Abstract: A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for engaging a housing of the ball-grid array connector by way of a respective complementary mating feature formed in the housing so that the cover is movable between a first and a second position in relation to the housing.

Abstract: A deformable connector incorporates first and second springs deflectable along multiple axis to compensate for misalignment. A connecting member is attached to the springs and includes perforations also to compensate for mis-alignment along an axis. EMI integrity is maintained with a deformable gasket that abuts the connecting member.

Abstract: An electronic device and a fastening apparatus in the electronic device. The device includes a main board, a shield and a supporting seat. The shield has a first opening and a second opening. The supporting seat includes a first engaging portion, a second engaging portion and a third engaging portion. The supporting seat connects with the shield by the first and second engaging portion and supports the main board by the third engaging portion. The first engaging portion connects to the first opening to prevent the supporting seat from moving along the X and Z axes and the second engaging portion connects to the second opening to prevent the supporting seat from moving along the Y axis. The X, Y, and Z axes are perpendicular to each other.

Abstract: The invention relates to a method for producing an electromagnetic shielding gasket by using a shielding compound that comprises a silicone plastic compound, electrically conducting parts and parts that expand under the influence of heat. The shielding compound is dispensed onto a housing and/or a circuit board and/or parts of the housing and is heat-treated after and/or during application, thereby providing the dispensed compound with the desired predetermined expansion and/or shape.

Abstract: An electrical appliance and, particularly, a hand-held appliance of the type used in close proximity to an individual, such as a hair dryer, cellular telephone, or the like, and which is shielded from emission of electromagnetic radiation. Appliances which are particularly susceptible to generation of electromagnetic radiation are those which include electrical coils as, for example, transformer coils or heating coils. In all cases, the appliance is provided with a shield substantially covering the exterior surface of the appliance. In the case of a hair dryer and similar appliances which have a long tubular barrel and a hand grip portion, both the barrel and the hand grip portion are completely covered with an electromagnetic insulating material. The preferred electromagnetic insulating materials which may be employed, for this purpose, are materials having a high degree of magnetic permeability, usually in the nature of iron alloys.

Abstract: The present invention relates generally to chip packaging and methods of packaging and, more particularly, to compact packaging of chips and methods thereof in electronic environments that minimize undesired electronic effects, promote speed, and enhance packaging versatility.

Abstract: The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead (103a, 103b) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield (103c, 103d, 104, 104a, 104b, 104f) that electrically shields the at least one signal lead (103a, 103b) from the at least one auxiliary lead. The shield (103c, 103d, 104, 104a, 104b, 104f) has such dimensions (d1, d2) and is positioned at such distance (d3, d4, d12) from the at least one signal lead (103a, 103b) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e.

Abstract: An electromagnetic wave shield film (1) comprises a transparent base (2), a conductor (4) positioned on the transparent base (2) via an adhesive (3) and having a mesh geometric pattern, and an earth portion (5) arranged around the conductor (4) and including conductive regions (501) which absorb electromagnetic waves, and non-conductive regions (510) which prevent the earth portion (5) from being creased.

Abstract: A main circuit switching unit and an isolator are accommodated in a vacuum container. A first conductor and a main circuit conductor are arranged to extend in and out of the vacuum container. A movable electrode of the main circuit switching unit is connected to the first conductor through a first flexible conductor, and a movable electrode of the isolator is connected to the main circuit conductor through a second flexible conductor. A shield is arranged around the first conductor and the main circuit conductor. Another shield is arranged around a connecting portion between the first flexible conductor and the movable electrode of the main circuit switching unit. A still another shield is arranged around the isolator. A further another shield is arranged around the second flexible conductor. These shields are secured to the vacuum container through insulating spacers.

Abstract: A multilayered, low temperature co-fired ceramic (LTCC) substrate within which a radio frequency (RF) filter is formed. Portions of a bandpass filter are implemented using electrode patterns on different ceramic tape layers of which selected portions are mutually superimposed, thereby providing self-compensation for changes in mutual coupling (e.g., mutual inductance) caused by small errors in alignment of the ceramic tape layers occurring during manufacturing.

