Intel Patents Granted

Patents granted to Intel by the U.S. Patent and Trademark Office (USPTO).

  • Patent number: 11967129
    Abstract: Apparatuses, methods and storage medium associated with multi-camera devices are disclosed herein. In embodiments, a multi-camera device may include 3 or more camera sensors disposed on a world facing side of the multi-camera device. Further, the multi-camera device may be configured to provide a soft shutter button at a location on an opposite side to the world facing side, coordinated with locations of the 3 or more camera sensors that reduces likelihood of blocking of one or more of the 3 or more camera sensors. Other embodiments may be disclosed or claimed.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Russell S. Love, Peter W. Winer, James Granger, Gerald A. Pham, Ka-Kei Wong, Varun Nasery, Kabeer R. Manchanda, Yu-Tseh Chi, Ali Mehdizadeh
  • Patent number: 11968689
    Abstract: Methods, systems, and storage media are described for monitoring downlink control information (DCI). In particular, some embodiments may be directed to monitoring DCI for an indication of channel occupancy time (COT) information. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Yongjun Kwak, Bishwarup Mondal, Daewon Lee, Hwan-Joon Kwon, Lopamudra Kundu, Hong He
  • Patent number: 11968559
    Abstract: A device to host a service producer in a 5G system (or 5G system architecture), a method to be performed at the device, and a non-transitory storage device storing instructions to be executed at the device. The method includes: decoding a request from a service consumer to manage one or more 5G quality of service (QoS) indicators (5QIs), each 5QI including a 5QI value and corresponding 5QI characteristics; configuring one or more network functions (NFs) of the 5GS with the 5QIs based on the request; and encoding for transmission to the service consumer a message including a result of managing the one or more 5QIs.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 23, 2024
    Assignee: Intel Corporation
    Inventors: Yizhi Yao, Joey Chou
  • Patent number: 11968380
    Abstract: An apparatus for encoding and decoding video receives a request to decode a current video frame. The apparatus determines whether encoding is within a threshold for a previous video frame. Additionally, the apparatus waits for the encoding to start if the encoding is within the threshold. Further, the apparatus provides a signal to begin encoding the current video frame. Also, the apparatus submits a decode workload to a graphics processor unit (GPU) for the current video frame. The apparatus additionally submits, in parallel with submitting the decode workload to the GPU, an encode workload to the GPU for the previous video frame.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: April 23, 2024
    Assignee: INTEL CORPORATION
    Inventors: Jiaping Wu, Kin-Hang Cheung, Bo Zhao
  • Patent number: 11960375
    Abstract: Processor trace systems and methods are described. For example, one embodiment comprises executing instrumented code by a compiler, the instrumented code including at least one call to un-instrumented code. The compiler can determine the at least one call to un-instrumented code is a next call to be executed. A resume tracing instruction can be inserted into the instrumented code prior to the at least one call to the un-instrumented code. The resume tracing instruction can be executed to selectively add processor tracing to the at least one call to the un-instrumented code, and the at least one call to the un-instrumented code can be executed.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Michael Lemay, Beeman Strong
  • Patent number: 11963335
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Jerrod Peterson, Justin M. Huttula, Ellann Cohen, Ruander Cardenas
  • Patent number: 11960887
    Abstract: Techniques related to packing pieces of data having variable bit lengths to serial packed data using a graphics processing unit and a central processing unit are discussed. Such techniques include executing bit shift operations for the pieces of data in parallel via execution units of the graphics processing unit and packing the bit shifted pieces of data via the central processing unit.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Bin Wang, Bo Peng
  • Patent number: 11960422
    Abstract: Systems, apparatuses and methods may provide for a frontend driver that notifies a hypervisor of a map request from a guest driver of a device, wherein the device is passed through to and directly controlled by a virtual machine, and wherein the map request is associated with an attempt of the device to access a guest memory page in a virtualized execution environment. The frontend driver may also determine whether the guest memory page is pinned and send a map hypercall to the hypervisor if the guest memory page is not pinned. Additionally, the hypervisor may determine that the guest memory page is pinned, determine, based on a direct memory access (DMA) bitmap, that an unmap request from the guest driver has been issued, and unpin the guest memory page.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Kun Tian, Yan Zhao, Yu Zhang
  • Patent number: 11960429
