Abstract: Disclosed are devices for shielding one or more connection ports from electromagnetic interference emissions. In one embodiment, the device includes a conformal member having a proximal aperture, a distal aperture, and a channel extending therethrough. The distal aperture has a maximum cross-sectional dimension that is less than about one half of a cutoff wavelength, thereby forming a waveguide for attenuating EMI signals that have a wavelength greater than a predetermined cutoff wavelength. In another embodiment, the conformable member includes first conformable element and a second conformable element. The conformable elements, when mated, form a proximal aperture, a distal aperture, and a channel extending therethrough having substantially the dimensional characteristics described above.

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

Abstract: A package, a method of making and a method of assembly of packages for semiconductor chips are disclosed. The package includes a die attach pad on which a semiconductor die is mounted. A lead is electrically connected to the semiconductor die which is encapsulated in packaging material. The lead is exposed at opposed sides of the package. Exposing the lead on both sides of the package allows the package to be stacked or assembled so that the leads of adjacent pairs of packages are in electrical contact. Making the semiconductor packages includes forming a piece of electrically conductive material into a die attach pad and at least one lead associated with the die attach pad. A semiconductor die is mounted on the die attach pad and an electrical connection is made between the semiconductor die and the lead. The package is formed by encapsulation with the lead exposed on opposite sides of the package.

Abstract: A hardened voyage data recorder includes two subsystems: a removable non-volatile memory and a base containing electronics and firmware for communicating with data sensing systems and for accessing the memory. According to the invention, the memory is protected in a “boiler” and the electronics includes an ETHERNET interface for connecting to shipboard data acquisition devices. The firmware is preferably configured via web pages. A communications protocol for communicating with the recorder is also disclosed.

Abstract: An electronic device having a printed circuit board having a ground, an electrically insulating layer provided on a face of the printed circuit board, and an electromagnetic shielding layer adhered to the face of the printed circuit board through the electrically insulating layer. The ground of the printed circuit board and the electromagnetic shielding layer are conducted electrically.

Abstract: The present invention belongs to a technical field for manufacturing a three-dimensional structure for an electronic device such as a radio wave shielding member through extension working of a metal plate having cuts. In conventional three-dimensional working of a metal plate, there is a problem in that a non-extension portion is wrinkled depending on extension of a cut. In the present invention, a connecting portion (3) extended in a second direction (D2) is provided at an equal pitch (p) in a first direction (D1) through an opening (4) having a rectangular cross-section in an intermediate portion (PB) between a cut forming portion (PC) having cuts (2) provided like a zigzag in the first direction (D1) and a non-extension portion (PA) having no cut in a metal plate (1). Consequently, even if the cut forming portion (PC) is extended, the connecting portion (3) is simply squashed and contracted and a boundary line (BL) portion is not deformed.

Abstract: The present invention relates to a magnetic device and method for making it, wherein the magnetic device is specifically constructed of grains in a matrix. The matrix may be cement or plaster. The grains have an average diameter that is greater than their magnetic domains. The device may be applied to shielding applications for frequencies ranging from 100 kHz to 10 GHz. The shielding may be applied to walls of a building, consumer products such as magnetic disks, and the like. The grains may be any ferromagnetic material, including ferrite.

Abstract: An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, with the result that the circuit device is spaced above the surface of the circuit board so as to define a gap therebetween. A cavity, such as a blind hole or closed through-hole, is defined in the surface of the circuit board beneath the circuit device and communicates with the gap but is closed off from the opposite surface of the circuit board. Air that is trapped in the gap by a molding material during the overmolding/underfilling process is collected and compressed within the cavity, yielding a void-free underfill between the circuit board and circuit device.

Abstract: The radio wave absorber of the present invention has a radio wave reflector and at least two radio wave absorbing layers disposed on a surface of the radio wave reflector, the at least two radio wave absorbing layers being formed of a base material and electroconductive titanium oxide mixed with the base material. The radio wave absorbing layers have different blend ratios of the electroconductive titanium oxide so as to make their radio wave absorption property different.

Abstract: An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.

Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.

Abstract: An electronic component such as a ceramic capacitor is coupled to a dielectric substrate package. Encapsulant material substantially surrounding the sides of the component, develops cracks therein, particularly near the corners of the component where CTE stresses are greatest. The cracks propagate downward into the dielectric substrate material and sever circuit lines in the substrate causing failure. A mounting pad for the component is extended from beneath the component to substantially beyond the outer periphery of the encapsulant material to prevent cracks from propagating into the dielectric material.

Abstract: An electromagnetic shielding device includes a hollow shielding frame and an elongate resilient member. The shielding frame is made of metal, has an open bottom side, and confines a component-receiving space that is accessible from the open bottom side. The open bottom side of the shielding frame is adapted to be mounted on a circuit board such that an electronic component on the circuit board extends into the component-receiving space through the open bottom side. The resilient member is made of a heat-conductive material, is disposed in the component-receiving space, and has a contact portion adapted to contact the electronic component in the component-receiving space for dissipating heat generated by the electronic component, and at least one resilient arm portion for connecting the contact portion to the shielding frame.

Abstract: A device for accomodating at least one, preferably electrical or electronic, component, comprising a housing forming an interior defined by an inner wall surface, in which interior the at least one component is arranged, the at least one component occupying less than all of the interior of the housing, the balance being filled with a casting material, wherein a projection from the inner wall surface encircles the interior and forms an undercut filled by the casting material to lock the casting material to the inner wall surface.

Abstract: The invention relates to an electronic module consisting of electrical circuit board conductors (3a), one or more electronic and/or electromechanical components (5, 5′), and one or more electrical connection contacts (7) wherein the circuit board conductors (3a) and the components (5, 5′) are surrounded at least partially by a plastic material (11) having low Shore Hardness.

Abstract: Magnetically shielded enclosures (e.g., rooms) and associated methods are disclosed for containing and magnetically shielding a field-sensitive system such as a charged-particle-beam (CPB) microlithography system without having to make the enclosure excessively large. The CPB microlithography system includes a lens column and substrate chamber collectively forming an internal shielding barrier. The shielded enclosure is in external surrounding relationship to the internal shielding barrier. The shielded enclosure includes a wall that defines an aperture through which some of the stray external magnetic field can penetrate to inside the enclosure. Some of the external magnetic field also leaks through the enclosure walls.

Abstract: An EMC core supporting structure for supporting one or more EMC cores inside a casing, which accommodates a printed circuit board, includes a plate member capable of shielding electro-magnetic waves. Preferably, the plate member expanding inside the casing to substantially cover the printed circuit board, and at least one side portion of the plate member is connected to an inner wall of the casing. A supporting portion that receives the EMC core(s) is formed on a surface of the plate member opposite to a surface facing the printed circuit board for mounting the at least one EMC core on the plate member.

Abstract: A floating shield current trap provides two resonance loops formed of split concentric tubular conductors joined radially at their axial ends. Adjustment of the separation of these loops provides a change in coupling between the loops effecting a simplified tuning of the resonance of the trap for different expected frequencies of interfering shield current.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the

Abstract: A conductive gasket includes: a non-conductive, elastic core; a flexible conductive cloth enclosing an outer surface of the core; a hot-melt adhesive inserted between the core and the conductive cloth to attach the core and the conductive cloth; a pressure sensitive adhesive (PSA) tape attached along the gasket to cover the ends of the conductive cloth; and a ridge formed on the PSA tape attached side of the conductive cloth. The conductive gasket is capable of forming a conduction path at all times between conductive members and enhances EMI/RFI shielding efficiency and contact reliability.