Abstract: A wet electrolytic capacitor that contains a cathode, fluidic working electrolyte, and anode that includes a sintered porous pellet is provided. A dielectric layer is also formed on a surface of the pellet and within its pores through anodic oxidation. The present inventors have discovered that through selective control over the anodic oxidation process, a substantially amorphous, low crystalline dielectric layer can be formed which, among other things, exhibits a leakage current that is smaller than previously thought possible for the high voltage capacitors employed in implantable medical devices.

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.

Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.

Abstract: An electrolytic capacitor includes a capacitor element and an electrolyte solution. The capacitor element includes an anode foil, a cathode foil opposite to the anode foil, and a conductive polymer layer disposed between the anode foil and the cathode foil. A dielectric layer is formed on the anode foil. An inorganic layer is formed on the cathode foil. The conductive polymer layer includes a conductive polymer. The inorganic layer has a surface having projections and recesses. The projections form a region where the inorganic layer is in contact with the conductive polymer layer and the recesses form a region where the inorganic layer is not in contact with the conductive polymer layer. A proportion of water in the electrolyte solution ranges from 0.1% by mass to 6.0% by mass, inclusive.

Abstract: A stacked capacitor includes a laminate; first to fourth external electrodes; a first capacitor portion, a second capacitor portion, and a third capacitor portion which are arrayed in the laminate from a first surface toward a second surface along a laminating direction. The first capacitor portion and the third capacitor portion each have a capacitance larger than that of the second capacitor portion. Inductor components of the first capacitor portion and the third capacitor portion are different in physical length from each other and are connected in parallel between the first external electrode disposed on a first end surface and the third external electrode disposed on a first side surface and between the first external electrode and the fourth external electrode disposed on a second side surface.

Abstract: A lithium composite negative electrode which allows a hybrid capacitor to operate at room temperature by reducing interfacial resistance in the electrode, a hybrid capacitor comprising the composite negative electrode, and manufacturing methods thereof. The lithium composite negative electrode is a laminar electrode including a lithium ion conductive solid electrolyte, an alginate gel electrolyte, and lithium-doped carbon. Further, a hybrid capacitor includes a positive electrode including a carbon material and/or a metal oxide, the lithium composite negative electrode, and a neutral aqueous electrolyte filled between the positive electrode and the lithium composite negative electrode. The lithium composite negative electrode is configured as a laminar electrode including the lithium ion conductive solid electrolyte, the alginate gel electrolyte, and the lithium-doped carbon.

Abstract: A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components.

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.

Abstract: A capacitor includes a capacitor element group, a first bus bar, a second bus bar, a case, a filling resin, and a temperature detection element. The capacitor element group includes a plurality of capacitor elements. The first and second bus bars are connected to electrodes of the plurality of capacitor elements. The case accommodates a capacitor unit in which the capacitor element group is connected to the first and second bus bars. The case is filled with the filling resin, and the filling resin is cured in the case. The first bus bar includes a contact region that is in contact with at least one capacitor element in the plurality of capacitor elements at a side close to an aperture of the case, the at least one capacitor element being positioned at a center of the capacitor element group. The temperature detection element is disposed on the contact region.

Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.

Abstract: A multilayer capacitor in which acoustic noise is reduced has an area of overlap between internal electrodes in an active region of a lower portion of a capacitor body that is smaller than an area of overlap between internal electrodes in an active region of an upper portion of the capacitor body. The multilayer capacitor can be bonded to a board by relatively small solders such that the lower portion is adjacent the board. Deviations between areas of overlap of adjacent internal electrodes in the upper and lower portions of the active region are minimized to reduce piezoelectric deformation of the capacitor body.

Abstract: A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.

Abstract: A capacitor assembly that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a pre-coat layer that overlies the dielectric and is formed from an organometallic compound. A solid electrolyte overlies the pre-coat layer that contains an inner layer and an outer layer, wherein the inner layer is formed from an in situ-polymerized conductive polymer and the outer layer is formed from pre-polymerized conductive polymer particles.

Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

Abstract: An electrolytic capacitor includes a capacitor element; a bottomed case that houses the capacitor element; a sealing member that seals an opening of the bottomed case; a tab terminal connected to the capacitor element and penetrating through the sealing member; and a resin layer that covers at least part of a main surface of the sealing member, the main surface being disposed outside the bottomed case. The tab terminal includes a first portion containing a first metal and a second portion containing a second metal. The resin layer is in contact with the first portion and the second portion. Linear expansion coefficient ?1 of the first metal, linear expansion coefficient ?2 of the second metal, and linear expansion coefficient ?r of the resin layer satisfy a relation of ?1<?r<?2 or ?r<?1<?2.

Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.