    Abstract: Methods, apparatus, and computer platforms and architectures employing many-to-many and many-to-one peripheral switches. The methods and apparatus may be implemented on computer platforms having multiple nodes, such as those employing a Non-uniform Memory Access (NUMA) architecture, wherein each node comprises a plurality of components including a processor having at least one level of memory cache and being operatively coupled to system memory and operatively coupled to a many-to-many peripheral switch that includes a plurality of downstream ports to which NICs and/or peripheral expansion slots are operatively coupled, or a many-to-one switch that enables a peripheral device to be shared by multiple nodes. During operation, packets are received at the NICs and DMA memory writes are initiated using memory write transactions identifying a destination memory address.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Patrick Connor, Matthew A. Jared, Duke C. Hong, Elizabeth M. Kappler, Chris Pavlas, Scott P. Dubal
  • Patent number: 11963051
    Abstract: Disclosed embodiments provide a handover prediction scheme that is based on contextual awareness of a compute node, such as a mobile device. The contextual information is used to predict network availability in a predicted target location, which is an area that a compute node is likely to travel. The use of sensors embedded in or accessible by the compute node may be used to carry out aspects of the embodiments. A reinforcement learning recommendation model is used to determine an optimal network, radio access technology, and/or network access node to connect with ahead of arriving at the predicted target location at a predicted arrival time. Other embodiments are described and/or claimed.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Ashwin Umapathy, Akshaya Ravishankar, Sanket Vinod Shingte
  • Patent number: 11963041
    Abstract: Various embodiments generally may relate to Load Balancing Optimization (LBO) and Mobility Robustness Optimization (MRO). Some embodiments of this disclosure are directed to the following 5G SON solutions: use cases and requirements for the management of distributed LBO and centralized LBO; procedures for the management of distributed LBO and centralized LBO; and management services and information needed to support the management of distributed LBO and centralized LBO.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11962406
    Abstract: An extremely high-throughput (EHT) station (STA) may encode an EHT PPDU for transmission on a plurality of subchannels. The EHT STA may determine a spectral mask to apply to the EHT PPDU prior to transmission of the EHT PPDU. When preamble puncturing is performed, the EHT STA may apply an overall spectral mask to the EHT PPDU prior to transmission. The overall spectral mask may be based on an interim spectral mask and a preamble-puncture spectral mask. The subchannels may be in a 6 GHz band and the EHT STA may determine if preamble puncturing is to be performed for one or more of the subchannels based on a presence of incumbents in the one or more of the subchannels, although the scope of the embodiments is not limited in this respect.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Xiaogang Chen, Qinghua Li, Thomas J. Kenney, Assaf Gurevitz, Avishay Friedman
  • Patent number: 11960922
    Abstract: In an embodiment, a processor comprises: an execution circuit to execute instructions; at least one cache memory coupled to the execution circuit; and a table storage element coupled to the at least one cache memory, the table storage element to store a plurality of entries each to store object metadata of an object used in a code sequence. The processor is to use the object metadata to provide user space multi-object transactional atomic operation of the code sequence. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Joshua B. Fryman, Jason M. Howard, Ibrahim Hur, Robert Pawlowski
  • Patent number: 11961838
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Byron Ho, Chun-Kuo Huang, Erica Thompson, Jeanne Luce, Michael L. Hattendorf, Christopher P. Auth, Ebony L. Mays
  • Patent number: 11957974
    Abstract: Described herein is a cloud-based gaming system in which graphics processing operations of a cloud-based game can be performed on a client device. Client-based graphics processing can be enabled in response to a determination that the client includes a graphics processor having a performance that exceeds a minimum threshold. When a game is remotely executed and streamed to a client, the client is configurable to provide network feedback that can be used to adjust execution and/or encoding for the game.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Makarand Dharmapurikar, Rajabali Koduri, Vijay Bahirji, Toby Opferman, Scott G. Christian, Rajeev Penmatsa, Selvakumar Panneer
  • Patent number: 11961179
    Abstract: One embodiment provides for a graphics processing unit comprising a processing cluster to perform multi-rate shading via coarse pixel shading and output shaded coarse pixels for processing by a post-shader pixel processing pipeline.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Prasoonkumar Surti, Abhishek R. Appu, Subhajit Dasgupta, Srivallaba Mysore, Michael J. Norris, Vasanth Ranganathan, Joydeep Ray
