Patents Examined by Ana L. Woodward
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Patent number: 11840628Abstract: A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.Type: GrantFiled: October 8, 2021Date of Patent: December 12, 2023Assignee: ELITE MATERIAL CO., LTD.Inventors: Rongtao Wang, Zhenfang Shang, Ningning Jia
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Patent number: 11840626Abstract: A poly alpha-1,3-glucan compound comprising: a) poly alpha-1,3-glucan, and b) a functionalized polyolefin; wherein said poly alpha-1,3-glucan compound comprises from 0.5 to 70 weight percent of poly alpha-1,3-glucan, based on the total weight of poly alpha-1,3-glucan (a) and functionalized polyolefin (b) in the poly alpha-1,3-glucan compound and wherein said functionalized polyolefin is grafted onto the poly alpha-1,3-glucan. These poly alpha-1,3-glucan compounds have many uses including films for packaging applications and as elastomers for automotive applications.Type: GrantFiled: August 30, 2018Date of Patent: December 12, 2023Assignee: NUTRITION & BIOSCIENCES USA 4, INC.Inventors: Xian Jiang, Vindhya Mishra
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Patent number: 11820867Abstract: A benzoxazine resin and a method for manufacturing the same, and a resin composition are provided. The benzoxazine resin is obtained from a condensation polymerization reaction of a phenolic compound, formaldehyde, and a primary amine compound that are used as a reactant. The phenolic compound includes a dicyclopentadiene phenol resin and bisphenol A. The primary amine compound includes 2,6-dimethylaniline and m-xylylenediamine. The resin composition includes the benzoxazine resin, an epoxy resin, and a bismaleimide resin. Based on a total weight of the benzoxazine resin, the epoxy resin, and the bismaleimide resin being 100 phr, an amount of the benzoxazine resin ranges from 30 phr to 50 phr.Type: GrantFiled: July 5, 2021Date of Patent: November 21, 2023Assignee: NAN YA PLASTICS CORPORATIONInventors: Cheng-Chung Lee, Chen-Hua Wu, Yu-Shiang Peng, Wei-Ting Wei
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Patent number: 11820891Abstract: The invention relates to a thermoplastic polymer composition comprising polyamides, its preparation method and a device for a motor vehicle capable of damping vibrations. The composition (I1, I2, I3, I4) comprises an aliphatic polyamide a polyphthalamide coming from a C6-C12 aliphatic diamine and from an aromatic diacid comprising terephthalic acid, the aliphatic polyamide/polyphthalamide weight ratio being >1 and a reinforcing filler comprising glass fibers. The composition has, after “RH50” conditioning, maximum tan delta values according to ISO 6721-5 between 60-90° C. and 1-3000 Hz, with (i) tan delta >4.20% at 60° C. and/or (ii) tan delta >4.00% at 80° C. and/or (iii) tan delta >3.80% at 90° C.Type: GrantFiled: November 19, 2020Date of Patent: November 21, 2023Assignee: HutchinsonInventors: Antoine Lucas, Marion Doudeau-Pirat
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Patent number: 11820889Abstract: The present invention pertains to a fluoropolymer hybrid organic/inorganic composite, to a film comprising said fluoropolymer hybrid organic/inorganic composite and to uses of said film in various applications, especially in electrochemical and in photo-electrochemical applications.Type: GrantFiled: May 8, 2018Date of Patent: November 21, 2023Assignee: Solvay SAInventors: Alberto Frache, Julio A. Abusleme, Alberto Cisternino, Christine Hamon, Giambattista Besana, Ségolène Brusseau, Matteo Lavaselli, Giovanni Camino
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Patent number: 11814518Abstract: A polyamide resin composition is provided which can be blow molded while concurrently satisfying blow moldability and uniform wall thickness of the molten resin, exhibits excellent thermal stability when the resin composition is accumulated as a melt and thereby gives molded articles with a good surface appearance, and is further excellent in impact resistance at room and low temperatures. The polyamide resin composition includes, based on 100 mass % of the polyamide resin composition, 40 to 84 mass % of a polyamide resin (A), not less than 15 mass % of an olefin-based ionomer (B), 0 to 10 mass % of an impact modifier (C), and 0.1 to 3 mass % of heat resistant agents (D). The polyamide resin (A) includes at least one selected from the group consisting of aliphatic copolyamides (A-1) and aromatic copolyamides (A-2). The heat resistant agents (D) include two or more kinds of organic hindered phenol heat resistant agents (D-1).Type: GrantFiled: July 31, 2019Date of Patent: November 14, 2023Assignee: UBE CORPORATIONInventors: Tetsuya Yasui, Atsushi Yamashita
