Patents Examined by Dion Ferguson
  • Patent number: 11056281
    Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Hun Park, Heung Kil Park, Gu Won Ji
  • Patent number: 11056278
    Abstract: A capacitor module, in particular for use in an inverter of an electrical or a hybrid vehicle, said capacitor module comprising a housing, at least one capacitor element mounted in said housing and at least one busbar at least partially mounted into said housing and being electrically connected to said capacitor element, the housing comprising a bottom wall, a side wall and an upper wall, wherein said upper wall comprises a peripheral portion made of a sealing material and an central portion made of a thermal dissipation material, the thermal conductivity of the thermal dissipation material being bigger than the thermal conductivity of the sealing material.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: July 6, 2021
    Assignee: VALEO SIEMENS EAUTOMOTIVE SHENZHEN CO., LTD.
    Inventors: Ronghui Li, Yu Qiu, Jun Liu, Huiling Wang
  • Patent number: 11056286
    Abstract: A capacitor assembly that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a pre-coat layer that overlies the dielectric and is formed from an organometallic compound. A solid electrolyte overlies the pre-coat layer that contains an inner layer and an outer layer, wherein the inner layer is formed from an in situ-polymerized conductive polymer and the outer layer is formed from pre-polymerized conductive polymer particles.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: July 6, 2021
    Assignee: AVX Corporation
    Inventors: Jan Petrzilek, Miloslav Uher, Tomas Horfirek
  • Patent number: 11049662
    Abstract: An electrolytic capacitor is disclosed. In an embodiment an electrolytic capacitor includes an anode foil, a cathode foil, a working electrolyte arranged between the anode foil and the cathode foil, a polymer layer arranged on the anode foil, wherein the polymer layer comprises PEDOT:PSS and an intermediate electrolyte arranged between the polymer layer and the working electrolyte, wherein the intermediate electrolyte is different from the working electrolyte with respect to its composition.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 29, 2021
    Assignee: TDK ELECTRONICS AG
    Inventor: Laszlo Dobai
  • Patent number: 11049652
    Abstract: A multi-layer ceramic capacitor includes: a ceramic body including a multi-layer chip and a side margin, the multi-layer chip including a capacitance forming unit including internal electrodes laminated in a first direction, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m, and a cover covering the capacitance forming unit in the first direction, the side margin covering the multi-layer chip in the second direction, the ceramic body having a main surface facing in the first direction, a side surface facing in the second direction, an end surface facing in a third direction orthogonal to the above directions, and a corner portion connecting those surfaces; and an external electrode covering the end surface and the corner portion, the corner portion having a surface roughness of 30 nm or more.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 29, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Kotaro Mizuno
  • Patent number: 11043334
    Abstract: An improved capacitor is provided. The capacitor comprises an anode comprising a pressed and sintered, preferably tantalum, powder wherein the anode has edge surfaces and parallel major surfaces. The anode further comprises a first set of parallel surface protrusions and a second set of parallel surface protrusions on each parallel major surface wherein the first set of parallel surface protrusions and second set of parallel surface protrusions are not parallel and form a well therebetween. An anode wire extends from an edge surface of the edge surfaces. A dielectric is on the anode and a conductive polymer on said dielectric.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: June 22, 2021
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Christian L. Guerrero, John Joseph Ols
  • Patent number: 11037732
    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Geum Kim, Byeong Cheol Moon, Kun Hoi Koo, Jung Min Kim
  • Patent number: 11037731
    Abstract: A multi-layer ceramic electronic component includes a ceramic body enclosing internal electrodes laminated in a first direction, wherein the ceramic body has a main surface having a flat face normal to the first direction, a first side surface having a flat face normal to a second direction orthogonal to the first direction, and a rounded ridge connecting the main surface and the first side surface to each other and curved in a convex shape; a maximum dimension of the ceramic body in the first direction is 120 ?m or less; and the rounded ridge satisfies a condition of Rb/Ra>3.0, where Ra represents a dimension of the rounded ridge in the first direction and Rb represents a dimension of the rounded ridge in the second direction on a cross-sectional surface of the ceramic body taken along a virtual cut plane parallel to the first direction and the second direction.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: June 15, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasutomo Suga, Shota Yajima
  • Patent number: 11037727
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Woo Chul Shin, Seung Heui Lee, Beom Seock Oh
  • Patent number: 11024467
    Abstract: A self-charging supercapacitor is provided which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode. The supercapacitor first electrode and the supercapacitor second electrode are parallel to and spaced apart from each other. A part of the metal electrode is Ohmic contacted with a surface of the supercapacitor second electrode, and another part of the metal electrode is disposed opposite to the supercapacitor first electrode.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: June 1, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhi-Ling Luo, Chang-Hong Liu, Shou-Shan Fan