  • Patent number: 11961767
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a P-type semiconductor device above a substrate and including first and second semiconductor source or drain regions adjacent first and second sides of a first gate electrode. A first metal silicide layer is directly on the first and second semiconductor source or drain regions. An N-type semiconductor device includes third and fourth semiconductor source or drain regions adjacent first and second sides of a second gate electrode. A second metal silicide layer is directly on the third and fourth semiconductor source or drain regions, respectively. The first metal silicide layer comprises at least one metal species not included in the second metal silicide layer.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Srijit Mukherjee, Vinay Bhagwat, Michael L. Hattendorf, Christopher P. Auth
  • Patent number: 11960439
    Abstract: Methods and apparatus for scalable MCTP infrastructure. A system is split into independent MCTP domains, wherein each MCTP domain uses Endpoint Identifiers (EIDs) for endpoint devices within the MCTP domain in a manner similar to conventional MCTP operations. A new class of MCTP devices (referred to as a Domain Controllers) is provided to enable inter-domain communication and communication with global devices. Global traffic originators or receivers like a BMC (Baseboard Management Controller), Infrastructure Processing Unit (IPU), Smart NIC (Network Interface Card), Debugger, or PROT (Platform Root or Trust) discover and establish two-way communication through the Domain Controllers to any of the devices in the target domain(s). The Domain Controllers are configured to implement tunneled connections between global devices and domain endpoint devices.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Janusz Jurski, Myron Loewen, Mariusz Oriol, Patrick Schoeller, Jerry Backer, Richard Marian Thomaiyar, Eliel Louzoun, Piotr Matuszczak
  • Patent number: 11961836
    Abstract: An integrated circuit structure comprises one or more fins extending above a surface of a substrate over an N-type well. A gate is over and in contact with the one or more fins. A second shallow N-type doping is below the gate and above the N-type well.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Hyung-Jin Lee, Mark Armstrong, Saurabh Morarka, Carlos Nieva-Lozano, Ayan Kar
  • Patent number: 11960734
    Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to be programed using a microsector granularity. Furthermore, selective partial reconfiguration operations may be performed use write operations to write a new configuration over existing configurations to selectively reprogram a portion of programmable logic. A quasi-delay insensitive (QDI) shift register and/or control circuitry receiving data and commands from an access register disposed between portions of programmable logic may enable at least some of the operations described.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Sean R Atsatt, Ilya K. Ganusov
  • Patent number: 11962644
    Abstract: In one embodiment, an apparatus comprises circuitry, wherein the circuitry is configured to: receive, via a communications network, context information for a first set of one or more edge devices, wherein the context information identifies an operating environment of the first set of edge devices based on information from one or more sensors; receive, via the communications network, workload information for a second set of one or more edge devices; determine workload assignments for the first set of edge devices based on the context information for the first set of edge devices and based on the workload information for the second set of edge devices; and transmit, via the communications network, the workload assignments to the first set of edge devices.
    Type: Grant
    Filed: July 2, 2016
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Katalin Klara Bartfai-Walcott, Hassnaa Moustafa
  • Patent number: 11960405
    Abstract: Graphics processors for implementing multi-tile memory management are disclosed. In one embodiment, a graphics processor includes a first graphics device having a local memory, a second graphics device having a local memory, and a graphics driver to provide a single virtual allocation with a common virtual address range to mirror a resource to each local memory of the first and second graphics devices.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Zack S. Waters, Travis Schluessler, Michael Apodaca, Ankur Shah
  • Patent number: 11962320
    Abstract: A semiconductor chip providing on-chip self-testing of an Analog-to-Digital Converter, ADC, implemented in the semiconductor chip is provided. The semiconductor chip comprises the ADC and a Digital-to-Analog Converter, DAC, configured to generate and supply a radio frequency test signal to the ADC via a supply path. The ADC is configured to generate digital output data based on the radio frequency test signal. The semiconductor chip further comprises a reference data generation circuit configured to generate digital reference data. Additionally, the semiconductor chip comprises a comparator circuit configured to compare the digital output data to the digital reference in order to determine error data.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Kameran Azadet, Martin Clara, Daniel Gruber, Albert Molina, Hundo Shin
