Patents Examined by Ana L. Woodward
  • Patent number: 11965093
    Abstract: Described herein is a polyamide composition including: (a) at least one first semi-crystalline polyamide including repeating units derived from two or more diacids, and one or more diamine(s), (b) at least one second semi-crystalline polyamide including repeating units derived from two or more diacids and one or more diamine(s), (c) at least one glass fibre, and (d) optionally at least one further additive, wherein the at least one first semi-crystalline polyamide and the at least one second semi-crystalline polyamide are different from each other and defined by their molar ratio of repeating units derived from aromatic dicarboxylic acids and aliphatic dicarboxylic acids. As described herein, the polyamide composition provides a superior combination of high thermal stability (i.e. heat distortion temperature) and high flowability (i.e. low melt viscosity).
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 23, 2024
    Assignee: BASF SE
    Inventors: Adair Rangel de Oliveira, Jr., Fabiana Zanelato Kuwajima, Antonio Cesar Da Silva, Carolina Teixeira
  • Patent number: 11958972
    Abstract: A thermoplastic composition includes: (a) about 30 wt % to about 60 wt % of a resin component including polyphenylene ether (PPE) and polystyrene (PS); (b) from about 35 wt % to about 65 wt % of a filler component; (c) from about 1 wt % to about 5 wt % of a flow promoter including at least a partially hydrogenated hydrocarbon resin; and (d) an elastomer component including from 2.5 wt % to 5 wt % rubber content in the composition excluding the filler component. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition except as indicated in (d).
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: April 16, 2024
    Assignee: SHPP Global Technologies B.V.
    Inventors: Rui Mao, Shijie Song
  • Patent number: 11952463
    Abstract: A method of preparing an acid neutralizing polymer powder (ANPP) includes preparing a first reaction product by contacting and reacting virgin polyamide powder material with tert-butoxide in a first aliquot of a polar aprotic solvent and preparing a mixture of an halogenated dialkylalkylamine to a second aliquot of the polar aprotic solvent. ANPP is prepared by mixing the first reaction product and the mixture for a period of time and at a temperature sufficient to produce the ANPP.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 9, 2024
    Assignees: Workers First LLC, Clarkson University
    Inventors: Matthew James Borowiak, Jr., Richard Earl Partch
  • Patent number: 11945949
    Abstract: Disclosed is a polyamide composition including 30% to 99.9% by weight of a polyamide mixture as component A). Component A) includes aliphatic polyamide A1) and aliphatic copolyamide or terpolyamide A2). The weight ratio of A1) to A2) is 55:45 to 95:5. The polyamide composition also includes 0% to 60% by weight of glass fibers as component B), 0% to 2% by weight of nigrosin as component C), 0.1% to 10% by weight of at least one polyhydric alcohol including more than two hydroxyl groups and a number-average molecular weight (Mn) of less than 2000 as component D), 0% to 20% by weight of further additives as component E). The reported amounts sum to 100% by weight based on the total composition.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: April 2, 2024
    Assignee: BASF SE
    Inventors: Sebastian Wagner, Stefan Mochev, Michael Roth
  • Patent number: 11939469
    Abstract: Described herein is a method of using copolyamides c) produced by polymerization of components A?) 15% to 84% by weight of at least one lactam, and B?) 16% to 85% by weight of a monomer mixture (M) including components B1?) at least one C32-C40-dimer acid and B2?) at least one C4-C12-diamine, where the percentages by weight of the components A?) and B?) are in each case based on the sum of the percentages by weight of the components A?) and B?), the method including using the copolyamides c) to increase an impact strength and/or breaking elongation of molded articles made of molding materials including thermoplastic polyamides, which are different from copolyamides c).
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: March 26, 2024
    Assignee: BASF SE
    Inventors: Patrick Spies, Jasmina Simon, Sebastian Allinger, Martin Weber
  • Patent number: 11926711
    Abstract: A thermoplastic starch (TPS)/polylactic acid (PLA)/poly(butylene adipate-co-terephthalate) (PBAT) blend modified biodegradable resin is prepared by using a chain extender, and is prepared from the following raw materials: 20-30 parts by weight of TPS; 20-30 parts by weight of PLA; 40-60 parts by weight of PBAT; and 0.5-0.9 parts by weight of a chain extender KL-E. The preparation method is a two-step method: blending the TPS with the PBAT in a twin screw for granulating; mixing TPS/PBAT mixed granules with PLA granules, and dissolving the chain extender KL-E into an ethyl acetate solution. The chain extender KL-E can be uniformly distributed in PLA and TPS/PBAT mixed granules by using a spraying method, and the remaining short-chain molecules and terminal carboxyl molecules in the mixed granules can be changed into long-chain molecules.