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Patent number: 11802206Abstract: A nonlimiting example method of forming polyamide polymer particles having pigments therein may comprising: mixing a mixture comprising a polyamide having a pigment pendent from a backbone of the polyamide (PP-polyamide), a carrier fluid that is immiscible with the PP-polyamide, and optionally an emulsion stabilizer at a temperature greater than a melting point or softening temperature of the PP-polyamide and at a shear rate sufficiently high to disperse the PP-polyamide in the carrier fluid; and cooling the mixture to below the melting point or softening temperature of the PP-polyamide to form solidified particles comprising the PP-polyamide and, when present, the emulsion stabilizer associated with an outer surface of the solidified particles. Said solidified particles may be used in additive manufacturing to make a variety of objects like containers, toys, furniture parts and decorative home goods, plastic gears, automotive parts, medical items, and the like.Type: GrantFiled: June 30, 2020Date of Patent: October 31, 2023Inventors: Karen A. Moffat, Valerie M. Farrugia
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Patent number: 11795303Abstract: This disclosure provides a polymer composite including a polymer, nanocellulose, and a compatibilizer, wherein the nanocellulose comprises cellulose nanocrystals and/or cellulose nanofibrils, and wherein the compatibilizer comprises a maleated polymer. In some embodiments, the nanocellulose includes lignin-coated nanocellulose. The polymer may be selected from polyethylene, polypropylene, polystyrene, polylactide, or poly(ethylene terephthalate). The maleated polymer may be selected from maleated polyethylene, maleated polypropylene, maleated polystyrene, maleated polylactide, or maleated poly(ethylene terephthalate.Type: GrantFiled: October 5, 2020Date of Patent: October 24, 2023Assignee: GranBio Intellectual Property Holdings, LLCInventors: Asis Kumar Banerjie, Kimberly Nelson
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Patent number: 11786160Abstract: The present invention provides a bio-electrode composition comprising a polymer compound having a repeating unit A that contains silver salt of fluorosulfonic acid, silver salt of fluorosulfonimide, or silver salt of fluorosulfonamide. This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility and light weight, which can be manufactured at low cost and does not cause large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition and a method for manufacturing the bio-electrode.Type: GrantFiled: February 11, 2019Date of Patent: October 17, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Jun Hatakeyama, Osamu Watanabe, Motoaki Iwabuchi, Shiori Nonaka, Koji Hasegawa
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Patent number: 11787939Abstract: The present disclosure relates to compositions and compounded compositions including polyamide and a maleated polyolefin, articles formed from the same such as extruded or molded articles, and methods of making the compositions and articles. A composition includes a condensation polyamide that is at least 30 wt % of the composition and that is the predominant polyamide in the composition. The composition also includes from ?10 wt % to ?50 wt % of a maleic anhydride grafted polyolefin having a grafted maleic anhydride incorporation of ?0.05 to ?1.5 wt % based on total weight of the maleated polyolefin.Type: GrantFiled: October 16, 2020Date of Patent: October 17, 2023Assignee: INV NYLON POLYMERS AMERICAS, LLCInventors: Chee Sern Lim, Isaac Iverson, John Buzinkai
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Patent number: 11787940Abstract: A terpolymer composition is described that contains a statistical amount of 50-98 wt % of a first repeating AA-BB comonomer unit; 1-25 wt % of a second repeating AA-BB comonomer unit; and 1-25 wt % of a repeating lactam comonomer unit or 1-25 wt % of a third repeating AA-BB comonomer unit, where the terpolymer composition exhibits a high melting point similar to that of PA66 while also exhibiting a significantly reduced crystallization rate and crystallization temperature.Type: GrantFiled: June 8, 2022Date of Patent: October 17, 2023Assignee: Ascend Performance Materials Operations LLCInventors: Jacob G Ray, Douglas Hoffman, Scott E. Powers
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Patent number: 11781014Abstract: The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.Type: GrantFiled: July 7, 2021Date of Patent: October 10, 2023Inventors: René Chelle, David Nguyen, Arnaud Vilbert
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Patent number: 11780955Abstract: A polymer complex is disclosed which is the reaction product of one or more polymers having a terminal or pendant hydroxyl group, or a terminal or pendent carboxyl group, or combinations thereof, with at least one metal complex and one alkyl phosphate. This polymer complex acts as an adhesion promotion agent as well as a viscosity stabilizer when formulated in a printing ink or coating.Type: GrantFiled: April 29, 2020Date of Patent: October 10, 2023Assignee: Sun Chemical CorporationInventors: Mark Andreas Mielke, Mathew Charles Mathew, William P. Keaveney, Richard John Czarnecki, William Ford Wilson, Mark John Lindsey, Ralph Francis Arcurio