  • Patent number: 11960884
    Abstract: An embodiment of the invention is a processor including execution circuitry to calculate, in response to a decoded instruction, a result of a complex multiplication of a first complex number and a second complex number. The calculation includes a first operation to calculate a first term of a real component of the result and a first term of the imaginary component of the result. The calculation also includes a second operation to calculate a second term of the real component of the result and a second term of the imaginary component of the result. The processor also includes a decoder, a first source register, and a second source register. The decoder is to decode an instruction to generate the decoded instruction. The first source register is to provide the first complex number and the second source register is to provide the second complex number.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Mark Charney, Raanan Sade, Elmoustapha Ould-Ahmed-Vall, Jesus Corbal, Roman S. Dubtsov
  • Patent number: 11960853
    Abstract: Folded integer multiplier (FIM) circuitry includes a multiplier configurable to perform multiplication and a first addition/subtraction unit and a second addition/subtraction unit both configurable to perform addition and subtraction. The FIM circuitry is configurable to determine each product of a plurality of products for a plurality of pairs of input values having a first number of bits by performing, using the first and second addition/subtraction units, a plurality of operations involving addition or subtraction, and performing, using the multiplier, a plurality of multiplication operations involving values having fewer bits than the first number of bits. The plurality of multiplication operations includes a first number of multiplication operations, and the multiplier is configurable to begin performing all multiplication operations of the plurality of multiplication operations within a first number of clock cycles equal to the first number of multiplication operations.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Martin Langhammer, Bogdan Mihai Pasca
  • Patent number: 11960896
    Abstract: Methods, systems and apparatuses may provide for technology that triggers an idle state in a first command streamer in response to a request to reset a second command streamer that shares graphics hardware with the first command streamer. The technology may also determine an event type associated with the request and conduct the request based on the event type.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Harsh Chheda, Nishanth Reddy Pendluru, Joseph Koston, Eric R. Crawford
  • Patent number: 11960900
    Abstract: Technologies for fast boot-up of a compute device with error-correcting code (ECC) memory are disclosed. A basic input/output system (BIOS) of a compute device may assign memory addresses of the ECC memory to different processors on the compute device. The processors may then initialize the ECC memory in parallel by writing to the ECC memory. The processors may write to the ECC memory with direct-store operations that are immediately written to the ECC memory instead of being cached. The BIOS may continue to operation on one processor while the rest of the processors initialize the ECC memory.
    Type: Grant
    Filed: December 28, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Murugasamy K. Nachimuthu, Rajat Agarwal, Mohan J. Kumar
  • Patent number: 11961535
    Abstract: Techniques are provided for detection of laser-based audio injection attacks. A methodology implementing the techniques according to an embodiment includes calculating cross correlations between signals received from microphones of an array of two or more microphones. The method also includes identifying time delays associated with peaks of the cross correlations, and magnitudes associated with the peaks of the cross correlations. The method further includes calculating a time alignment metric based on the time delays and calculating a similarity metric based on the magnitudes. The method further includes generating a first attack indicator based on a comparison of the time alignment metric to a first threshold and generating a second attack indicator based on a comparison of the similarity metric to a second threshold. The method further includes providing warning of a laser-based audio attack based on the first attack indicator and/or the second attack indicator.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Pawel Trella, Przemyslaw Maziewski, Jan Banas
  • Patent number: 11961804
    Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Mathew J. Manusharow, Jonathan Rosenfeld
  • Patent number: 11963036