    Type: Grant
    Filed: October 12, 2019
    Date of Patent: March 12, 2024
    Assignee: NANJING WURUI BIODEGRADABLE NEW MATERIAL RESEARCH INSTITUTE CO., LTD.
    Inventor: Tingwei Wang
  • Patent number: 11920034
    Abstract: Described herein is a polyamide composition (P) including specific flat glass fibres (B) with elongated shape having a non-circular cross-sectional area. The polyamide composition (P) is advantageously used for the production of molded parts. Also described herein is a method of using molded parts obtainable by molding of the polyamide composition (P) to produce mechanical parts. The molded parts are characterized by having improved fatigue resistance properties. Also described herein is a polyamide composition (P) including PA 6.6 as polyamide (A) and flat glass fibres (B).
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: March 5, 2024
    Assignee: BASF SE
    Inventors: Gilles Robert, Tae-Kyun Kim, Weibing Wang, Franco Speroni
  • Patent number: 11912868
    Abstract: The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 27, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Gi Dae Choi, Minsu Kim, Eon Seok Lee
  • Patent number: 11912836
    Abstract: The present invention relates to a polymer composition comprising a polymer comprising methyl methacrylate, (meth)acrylic acid and styrene monomers. In particular, the present invention relates to a polymer composition comprising a polymer comprising methyl methacrylate, (meth)acrylic acid and styrene monomers, said composition having particularly advantageous compromises of heat-resistant, fluidity, scratch-resistant and chemical-resistant properties. The present invention also relates to a molded or extruded object comprising a polymer comprising methyl methacrylate, (meth)acrylic acid and of styrene monomers, and the use of these objects.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: February 27, 2024
    Assignee: ARKEMA FRANCE
    Inventors: Stefania Cassiano Gaspar, Benoit Brule
  • Patent number: 11898035
    Abstract: Provided are a polyamide composition containing a polyamide (A) having a melting point of 280° C. or higher and a flame retardant (B), which is such that, when a melt of the polyamide composition is injection-molded with a mold having a thickness of 0.5 mm and a width of 40 mm under the condition of a cylinder temperature higher by 20° C. than the melting point of the polyamide (A), an injection pressure of 74 MPa and a mold temperature of 140° C., the flow length is 40 mm or more, and that the melt flow rate at a temperature of 320° C. and under a load of 2.16 kg is 15 g/10 min or less; and a molded article of the polyamide composition.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: February 13, 2024
    Assignee: KURARAY CO., LTD.
    Inventors: Shimon Kanai, Takaharu Shigematsu
  • Patent number: 11884810
    Abstract: The present invention relates to a thermoplastic resin composition and a molded article including the same. More specifically, the thermoplastic resin composition of the present invention includes 100 parts by weight of a base resin consisting of 10 to 30% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) including an acrylate rubber having an average particle diameter of 0.05 to 0.15 ?m, 20 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) including an acrylate rubber having an average particle diameter of 0.3 to 0.5 ?m, 0 to 35% by weight of an aromatic vinyl polymer (B), and 10 to 60% by weight of a polymethacrylate (C); and 0.5 to 10 parts by weight of a polyamide (D).
