Abstract: The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.

Abstract: Disclosed herein is a vacuum cleaner including a first cleaning module to perform a cleaning of a floor and a second cleaning module detachably coupled to the first cleaning module and configured to perform a cleaning in a handheld manner while detached from the first cleaning module, wherein the second cleaning module includes a connecting pipe to deliver inlet force to an inlet of the first cleaning module while connected to the first cleaning module, a handle connected to one side of the connecting pipe, having an inside space, and provided in a shape in which a rear surface thereof is open, a connecting hose connecting the connecting pipe to a dust collector, and a connector having a hose support provided to support the connecting hose, and to connect the connecting pipe to the connecting hose, and the hose support is disposed to support the connecting hose rounded along an inner side of the handle in a state that the connector is coupled to an inside space of the handle.

Abstract: Embodiments relate to solid nano-particles applied to the surface of well equipment to treat bituminous material adhesion. An embodiment provides a method of treating the surface of well equipment. The method may comprise applying a solid nanoparticle film to the surface of the well equipment with a treatment fluid comprising solid nanoparticles. The method may further comprise allowing the solid nanoparticles to interact with the surface of the well equipment and/or bituminous materials adhered to the surface of the well equipment to remove at least a portion of the bituminous materials from the surface of the well equipment.

Abstract: Embodiments relate to removing residue from a well bore and well bore equipment with a treatment fluid composition, and in some embodiments, to treatment fluid compositions that comprise nanoparticles. An embodiment provides a method of removing drilling fluid residue from the surfaces of well equipment. The method comprising: applying a solid nanoparticle film to at least a portion of the surfaces of the well equipment with a treatment fluid comprising solid nanoparticles; and allowing the solid nanoparticles to interact with the surfaces of the well equipment and the drilling fluid residue adhered to the surfaces of the well equipment to remove at least a portion of the drilling fluid residue from the surfaces of the well equipment.

Abstract: Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.

Abstract: An apparatus for cleaning an instrument with a cleaning fluid includes a vessel defining a chamber and a port for at least partially filling the chamber with the fluid. The apparatus further includes an ultrasonic transducer for delivering ultrasonic energy to the fluid, and a vacuum pump for depressurizing the chamber. The apparatus further includes a rotatable device removably disposable in the chamber and having a rack defining a cavity for supporting the instrument. The rotatable device also has a fluid delivery member extending toward the cavity and having a fluid channel between an inlet and an outlet. The apparatus further includes a fluid transmission system in fluid communication with the chamber and the fluid channel of the fluid delivery member for circulating the fluid from the chamber through the fluid channel of the fluid delivery member. A method of cleaning an instrument is also provided.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, using a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof. The incoming fluid mixture may be maintained pressure greater than atmospheric pressure and at a temperature greater than the condensation temperature of the fluid mixture. The fluid mixture may be expanded into the treatment chamber to form an aerosol or gas cluster spray. In this embodiment, the nozzle may be positioned within 50 mm of the microelectronic substrate during the treatment, more preferably within 10 mm of the microelectronic substrate.

Abstract: A cleaning device for cleaning a liquid contact part of a discharge device, the liquid contact part including an operating space in which a rod-like member is operated, and a supply flow path, the cleaning device including a compressed gas source, a cleaning fluid supply tank, a plurality of supply mechanisms that supply compressed gas and a cleaning fluid, a cleaning fluid collection tank, a liquid contact part fixing jig to which the plural supply mechanisms and the cleaning fluid collection tank are fluidly connected, and which accommodates the liquid contact part of the discharge device, and a control device, wherein the cleaning fluid is supplied to the liquid contact part fixing jig in accordance with pressure values, which are specified separately for the plural supply mechanisms, by the control device. The liquid contact part can be cleaned with a uniform flow without disassembling the liquid contact part.

Abstract: Methods for removing, reducing or treating the trace metal contaminants and the smaller fine sized cerium oxide particles from cerium oxide particles, cerium oxide slurry or chemical mechanical polishing (CMP) compositions for Shallow Trench Isolation (STI) process are applied. The treated chemical mechanical polishing (CMP) compositions, or the CMP polishing compositions prepared by using the treated cerium oxide particles or the treated cerium oxide slurry are used to polish substrate that contains at least a surface comprising silicon dioxide film for STI (Shallow trench isolation) processing and applications. The reduced nano-sized particle related defects have been observed due to the reduced trace metal ion contaminants and reduced very smaller fine cerium oxide particles in the Shallow Trench Isolation (STI) CMP polishing.