    Abstract: An apparatus and system to enable dynamic offloading and execution of compute tasks are described. In split CU-DU RAN architectures, the CU-CP is connected with multiple compute control functions (CF) and service functions (SF) that have different computing hardware/software capabilities. Different architectures depend on whether the SF is collocated with the CU-UP, the CU-UP and SF only serve compute messages, a compute message is supplied directly to the CU-UP or also traverses the CU-CP. In response to reception from a UE of a compute message containing data for computation being sent to the CU-CP through the DU, the CU-CP sends the data to the SF with identifiers and sends the result to the UE.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Sangeetha L. Bangolae, Zongrui Ding, Youn Hyoung Heo, Puneet Jain, Abhijeet Ashok Kolekar, Qian Li, Ching-Yu Liao, Thomas Luetzenkirchen, Sudeep K. Palat, Alexandre Saso Stojanovski
  • Patent number: 11963248
    Abstract: A computer-readable storage medium stores instructions for execution by one or more processors of a UE. The instructions configure the UE for small data transmission (SDT) in a 5G NR network and cause the UE to perform operations comprising detecting while in an RRC_Inactive state, a radio link failure during a first SDT of UL data to a base station. A secure key for a second SDT is generated based on the radio link failure. A configuration message including an indication of the second SDT is transmitted to the base station. A response message including a UL grant is received from the base station. The UL data is encoded for the second SDT using the secure key. The second SDT is performed using the UL grant while the UE is in the RRC_Inactive state.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Sudeep K. Palat, Yi Guo, Marta Martinez Tarradell, Sangeetha L. Bangolae, Ansab Ali, Seau S. Lim, Youn Hyoung Heo
  • Patent number: 11954462
    Abstract: Methods, apparatus, and software for implementing dual Bayesian encoding-decoding for text-to-code transformations. In one aspect, a multi-model probabilistic source code model employing dual Bayesian encoder-decoder models is used to convert natural language (NL) inputs (aka requests) into source code. An NL input is processed to generate a Probabilistic Distribution (PD) of Source code (SC) tokens in an SC token sequence and a PD of Abstract Syntax Tree (AST) tokens in an AST token sequence, wherein each SC token is associated with a respective AST token, and each of the SC and AST tokens have a respective PD. One or more fixing rules are applied to one or more tokens SC tokens that are identified as needing fixing, wherein the fixing rule are selected in consideration of the PDs of the SC tokens and the PDs of their associated AST tokens.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Alejandro Ibarra Von Borstel, Fernando Ambriz Meza, David Israel Gonzalez Aguirre, Walter Alejandro Mayorga Macias, Rocio Hernandez Fabian
  • Patent number: 11955995
    Abstract: A lossless data compressor of an aspect includes a first lossless data compressor circuitry coupled to receive input data. The first lossless data compressor circuitry is to apply a first lossless data compression approach to compress the input data to generate intermediate compressed data. The apparatus also includes a second lossless data compressor circuitry coupled with the first lossless data compressor circuitry to receive the intermediate compressed data. The second lossless data compressor circuitry is to apply a second lossless data compression approach to compress at least some of the intermediate compressed data to generate compressed data. The second lossless data compression approach different than the first lossless data compression approach. Lossless data decompressors are also disclosed, as are methods of lossless data compression and decompression.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: James Guilford, Vinodh Gopal, Daniel Cutter, Kirk Yap, Wajdi Feghali, George Powley
  • Patent number: 11956104
    Abstract: Millimeter-wave (mmWave) and sub-mmWave technology, apparatuses, and methods that relate to transceivers and receivers for wireless communications are described. The various aspects include an apparatus of a communication device including one or more antennas configured to receive an RF signal and an ADC system. The ADC system includes a 1-bit ADC configured to receive the RF signal, and an ADC controller circuitry configured to measure a number of positive samples in the received RF signal for a plurality of thresholds of the 1-bit ADC, estimate receive signal power associated with the received RF signal based on the measured number of positive samples, determine a direct current (DC) offset in the received RF signal using the estimated received signal power, and adjust the received RF signal based on the determined DC offset.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Oner Orhan, Hosein Nikopour, Mehnaz Rahman, Ivan Simoes Gaspar, Shilpa Talwar, Stefano Pellerano, Claudio Da Silva, Namyoon Lee, Yo Seb Jeon, Eren Sasoglu
  • Patent number: 11956156
    Abstract: Methods and apparatus for dynamic offline end-to-end packet processing based on traffic class. An end-to-end connection is set up between an application on a client including a processor and host memory and an application on a remote server. An offline packet buffer is allocated in host memory. While the processor and/or a core on with the client application is executed is in a sleep state, the client is operated in an interrupt-less and polling-less mode as applied to a predetermined traffic class. Under the mode, a Network Interface Controller (NIC) at the client receives network traffic from the remote server and determines whether the network traffic is associated with the predetermined traffic class. When it is, the NIC writes packet data extracted from the network traffic to an offline packet buffer. Descriptors are generated and provided to the NIC to inform the NIC of the location and size of the offline packet buffer.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Akhilesh S. Thyagaturu, Vinodh Gopal
