Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

Abstract: A capacitor circuit (capacitor device 20, 30, 34, 50) in which a plurality of capacitors (41 to 45) are connected to each other is included, one or two or more capacitors (overvoltage short-circuiting capacitors 40, 40a, 40b, 40c, 40d) in the capacitor circuit have a dielectric breakdown voltage made lower than that of another capacitor, and the one or two or more capacitors having the lower dielectric breakdown voltage are subjected to dielectric breakdown due to application of an overvoltage earlier than the other capacitor so that the capacitor circuit is short-circuited. As a result, the safety of the capacitor device and a device connected thereto can be enhanced.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component including a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and first and second external electrodes respectively electrically connected to the first and second internal electrodes, disposed in an outer portion of the ceramic body. The first and second external electrodes include a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn). A ratio (t1/t2) between a thickness (t1) of the first plating layer including nickel (Ni) and a thickness (t2) of the second plating layer including tin (Sn) is within a range from 1.0 to 9.0.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: a relationship “M??0.00002×EM+0.0012” is satisfied, when a length of end margins in a direction in which the two end faces face with each other is EM [?m] and a ratio of Mo [atm %] to a B site element [atm %] of a main component ceramic in the end margins is M, wherein the end margin is a region, in which internal electrode layers connected to one of the external electrodes without sandwiching internal electrode layers connected to the other of the external electrode, face with each other, in the multilayer chip.

Abstract: An upper mold for MLCC lamination comprising: a vacuum head comprising a first area formed by a plurality of base holes, which communicate with an air channel formed on the upper surface, and by through-holes that connect the lower surface and respective base holes so as to communicate with each other such that air flows between the base holes and the lower surface, the first area having a predetermined area, and the vacuum head comprising a second area configured, thereby suctioning air; a mesh plate fixed to the lower surface of the vacuum head to have a size corresponding to that of the first area, the mesh plate having a porous structure such that, when air flows through the through-holes of the first area, suction and discharge can occur evenly; and a contact plate fixed to the lower surface of the vacuum head by adhesion of the second area.

Abstract: Devices which internally control and regulate voltage of a super-capacitor cell or stack thereof during charge-discharge cycles, methods for controlling and regulating voltage of a super-capacitor cell or stack thereof with these devices and methods for production of the devices are provided.

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.

Abstract: A capacitor component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes stacked opposingly in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The second surface includes a plurality of convex portions spaced apart from each other.

Abstract: A solid electrolytic capacitor including: a capacitor element including an anode part provided on a first end side, and a cathode part provided on a second end side opposite the first end, so as to be adjacent to the anode part; and a cathode lead connected to the cathode part. The capacitor element has, on a surface of the cathode part, either one or both of a first protective layer and a second protective layer, the first protective layer being electrically insulating and provided on the first end side, the second protective layer being electrically insulating and provided on the second end side. The cathode part and the cathode lead are connected to each other via an electrically conductive adhesive layer.

Abstract: A multi-layer ceramic capacitor includes: a ceramic body including first and second end surfaces, first and second side surfaces, first internal electrodes drawn to the first and second end surfaces, second internal electrodes drawn to at least one of the first side surface and the second side surface, and dielectric layers, the first and second internal electrodes being alternately laminated via the dielectric layers; first and second external electrodes that respectively cover the first and second end surfaces, and extend to each of the first and second side surfaces; a third external electrode including a first side-surface region formed on the first side surface and a second side-surface region formed on the second side surface, the first side-surface region and the second side-surface region being formed to be mutually shifted along the first direction and at least partially facing each other in the second direction.

Abstract: A thin film capacitor comprises a first electrode, a second electrode, and a dielectric substance disposed between the first electrode 10 and the second electrode. The second electrode has a first metallic layer, an intermediate layer, and a second metallic layer in sequence in this order from the side of the dielectric substance. The first metallic layer contains a metal element M1 as a main component, and the second metallic layer contains a metal element M2 different from the metal element M1 as a main component. The intermediate layer has one or more laminate structures each having a second metal sublayer containing the metal element M2 as a main component and a first metal sublayer containing the metal element M1 as a main component in sequence from the side of the first metallic layer toward the side of the second metallic layer.

Abstract: An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.

Abstract: A conductive powder for an internal electrode includes a metal particle and a graphene oxide disposed on at least a portion of a surface of the metal particle. A content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle.

Abstract: A multilayer ceramic electronic component includes a laminated body. External electrodes are provided on both end surfaces of the laminated body. The external electrodes include a base electrode layer, a conductive resin layer disposed on the base electrode layer, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a first layer located on the base electrode layer, a second layer located on the first layer, and a third layer located on the second layer. A void volume of the first layer and the third layer calculated by a predetermined equation is about 10 vol % or less, and a void volume of the second layer is about 16 vol % or more, and thicknesses of the first layer, the second layer, and the third layer satisfy predetermined conditions.

Abstract: A multilayer ceramic electronic component includes a laminate, a first external electrode on a first end surface of the laminate, and a second external electrode on a second end surface of the laminate. The laminate includes a central layer portion in which each first internal electrode layer and each second internal electrode layer oppose each other with a dielectric ceramic layer therebetween, peripheral layer portions sandwiching the central layer portion in a lamination direction, and side margins sandwiching the central layer portion and the peripheral layer portions in a width direction. The side margins each include an inner layer disposed closest to the laminate, an outer layer disposed farthest from the laminate, and a buffer layer disposed between the inner layer and the outer layer.

Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

Abstract: The present invention relates in part to a method of fabricating graphene structures from graphene oxide by reducing the graphene oxide on a patterned substrate. The invention also relates in part to graphene structures produced using said method and electrodes and capacitors comprising said graphene structures.

Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes; and first and second external electrodes, wherein the first and second external electrodes include first and second base electrode layers being at least partially in contact with the first and second external surfaces of the ceramic body, first and second nickel plating layers disposed to cover the first and second base electrode layers, and first and second tin plating layers disposed to cover the first and second nickel plating layers, respectively, and wherein a thickness of a center portion of each of the first and second tin plating layers exceeds 5 ?m.