Abstract: A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor device, and a tab unit extending from the cover and for holding the substrate. The cover has an outer surface made of conductive material and an inner surface made of insulation material, where the insulating inner surface faces the semiconductor device. The tab unit has a first contact surface which extends from the conductive outer surface and is contact with the ground electrode.

Abstract: An electromagnetic interference (EMI) shielding cage for an electronic module is comprised an electrically-conductive bottom, an electrically-conductive rear panel electrically coupled to said bottom, an electrically-conductive, elongated cover electrically coupled to said bottom and first and second side walls that are electrically and mechanically coupled to said bottom, said rear panel and said elongated cover. Numerous ground lugs, electrically coupled to at least one of: said bottom; rear panel; and first and second side walls provide an electrical pathway for EMI signals to a reference potential. An electrically-conductive, compressible gasket encircling the bottom, top and side walls provides an electrical connection to a front panel, providing additional EMI suppression. Gasket engagement tabs in the top and bottom provide electrical connection between the gasket and panels.

Abstract: A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer.

Abstract: Described is an adaptable EMI/RFI shielding for a panel. The shield includes an electrically conductive shield having first and second sides and a gasket attached on the first side at a periphery of the shield. The shield has a slot formed therein. A panel portion has a front wall and side walls defining an interior region. The panel portion also includes a spring receptacle and a snap that each extends substantially perpendicular from the front wall within the interior region. The spring receptacle has a spring inserted therein with a portion of the spring extending out of the spring receptacle. The snap has a hook at one end of the snap. The spring urges against the second side of the shield and the hook enters the slot and catches onto the first side of the shield when the shield is attached to the panel portion.

Abstract: A two-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield includes a bottom portion mounted to the circuit board and a top portion which fits onto the bottom portion. The RF electrical interference shield can be mounted to circuit boards (e.g., by soldering) to prevent electrical components from causing RF interference. The RF shield of the present invention also allows for easy removal of the top of the RF shield so as to provide access to the interior for rework or repair of the electrical components covered by the shield, without having to unsolder the bottom portion of the shield. The two-piece shield for shielding an electrical component comprises a top portion and bottom portion that are fitted together so as to enclose the electrical components to be shielded. The top and bottom portions snap together, e.g.

Abstract: An electronic device for distorting sensitive information in one or more electromagnetic emanations from the electronic device is disclosed. The device has one or more active layers having one or more electronic components that emit the electromagnetic emanations and one or more conductive substrate layers planarity adjacent to one or more of the active layers that distort the electromagnetic emanations. In alternative embodiments of the inventions, shielding is added with frequency selective openings. In other alternative embodiments, a signal source is added to distort sensitive information.

Abstract: An electronic component comprises an upper half housing segment and a lower half housing segment. A lead frame to be bent downward toward the lower housing segment projects laterally from an upper end portion of the lower housing segment. Projecting from a side wall upper end portion of the lower housing segment is a rib piece in contact with the lower surface of base end portion of the lead frame and plastically deformable when subjected to a bending force to be applied to the base end portion when the lead frame is bent.

Abstract: An EMI suppression plate surrounds a galvanically isolated connector at the opening in a chassis that is provided for the connector. The plate is configured to provide an immediate high frequency coupling to the chassis ground. The plate comprises a circuit board that includes two conductors that are coupled by one or more capacitors. One conductor is in contact with an outer shell of the connector, and the other conductor is in contact with the chassis ground. By providing a high frequency coupling between the connector and chassis at the location of the connector opening on the chassis, the ground current path between the connector and chassis ground is minimized.

Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

Abstract: An electronic card of the present invention has an insulative casing, a connector, a circuit board, a receiving portion, a first shell and a second shell. The insulative casing includes a first bar, a second bar and a transverse bar between the first bar and the second bar. The first shell and the second shell are assembled to shield the insulative casing therebetween. The first shell forms tabs respectively for locking with assembling passages of the first bar and the second bar and locking holes of the transverse bar. The receiving portion has a first cover and a second cover, and either of the first cover and the second cover is unitarily formed with the insulative casing. A transverse bar connects with the first bar and the second bar and forms a lib thereon. Such an electronic card is assembled conveniently and reliably, and shield from EMI.