  • Patent number: 11954490
    Abstract: Disclosed embodiments relate to systems and methods for performing instructions to transform matrices into a row-interleaved format. In one example, a processor includes fetch and decode circuitry to fetch and decode an instruction having fields to specify an opcode and locations of source and destination matrices, wherein the opcode indicates that the processor is to transform the specified source matrix into the specified destination matrix having the row-interleaved format; and execution circuitry to respond to the decoded instruction by transforming the specified source matrix into the specified RowInt-formatted destination matrix by interleaving J elements of each J-element sub-column of the specified source matrix in either row-major or column-major order into a K-wide submatrix of the specified destination matrix, the K-wide submatrix having K columns and enough rows to hold the J elements.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Raanan Sade, Robert Valentine, Bret Toll, Christopher J. Hughes, Alexander F. Heinecke, Elmoustapha Ould-Ahmed-Vall, Mark J. Charney
  • Patent number: 11954783
    Abstract: An embodiment of an electronic processing system may include an application processor, persistent storage media communicatively coupled to the application processor, and a graphics subsystem communicatively coupled to the application processor. The graphics subsystem may include a first graphics engine to process a graphics workload, and a second graphics engine to offload at least a portion of the graphics workload from the first graphics engine. The second graphics engine may include a low precision compute engine. The system may further include a wearable display housing the second graphics engine. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Atsuo Kuwahara, Deepak S. Vembar, Chandrasekaran Sakthivel, Radhakrishnan Venkataraman, Brent E. Insko, Anupreet S. Kalra, Hugues Labbe, Abhishek R. Appu, Ankur N. Shah, Joydeep Ray, Elmoustapha Ould-Ahmed-Vall, Prasoonkumar Surti, Murali Ramadoss
  • Patent number: 11955436
    Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song, Stephen Hall
  • Patent number: 11954047
    Abstract: Systems, methods, and apparatuses to implement spatially unique and location independent persistent memory encryption are described. In one embodiment, a system on a chip (SoC) includes at least one persistent range register to indicate a persistent range of memory, an address modifying circuit to check if an address for a memory store request is within the persistent range indicated by the at least one persistent range register, and append a unique identifier value, for a component corresponding to the memory store request for the address, to the address to generate a modified address and output the modified address as an output address when the address is within the persistent range, and output the address as the output address when the address is not within the persistent range, and an encryption engine circuit to generate a ciphertext based on the output address.
    Type: Grant
    Filed: September 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Mahesh Natu, Anand K. Enamandram, Manjula Peddireddy, Robert A. Branch, Tiffany J. Kasanicky, Siddhartha Chhabra, Hormuzd Khosravi
  • Patent number: 11954563
    Abstract: Apparatus and method for error reduction in distributed quantum computing via fusing-and-decomposing gates. For example, one embodiment of an apparatus comprises: a quantum module comprising a plurality of qubits; unitary generation logic to combine a group of quantum gates to form at least one unitary operation; decomposition logic to decompose the unitary operation into multiple alternative gate sequences comprising either exact gate sequences or approximate gate sequences; and selection logic to evaluate the multiple alternative gate sequences based on a cost function to identify at least one of the gate sequences.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 9, 2024
    Assignee: INTEL CORPORATION
    Inventors: Nicolas Sawaya, Anne Matsuura, Justin Hogaboam
  • Patent number: 11954062
    Abstract: Embodiments described herein provide techniques to enable the dynamic reconfiguration of memory on a general-purpose graphics processing unit. One embodiment described herein enables dynamic reconfiguration of cache memory bank assignments based on hardware statistics. One embodiment enables for virtual memory address translation using mixed four kilobyte and sixty-four kilobyte pages within the same page table hierarchy and under the same page directory. One embodiment provides for a graphics processor and associated heterogenous processing system having near and far regions of the same level of a cache hierarchy.