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: January 30, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Da Eun Sung, Tae Hoon Kim, Chun Ho Park, Yong Hee An, Wangrae Cho, Ho Hoon Kim, Jeongmin Jang
  • Patent number: 11873582
    Abstract: Presented herein are materials, methods, and systems for the improved 3D printing improved 3D printing of materials that include polypropylene. In some embodiments, the present disclosure provides a composite comprising a polymer matrix and a plurality of fibers for improved 3D printing. For example, the polymer matrix may have a composition that includes a polymer blend of polypropylene (PP) and polyethylene (PE) (e.g., high density polyethylene (HDPE), low density polyethylene (LDPE), linear low-density polyethylene (LLDPE)), impact modified polypropylene copolymer and/or polypropylene random copolymer with a plurality of fibers. In some embodiments, the plurality of fibers comprises cellulosic nanofibers (e.g., natural cellulosic nanofibers, e.g., cellulose nanofibrils). In some embodiments, filaments are prepared from the composites by melt compounding the polymer matrix (e.g., PP copolymers and/or PP/PE pellets) with a plurality of fibers and extruding the mixture.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: January 16, 2024
    Assignee: University of Maine System Board of Trustees
    Inventors: Douglas J. Gardner, Lu Wang, Jordan Elliott Sanders
  • Patent number: 11873402
    Abstract: Enhanced suffusion coated and laminated nylon fibers are described. The fibers are formed from a blend of an aliphatic nylon and a semiaromatic nylon that is subsequently suffused with carbon. The nylon blend demonstrates advantageous physical properties over typical nylons, and the carbon suffusion process unexpectedly improved these physical properties further.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: January 16, 2024
    Assignee: SHAKESPEARE COMPANY, LLC
    Inventors: Piyush Dave, Saumitra Bhargava
  • Patent number: 11866580
    Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: January 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Fumito Suzuki, Jun Yasumoto, Hiroharu Inoue
  • Patent number: 11859052
    Abstract: A nonlimiting example method for synthesizing a pigment-pendent polyamide (PP-polyamide) may comprise: functionalizing metal oxide particles bound to a pigment particle with a compound having an epoxy to produce a surface treated pigment having a pendent epoxy; and reacting the pendent epoxy with a polyamide to yield the PP-polyamide. Another nonlimiting example method for synthesizing a PP-polyamide may comprise: functionalizing metal oxide particles bound to a pigment particle with a silica particle having a carboxylic acid surface treatment to produce a surface treated pigment having a pendent carboxylic acid; converting the pendent carboxylic acid to a pendent acid chloride; and reacting the pendent acid chloride with a polyamide to yield the PP-polyamide.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: January 2, 2024
    Assignee: Xerox Corporation
    Inventors: Valerie M. Farrugia, Karen A. Moffat
  • Patent number: 11859068
    Abstract: Described herein are thermoplastic molding materials including components: A) 10 to 98.5 wt % of a thermoplastic polyamide, B) 1 to 20 wt % of red phosphorus, C) 0.5 to 15 wt % of an aluminum salt of phosphonic acid, D) 0 to 55 wt % of a fibrous or particulate filler or mixtures thereof, E) 0 to 30 wt % of further additives, wherein the weight percentages of the components A) to E) sum to 100%.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: January 2, 2024
    Assignee: BASF SE
    Inventors: Michael Roth, Michaela Heussler, Klaus Uske, Christoph Minges
  • Patent number: 11851563
    Abstract: A base polyamide composition comprising a nylon mixture having caprolactam units from 1 wppb to 50 wppm catalyst composition; and greater than 0.75 wt % residual caprolactam, wherein the base polyamide composition has a delta end group level ranging from 30 ?eq/gram to 90 ?eq/gram.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: December 26, 2023
    Assignee: Ascend Performance Materials Operations LLC
    Inventors: Jacob Ray, Chris Schwier, Douglas Claire Hoffman, Muhamad Fouad
  • Patent number: 11840628
    Abstract: A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: December 12, 2023
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Rongtao Wang, Zhenfang Shang, Ningning Jia
  • Patent number: 11840626
    Abstract: A poly alpha-1,3-glucan compound comprising: a) poly alpha-1,3-glucan, and b) a functionalized polyolefin; wherein said poly alpha-1,3-glucan compound comprises from 0.5 to 70 weight percent of poly alpha-1,3-glucan, based on the total weight of poly alpha-1,3-glucan (a) and functionalized polyolefin (b) in the poly alpha-1,3-glucan compound and wherein said functionalized polyolefin is grafted onto the poly alpha-1,3-glucan. These poly alpha-1,3-glucan compounds have many uses including films for packaging applications and as elastomers for automotive applications.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: December 12, 2023
    Assignee: NUTRITION & BIOSCIENCES USA 4, INC.
    Inventors: Xian Jiang, Vindhya Mishra
  • Patent number: 11820867
    Abstract: A benzoxazine resin and a method for manufacturing the same, and a resin composition are provided. The benzoxazine resin is obtained from a condensation polymerization reaction of a phenolic compound, formaldehyde, and a primary amine compound that are used as a reactant. The phenolic compound includes a dicyclopentadiene phenol resin and bisphenol A. The primary amine compound includes 2,6-dimethylaniline and m-xylylenediamine. The resin composition includes the benzoxazine resin, an epoxy resin, and a bismaleimide resin. Based on a total weight of the benzoxazine resin, the epoxy resin, and the bismaleimide resin being 100 phr, an amount of the benzoxazine resin ranges from 30 phr to 50 phr.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: November 21, 2023
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Cheng-Chung Lee, Chen-Hua Wu, Yu-Shiang Peng, Wei-Ting Wei