2 (2A, 2B) include photoelectric conversion parts 2B exhibiting spectral sensitivity characteristics that peak in a visible light region.

Abstract: A photo-alignment exposure device that includes a first mask and a first exposure device that independently proximity-exposes a first divided area, a second mask and a second exposure device that independently proximity-exposes a second divided area adjacent to the first divided area, and a third mask and a third exposure device that exposes an area on a side of the first divided area near a boundary between the first divided area and the second divided area. The third exposure device is provided with a photo-irradiation angle same as that of the first exposure device or the second exposure device with respect to an exposed surface. A condensing element that condenses the mask transmitted light on the area on a side of the first divided area near the boundary is provided between the mask opening of the third mask and the exposed surface.

Abstract: An exposure method includes a step of moving a photomask by a predetermined distance and switching a first mask pattern group to a second mask pattern group when an exposure to a first exposure area on an object to be exposed by the first mask pattern group of the photomask formed by arranging the first and the second mask pattern groups corresponding to an exposure patterns at predetermined intervals in a conveying direction of the object to be exposed is completed, and a step of performing an exposure on the second exposure area on the object to be exposed by the second mask pattern group, in which a moving speed of the photomask is controlled so that a moving distance of the object to be exposed is longer than a moving distance of the photomask in a period of time when switching the first and the second mask pattern groups.

Abstract: The semiconductor optical integrated circuit has a semiconductor substrate; a pn junction part formed in the semiconductor substrate so as to continuously extend along a signal transmission route, a light emitting part formed on a part of the pn junction part; and an optical waveguide part formed continuous to the light emitting part on the pn junction part. The light emitting part supplies a drive current to the pn junction part to generate an optical signal from the pn junction part, and the optical waveguide part transmits the optical signal while amplifying the optical signal by an amplification current supplied to the pn junction part.

Abstract: An optical interconnection device for transmitting and receiving an optical signal between a plurality of laminated semiconductor substrates. The optical interconnection device has a plurality of light emitting elements or a plurality of light receiving elements that are arranged in one of the semiconductor substrates and have pn junction parts using the semiconductor substrate as a common semiconductor layer. The light emitting element and the light receiving element, which form a pair and which transmit and receive an optical signal between the different semiconductor substrates, emit and receive light at a common wavelength.

Abstract: The deposition mask includes: a thin plate-shaped magnetic metal member 1 in which a through-hole 4 having shape and dimensions greater than those of the thin-film pattern is provided at a position corresponding to the thin-film pattern; and a resin film 2 which is provided in close contact with one surface of the magnetic metal member 1 and in which an opening pattern 5 having shape and dimensions identical to those of the thin-film pattern is formed at a position corresponding to the thin-film pattern in the through-hole 4, the resin film 2 being permeable to visible light. The opening pattern 5 is provided within an opening pattern formation region 7 surrounded by a deposition shadow region 6 defined by the thickness of the magnetic metal member 1 and the maximum angle of incidence of the deposition material to the film surface in the through-hole 4.

Abstract: A deposition mask for forming a thin film pattern having a predetermined shape on a substrate by deposition, includes a resin film that transmits visible light and has an opening pattern penetrating through the resin film and having the same shape and dimension as those of the thin film pattern so as to correspond to a preliminarily determined forming region of the thin film pattern on the substrate.