    Type: Grant
    Filed: March 14, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Joydeep Ray, Niranjan Cooray, Subramaniam Maiyuran, Altug Koker, Prasoonkumar Surti, Varghese George, Valentin Andrei, Abhishek Appu, Guadalupe Garcia, Pattabhiraman K, Sungye Kim, Sanjay Kumar, Pratik Marolia, Elmoustapha Ould-Ahmed-Vall, Vasanth Ranganathan, William Sadler, Lakshminarayanan Striramassarma
  • Patent number: 11955343
    Abstract: Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Robert L. Bristol, Marie Krysak, James M. Blackwell, Florian Gstrein, Kent N. Frasure
  • Patent number: 11954489
    Abstract: Disclosed embodiments relate to systems for performing instructions to quickly convert and use matrices (tiles) as one-dimensional vectors. In one example, a processor includes fetch circuitry to fetch an instruction having fields to specify an opcode, locations of a two-dimensional (2D) matrix and a one-dimensional (1D) vector, and a group of elements comprising one of a row, part of a row, multiple rows, a column, part of a column, multiple columns, and a rectangular sub-tile of the specified 2D matrix, and wherein the opcode is to indicate a move of the specified group between the 2D matrix and the 1D vector, decode circuitry to decode the fetched instruction; and execution circuitry, responsive to the decoded instruction, when the opcode specifies a move from 1D, to move contents of the specified 1D vector to the specified group of elements.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Bret Toll, Christopher J. Hughes, Dan Baum, Elmoustapha Ould-Ahmed-Vall, Raanan Sade, Robert Valentine, Mark J. Charney, Alexander F. Heinecke
  • Patent number: 11955395
    Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Lizabeth Keser, Bernd Waidhas, Thomas Ort, Thomas Wagner
  • Patent number: 11956663
    Abstract: This disclosure describes systems, methods, and devices related to traffic indications for multi-link devices (MLDs). A device may generate a first traffic indication map (TIM) with a first bitmap including a first indication that traffic is to be sent by a first access point (AP) device of the MLD to a first non-AP device of a second MLD using a first communication link. The device may generate a second TIM with a second bitmap including a second indication that no traffic is to be sent by a second AP device of the MLD to a second non-AP device of the second MLD using a second communication link. The device may send, using the first communication link, the beacon, the beacon including the first TIM and the second TIM. The device may send, using the first communication link, a data frame to the first non-AP device of the second MLD.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Alexander Min, Laurent Cariou, Minyoung Park, Po-Kai Huang
  • Patent number: 11955534
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Andrew W. Yeoh, Joseph Steigerwald, Jinhong Shin, Vinay Chikarmane, Christopher P. Auth
  • Patent number: 11954501
    Abstract: A scheme for restoring a password-protected endpoint device (e.g., a memory device) of a computer system to an operational state from a low power state without requiring user input of a device password. A password received for unlocking the device during a boot process is stored in a secure memory. The password-protected endpoint device subsequently enters the low power state, causing it to lock. During a transition from the low power state to an operational state, it is detected that the password for the endpoint device is stored in the secure memory. The password is fetched from the secure memory and used to unlock the endpoint device, thereby restoring the endpoint device to an operational state.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Pannerkumar Rajagopal, Bhavana Shankarappa, Kiran Mahesh Eriki
  • Patent number: 11955462
    Abstract: Embodiments are generally directed to package stacking using chip to wafer bonding. An embodiment of a device includes a first stacked layer including one or more semiconductor dies, components or both, the first stacked layer further including a first dielectric layer, the first stacked layer being thinned to a first thickness; and a second stacked layer of one or more semiconductor dies, components, or both, the second stacked layer further including a second dielectric layer, the second stacked layer being fabricated on the first stacked layer.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes, Richard Patten
  • Patent number: 11955377
    Abstract: Approaches based on differential hardmasks for modulation of electrobucket sensitivity for semiconductor structure fabrication, and the resulting structures, are described. In an example, a method of fabricating an interconnect structure for an integrated circuit includes forming a hardmask layer above an inter-layer dielectric (ILD) layer formed above a substrate. A plurality of dielectric spacers is formed on the hardmask layer. The hardmask layer is patterned to form a plurality of first hardmask portions. A plurality of second hardmask portions is formed alternating with the first hardmask portions. A plurality of electrobuckets is formed on the alternating first and second hardmask portions and in openings between the plurality of dielectric spacers. Select ones of the plurality of electrobuckets are exposed to a lithographic exposure and removed to define a set of via locations.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Kevin L. Lin, Robert L Bristol, James M. Blackwell, Rami Hourani, Marie Krysak
  • Patent number: 11954465
    Abstract: An apparatus comprising at least one interface configured to read one or more high-level code instructions; and at least one processor configured to read the one or more high-level code instructions using the interface, determine atomic operations in the high-level code instructions, and translate the one or more high-level code instructions into assembly code instructions, wherein atomic operations are indicated in the assembly code instructions based on the atomic operations in the high-level code instruction.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Alexei Katranov, Stanislav Bratanov