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Patent number: 11781013Abstract: Described herein are thermoplastic composites including a polymer matrix, having a at least one semi-crystalline polyphthalamide (“PPA”) polymer, and at least one continuous reinforcing fiber. It was surprisingly discovered that incorporation of semi-crystalline PPA polymers, having a selected melt profile, into the polymer matrix provided for crack-free thermoplastic composites. Based at least in part on the semi-crystalline structure of PPA polymers, the thermoplastic composite can have improved tensile strength, chemical resistance and thermal stability, relative to composites incorporating an amorphous PPA polymer. The composites can be formed using melt impregnation techniques, well known in the art. The composites can be desirably used in a wide range of application settings including, but not limited to automotive, aerospace, automotive and oil and gas and mobile electronic device applications.Type: GrantFiled: February 21, 2018Date of Patent: October 10, 2023Assignee: SOLVAY SPECIALTY POLYMERS USA, LLCInventors: Joel Flores, Pierre-Yves Lahary, Anthony Bocahut, Chloé Epinat
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Patent number: 11767428Abstract: The present invention relates to a reinforced thermoplastic powder composition, comprising: at least one polyamide powder with a d50 of less than 100 ?m, from 5% to 70% by weight of at least one glass fiber: with a l50 within the range from 50 to 200 ?m, with an lmax of less than 450 ?m, with a d50 within the range from 4 to 40 ?m, with a form factor F: l50/d50 of between 5 and 15, and from 0.05% to 5% of a pulverulent flow agent with a d50 of less than 20 ?m; with regard to the total weight of the composition. The present invention relates in particular to the use of said composition in 3D printing processes for manufacturing reinforced three-dimensional objects.Type: GrantFiled: October 4, 2018Date of Patent: September 26, 2023Assignee: Arkema FranceInventors: Jean-Charles Durand, Ornella Zovi, Benoît Brule
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Patent number: 11769607Abstract: A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.Type: GrantFiled: November 16, 2021Date of Patent: September 26, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
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Patent number: 11760909Abstract: Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.Type: GrantFiled: June 21, 2021Date of Patent: September 19, 2023Assignee: PRC-DESOTO INTERNATIONAL, INC.Inventor: Bruce Virnelson
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Patent number: 11760850Abstract: Provided is a fiber-reinforced polypropylene composition having a light weight and improved mechanical strength. A carbon fiber-containing polypropylene composition contains a predetermined amount of each of polypropylene (component 1), carbon fiber (component 2), and modified polypropylene (component 3), wherein the component 2 contains a predetermined amount of each of a C—O bond, a C?O bond, an O—C?O bond, a C—C bond, and a C—N bond.Type: GrantFiled: March 26, 2021Date of Patent: September 19, 2023Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Shun Takahashi, Masahiko Numakura, Kenichi Seno
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Patent number: 11760717Abstract: The resin composition of the present disclosure contains a fluorene derivative represented by the following formula (1) and a polyamide-series resin: Wherein R1 represents a substituent, k denotes an integer of 0 to 8, R2a, R2b, R2c, and R2d each represent a hydrogen atom or a substituent, R3a and R3b each represent a hydrogen atom or a substituent, and X1a and X1b each represent a group defined in the following formula (X1): wherein R4 and R5 each represent a hydrogen atom or a hydrocarbon group; or R4 and R5 bend together to form a heterocyclic ring containing the nitrogen atom adjacent to R4 and R5. The resin composition has an excellent fluidity.Type: GrantFiled: December 21, 2020Date of Patent: September 19, 2023Assignee: OSAKA GAS CHEMICALS CO., LTD.Inventors: Yuki Ouchi, Shinichi Kamei, Tomoharu Tachikawa, Tomoya Hasegawa, Haruka Katakura
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Patent number: 11753542Abstract: Disclosed are a thermoplastic polyamide resin composition, a method for preparing the same and a molded article produced thereby. The molded article may have improved impact strength and heat resistance, produced from the thermoplastic polyamide resin composition including a nucleating agent containing an aromatic polyamide and a heat-dissipation filler, polyamide 66 and polyamide 6, thereby improving the speed of process and realize uniform crystallization.Type: GrantFiled: December 29, 2020Date of Patent: September 12, 2023Assignees: Hyundai Motor Company, Kia Motors CorporationInventor: Seung Woo Choi