Abstract: Methods for producing a polyamide having an optical absorber pendent from the polyamide's backbone (OAMB-polyamide) may comprise: esterifying a hydroxyl-pendent optical absorber with a halogen-terminal aliphatic acid to yield a halogen-terminal alkyl-optical absorber; and N-alkylating a polyamide with the halogen-terminal alkyl-optical absorber to yield the OAMB-polyamide. Other methods for producing an OAMB-polyamide may comprise: esterifying a carboxyl-pendent optical absorber with a halogen-terminal aliphatic alcohol to yield a halogen-terminal alkyl-optical absorber; and N-alkylating a polyamide with the modified optical absorber to yield a polyamide having the OAMB-polyamide.

Abstract: Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

Abstract: To provide a polyamide resin composition that contains a halogen-containing flame retardant, which excels in flame retardance, well suppressed from degrading the transmittance due to darkening, and such molded article. The polyamide resin composition contains a polyamide resin, 1 to 10% by mass of a halogen-containing flame retardant, and 1 to 5% by mass of antimony oxide, the polyamide resin composition having a phosphorus atom concentration of 1.50×10?2% by mass or less.

Abstract: Aspects of the invention can be directed to a boot including a sole portion, a lower portion, and a boot shaft portion. The sole portion, the lower portion and the boot shaft portion can be formed as a unitary member composed of a single compound. The wherein the single compound can include: EVA in the range of 17% to 27%, POE in the range of 6% to 16%, SEBS in the range of 10% to 20%, and rubber in the range of 19% to 29%.

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

Abstract: A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.

Abstract: The present invention relates to a polymer composition (C) comprising at least one polyamide (P1), and from 1 to 50 wt. %, based on the total weight of (C), of at least one functionalized polymer (P2), wherein P2 is a poly(aryl ether sulfone) (PAES) having at least one functional group (SO3?), (Mp+)1/p in which Mp+ is a metal cation of p valence. The present invention also relates to articles incorporating the polymer composition (C) and the use of functionalized polymer (P2) as a compatibilizer in the polymer composition (C) comprising two immiscible polymers.

Abstract: A thermoplastic acrylonitrile-butadiene-styrene copolymer/lignin blend is provided, whereas the blend comprises (i) an amount of acrylonitrile-butadiene-styrene copolymer; (ii) an amount of lignin; and (iii) an amount of compatibilizing agent capable of imparting improved ductility and impact strength to the resultant blend. Methods of improving impact strength and ductility of a thermoplastic acrylonitrile-butadiene-styrene copolymer/lignin blend and articles made therefrom are also disclosed.

Abstract: The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Abstract: A novel primer composition contains aldimine and/or epoxy resins, a process of making such primer to be used in glass bonding adhesive kit.

Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.

Abstract: The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

Abstract: A thermoplastic molding composition is disclosed. The thermoplastic molding composition includes A) from 20 to 96.9% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of an inorganic phosphinate salt, C) from 1 to 15% by weight of an organic phosphinate salt, D) from 1 to 15% by weight of melamine cyanurate, E) from 0.1 to 10% by weight of a polyvinylpyrrolidone homopolymer, and F) from 0 to 50% by weight of other additives. The total of the percentages by weight of A) to F) is 100%.

Abstract: Disclosed herein are a polyamide composition and a molded article made of the same with improved mechanical strength and reduced weight. The molded article may include the polyamide composition that includes high flowable polyamide and polyphthalamide and a small-diameter fiber, thereby resulting in an improvement in mechanical strength while achieving excellent surface properties and high weight reduction.

Abstract: Disclosed is a polyamide resin composition including 50% to 99% by mass of a polyamide (P) and 1% to 50% by mass of an acid-modified polyolefin (Q) satisfying the following requirements (1) to (3). (1) A melt flow rate (MFR) as measured at 230° C. under a load of 2.16 kg is 50 to 200 (g/10 min). (2) An acid modification amount is 0.1% to 2.0% by mass. (3) The acid-modified polyolefin (Q) includes a modified product (q1) of an elastomer including 10% to 95% by mole of an ethylene-derived skeleton unit, 0% to 80% by mole of a propylene-derived skeleton unit, and 3% to 40% by mole of a skeleton unit derived from an ?-olefin having 4 to 8 carbon atoms (with a total amount of the ethylene-derived skeleton unit, the propylene-derived skeleton unit, and the skeleton unit derived from an ?-olefin being 100% by mole), the elastomer being modified by maleic acid or an anhydride thereof.

Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.

Abstract: A polyamide resin composition containing a polyimide resin (A), a modified styrene-based copolymer (B), a modified high-density polyethylene (C), and an aliphatic metal salt (D), and having a melt mass flow rate (MFR) of 20 g/10 minutes or more and less than 60 g/10 minutes and a 65% RH equilibrium water absorption rate of less than 3%. The polyamide resin composition can form a molded article having a sufficiently high limit of fatigue against continuous load, achieve high mechanical characteristics and high fluidity to prevent the occurrence of a short shot or decrease in the strength of a welded part even in a large and/or thick molded article, and has excellent mold releasability and more excellent abrasion resistance than ever before.

Abstract: A polyvinylidene fluoride film composition and a polyvinylidene fluoride isolation film are provided. The polyvinylidene fluoride film composition includes a polyvinylidene fluoride, a polyetherimide, and a polyether-type nonionic surfactant. The weight ratio of the polyvinylidene fluoride to the polyetherimide is 1:1 to 19:1, and the content of the polyether-type nonionic surfactant is 0.1% to 10% by weight based on a total of 100% by weight of the polyvinylidene fluoride film composition.