  • Patent number: 11024466
    Abstract: A self-charging supercapacitor is provided which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode. The supercapacitor first electrode and the supercapacitor second electrode are parallel to and spaced apart front each other. The metal electrode and the supercapacitor second electrode form an Ohmic contact, the metal electrode is spaced apart from and opposite to the supercapacitor first electrode.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: June 1, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhi-Ling Luo, Chang-Hong Liu, Shou-Shan Fan
  • Patent number: 11024468
    Abstract: A method for charging self-charging supercapacitor includes: providing a self-charging supercapacitor which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode; the metal electrode and the supercapacitor second electrode form an Ohmic contact, the metal electrode is spaced apart from and opposite to the supercapacitor first electrode. Electrically connecting the metal electrode and the supercapacitor first electrode with a second electrolyte.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: June 1, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhi-Ling Luo, Chang-Hong Liu, Shou-Shan Fan
  • Patent number: 11017951
    Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and having first to sixth surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second connection terminals disposed on the first and second band portions on the first surface of the capacitor body. The first and second connection terminals are each provided with a solder receiving portion to have a symmetrical shape in a direction connecting the third and fourth surfaces and a direction connecting the fifth and sixth surfaces.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
  • Patent number: 11017947
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein concentrations of Mn, Si and B of a margin region are respectively higher than concentrations of Mn, Si and B of the dielectric layers, wherein a donor element concentration of the margin region is lower than a donor element concentration of the dielectric layers, wherein the margin region is at least one of an end margin region and a side margin region.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: May 25, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Noriyuki Chigira
  • Patent number: 11011307
    Abstract: An electronic component includes a laminate and an external electrode provided on an end surface of the laminate. The external electrode includes a Ni layer provided on the end surface, a Ni—Sn alloy layer provided on the Ni layer, and a resin layer that is provided on the Ni—Sn alloy layer and includes metal grains including Sn grains. The Ni layer and the Ni—Sn alloy layer reduce or prevent intrusion of moisture from the external electrode into an interior of the laminate, and the resin layer reduces or prevents generation of cracks when a bending stress is applied to the external electrode.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: May 18, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshihiro Harada
  • Patent number: 11004608
    Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body configured by stacking a plurality of dielectric layers and configured by stacking a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween and first and second external electrodes disposed on opposing end portions of the ceramic body, and a pair of substrates spaced apart from a lower portion of the multilayer ceramic capacitor and each including, on opposing end portions, first terminal electrodes connected to the first external electrode and second terminal electrodes connected to the second external electrode.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
  • Patent number: 11004611
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Patent number: 10991518
    Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 27, 2021
    Assignee: GranBlueTech, L.L.C.
    Inventor: John P. Snyder
  • Patent number: 10991512
    Abstract: A capacitor component includes a lamination portion in which first and second internal electrodes are disposed to face each other in a first direction and separated from each other by a dielectric layer, and a body comprising the lamination portion and first and second connection portions disposed on both sides of the lamination portion in a second direction, perpendicular to the first direction, and connected to the first and second internal electrodes. The first and second connection portions each include a metal layer including nickel and disposed on the lamination portion and a ceramic layer disposed on the metal layer, and an average thickness of each of the first and second internal electrodes is 0.4 ?m or less.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: April 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Soo Park, Yong Park, Ki Pyo Hong, Jong Ho Lee
  • Patent number: 10991509
    Abstract: A capacitor is provided that includes a base having a first main surface and a second main surface opposing each other with a trench formed on a side of the first main surface (110A. Moreover, a dielectric film is disposed in a region that includes an inside of the trench on the side of the first main surface of the base; a conductor film is provided that includes a first conductor layer disposed on the dielectric film, which is the region including the inside of the trench and a second conductor layer disposed on the first conductor layer; and a stress relieving portion is provided in contact with at least a part of the end of the first conductor layer. Moreover, a thickness of the stress relieving portion is smaller than a thickness of the conductor film, outside the trench portion of the first main surface of the base.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 27, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Nakagawa, Tomoyuki Ashimine, Yasuhiro Murase