Abstract: A method of removing a hard mask is provided. Gate stacks are patterned on a substrate, where the gate stacks include a polysilicon layer and the hard mask deposited over the polysilicon layer. A dielectric layer is deposited on the substrate and on the patterned gate stacks. A first portion of the dielectric layer is planarized by chemical mechanical polishing (CMP) to remove a topography of the dielectric layer. The hard mask and a second portion of the dielectric layer are removed by the CMP.

Abstract: A method of removing an unwanted constituent from a siliceous surface in which the method includes contacting the siliceous surface and the unwanted constituent with a multi-functional composition that includes water, a hydrophilic silane, and a surfactant, and drying the surface.

Abstract: A golf equipment cleaning device is provided wherein the cleaning device selectively expels a pressurized fluid that a golfer may use at any point on the golf course. A golfer may use a hand pump to pressurize a container that comprises a fluid. Then, the golfer may release the pressurized fluid through the end of a bristled brush such that the golfer may scrub a golf ball or golf club with a bristled brush and a pressurized fluid.

Abstract: A de-icing system for a hemispherical protective housing mounted on an aircraft structure is described. The system can include a series of piezo-electric devices mounted at the boundary of the housing. The piezo-electric devices generate ultrasonic frequencies and resonance of the protective housing is induced. One of the piezo-electric devices senses the frequency generated in the protective housing and acts as part of a feedback loop to maintain structural resonance of the protective housing. The structural resonance of the protective housing prevents the build-up of ice. Additionally, higher power resonances can be generated to remove ice already built up on the protective housing. The system also enables detection of ice build-up on the protective housing by monitoring any change in the frequency required to maintain structural resonance of the protective housing.

Abstract: A dish washer including a sump unit disposed below a wash tub and configured to collect water, and an upper nozzle, a lower nozzle, and a subsidiary nozzle configured to spray water received from the sump unit onto dishes/cutlery contained in at least one rack. The sump unit includes a circulating pump configured to pump water collected in the sump unit, and a distributing element configured to allow water pumped by the circulating pump to be sprayed through any one of the lower nozzle and the subsidiary nozzle, and to be sprayed selectively through the upper nozzle. Accordingly, it is possible to independently perform an intensive wash mode of spraying water only through the subsidiary nozzle.

Abstract: A method for cleaning a bargun dispenser, the method including providing a cleaning assembly containing a reservoir, a pump and fluid connection tubes; connecting the cleaning assembly to the bargun dispenser by connecting the concentrate inlet line to the reservoir in place of the source of concentrate with one of the fluid connection tubes and connecting the water inlet line to the reservoir in place of the water supply with one of the fluid connection tubes; filling the reservoir with a cleaning solution; activating the pump of the reservoir; and activating the bargun handle buttons for opening the pump outlet lines until the reservoir is empty.

Abstract: A method for removal of organic coatings from loose aluminum scrap includes passing the scrap through a Multiple Hearth Furnace operatively maintained in the range of 500° F.-1600° F. Each hearth in the furnace is independently temperature controlled and held under a slightly negative pressure environment. The hearths heat the scrap such that pyrolysis of the coatings occurs within the hearth. Organic compounds liberated during this process are partially or entirely consumed within the furnace combustion products are exhausted through the top. Hydrogen fluoride contained in the products of combustion is incinerated prior to final discharge from the system and routing to additional environmental equipment for particle removal. Scrap is continuously fed into the top of the furnace, and agitated and mechanically moved within each hearth toward an output of another hearth therebelow. The agitation and movement of the scrap exposes the scrap to the hearth atmosphere to assist in processing of the scrap.

Abstract: The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.

Abstract: A warewasher (1) provided as a box-type warewasher and a method for operating such a warewasher (1) are provided. In accordance with the warewasher and method, during the adsorption phase, air is guided from the treatment chamber (2) of the machine (1) through a drying unit (40) in such a way that moisture from the airflow is absorbed by a dry material, wherein the air is then fed again to the treatment chamber (2). Furthermore, the drying device is arranged above the treatment chamber (2) so as to effectively prevent penetration of splashed water into the drying device (40).

Abstract: A tire cleaning method according to the present technology is a method of cleaning a tire in which puncture repair liquid has been used, comprising the steps of: recovering puncture repair liquid from an inside of a tire before removing the tire from a rim of a wheel; injecting cleaning liquid into the inside of the tire from which the puncture repair liquid has been recovered; cleaning the inside of the tire with the cleaning liquid by moving the tire; and removing the cleaning liquid from the inside of the cleaned tire.