Abstract: A display device is provided and includes display panel; case provided at back surface of display panel; and flexible wiring board including first end connected to display panel and curved along outer surface of case, flexible wiring board comprising sheet-shaped substrate having first surface that is flat and second surface opposite to first surface, conductive layer formed on first surface of substrate and constituting wires, and protective layer overlaid on conductive layer and substrate, and substrate comprising first portion including first end joined to display panel, second portion including second end opposite to first end, and third portion provided between first portion and second portion, thickness of part of third portion is smaller than thickness of first portion and thickness of second portion, flexible wiring board is curved at third portion.

Abstract: Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. An edge connector may be formed on an end of the PCB substrate and may include contact pins on an outer layer of the plurality of layers. The edge connector may also include an intra-pair coupling block disposed on one or more interior layers such that at least a portion of the intra-pair coupling block is colinear with at least one contact pin on the outer layer. The electronic device may also include at least one integrated circuit on the PCB and electrically connected to the contact pins. The intra-pair coupling component may induce coupling of signals carried by the contact pins.

Abstract: An apparatus and method to reliably attach an electronic module to a textile. The overall mechanical assembly of the invention includes: (a) light pipe, (b) top enclosure, (b) magnet, (c) main electronics which contains (d) the main PCB, (e) battery and (f) other electronic components, (g) bottom enclosure, which holds (h) the connector PCB, (i) module dock, (j) top textile PCB which are located above the (j) textile band and under the (k) textile pocket and the (I) bottom textile PCB and (m) fabric and laminate padding, which are located below the textile band. The invention is physically embodied by an electronic module, comprising at least one printed circuit board (PCB), comprising at least one conductive circuit and at least one electronic component; a metallic rivet, grommet or eyelet to mechanically and electrically connect the; and a textile substrate with at least one electrically conductive circuit.

Abstract: A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

Abstract: A flexible printed circuit and a manufacture method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a transfer sub-circuit board. The main sub-circuit board includes a first transfer terminal, a first wiring portion and a second wiring portion; and the transfer sub-circuit board includes a second transfer terminal and a third wiring portion, and the third wiring portion electrically connects a first group of second contact pads with a second group of second contact pads of the second transfer terminal. The transfer sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the first group of second contact pads to the first group of first contact pads and electrically connecting the second group of second contact pads to the second group of first contact pads.

Abstract: An apparatus for interfacing with an RF/microwave subsystem is provided. The apparatus includes a printed circuit board that includes: a controller, and a connector constructed to provide control signals and power signals to a subsystem in accordance with instructions from the controller, and a mechanical interface constructed to provide a mechanical connection between the subsystem and the printed circuit board.

Abstract: A display apparatus includes a display panel including first display pads and second display pads spaced apart from the first display pads, a main circuit board, a first flexible circuit board which connects the main circuit board to the first display pads, a second flexible circuit board which connects the main circuit board to the second display pads and overlaps at least a portion of the first flexible circuit board, heat radiation members on the first and second flexible circuit boards, and a deformation prevention member spaced apart from the heat radiation members and disposed on at least one of the first and second flexible circuit boards. The deformation prevention member includes a metal.

Abstract: A voltage regulator module includes a circuit board, a metallic winding assembly, a switching circuit and a magnetic core assembly. The circuit board includes an accommodation space, a first surface and a second surface. The accommodation space is formed within the circuit board and in communication with a first opening and a second opening. The metallic winding assembly includes third opening. A projection region of the switching circuit and a projection region of the metallic winding assembly on the first surface are partially overlapped with each other. The magnetic core assembly includes an upper core, a lower core and a lateral leg. The upper core and the lower core are disposed on the circuit board. The lateral leg is penetrated through the first opening, the third opening and the second opening. An inductor is defined by the magnetic core assembly and the metallic winding assembly collaboratively.

Abstract: In accordance with embodiments disclosed herein, there is provided a high-density dual-embedded-microstrip interconnect. An interconnect includes a reference layer and a dielectric disposed on the reference layer. The interconnect further includes a pair of conductors including a first conductor and a second conductor that are in an edge-facing orientation. The interconnect further includes a third conductor. The pair of conductors may be disposed within the dielectric and the third conductor may be disposed on the dielectric above the pair of conductors. The pair of conductors may be disposed on the dielectric and the third conductor may be disposed within the dielectric below the pair of conductors. First noise received by the third conductor from the first conductor and second noise received by the third conductor from the second conductor at least partially cancel out.

Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Abstract: A flexible electronic foil (1,1?,1?) comprising a flexible substrate (2) and at least one electrically conducive portion (3) arranged to the substrate (2). The foil (1,1?,1?) comprises mechanical fastening means (6,6?,7) for mechanical fastening of the electronic foil (1,1?,1?), the mechanical fastening means being part of the substrate (2) of the electronic foil (1,1?,1?).

Abstract: A flexible printed circuit board includes: a trunk portion; and a pair of branch portions as two portions branched from the trunk portion and arranged on a battery including multiple arrayed cells, in which for at least one branch portion of the pair of branch portions, bending is performed using a pair of parallel bending lines extending apart from the other branch portion as extending apart from the trunk portion, and the at least one branch portion is bent such that a direction of bending at one bending line of the pair of parallel bending lines and a direction of bending at the other bending line are directions opposite to each other.

Abstract: A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.

Abstract: A detachable capacitor connection structure is provided for a storage device. In an embodiment, a connection element detachably connects a capacitor module including one or more capacitors to a circuit board such that the capacitor module is stacked over the circuit board. The connection element includes: a first connector including two pin headers, mounted on a bottom plane of the capacitor module; and a second connector including two sockets, mounted on a top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.

Abstract: Provided is a control device and a motor device that can effectively suppress influence of vibration of a specific electronic component. A coil that is the specific electronic component is mounted on a circuit board. A connector portion has a base portion extending in a thickness direction of the circuit board and an extended portion extending from the base portion in a direction in which the circuit board extends. The extended portion of the connector portion has an annular portion, a support portion, and a pedestal portion. The pedestal portion serves as a portion to which the coil is bonded and fixed. With an adhesive applied to the pedestal portion, the pedestal portion bonds and fixes the coil thereto.

Abstract: A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.

Abstract: A flexible intelligent electrical switching device with multi-function capability, and methods of use are presented herein which provide an autonomous, reconfigurable switching device. The present disclosure is specifically designed to reduce space, cost of manufacture, efficiency, installation reduction time and ease of implementation.

Abstract: The embodiments of the present application provide an electronic device, the electronic device defines a channel. A driving board is fixedly connected with a camera module, and an output shaft of a driving motor is mounted with a driving gear. A driven gear is meshed with both of the driving gear and a rack, a diameter of the driven gear is greater than a diameter of the driving gear. The driving motor can drive the driving board to move along a direction from the channel to the outside of the electronic device through the rotation of the driving gear and the rotation of the driven gear, thereby to drive the camera module from in the channel to the outside of the electronic device.