Abstract: A method for terminating remote control over a washing machine wherein when shutdown control over the washing machine is triggered, the washing machine sends an instruction to terminate a channel between the washing machine and a mobile terminal connected with the washing machine, and shuts down. The shutdown control is triggered in a short-range or remote manner. By this method a termination instruction is sent before the washing machine shuts down to terminate a channel between the washing machine and the mobile terminal, it is ensured that the channel between the washing machine and a mobile terminal has already been cut off before the washing machine shuts down, such that the washing machine is no longer controlled by the mobile terminal connected with the washing machine the last time when being turned on next time, for improving security of washing machine control.

Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.

Abstract: Provided are a method performed by an appliance for washing and rinsing goods, where some of the goods loaded into the appliance are sensitive to process water temperature changes, and an appliance performing the method. The method may include receiving via a user interface, an instruction that an appliance, during execution of a general-type washing program, should take into account that goods sensitive to temperature changes are loaded into the appliance, measuring a temperature value in a washing compartment of the appliance upon executing a draining process, and supplying fresh water to the washing compartment of the appliance. The method may include measuring, when the fresh water has been supplied, whether the process water being accommodated in a sump of the appliance is at a target temperature value or not and if not adjusting the temperature of the process water in the sump to attain the target temperature value.

Abstract: A denuder, such as a bone stock denuder container, is disclosed. The denuder includes a nozzle and a container body. The nozzle is configured to be fluidically coupled to a source of fluid and to direct a fluid stream. The container body includes curved chamber wall that forms a wash chamber. The wash chamber is configured to receive a bone stock. The nozzle is configured to direct the fluid stream to impact the curved chamber wall.

Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

Abstract: A drill device for removing plugging in pipes, the drill device including: a drill bit for breaking plugging in pipes; a vertical control handle capable of controlling a vertical movement of the drill bit; a drill handle capable of controlling a rotational movement of the drill bit; a screw disposed coaxially with the drill bit; a drill shaft having a first portion surrounding the screw and a second portion to which the drill bit is fixed; and a guide shaft surrounding the first portion of the drill shaft. The vertical control handle and the drill handle are disposed on an extension line of the axis of the screw; the screw is vertically moved by rotations of the vertical control handle; and the guide shaft is rotated by rotations of the drill handle, and in conjunction therewith, the drill bit can be rotated.

Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

Abstract: A method for handling a clogging condition in a dishwasher may include detecting the clogging condition; upon detecting the clogging condition, interrupting a wash cycle of the dishwasher and executing a remedial operation to remove the clogging condition. The remedial operation may include executing a drain operation for a predetermined drain time during which a drain pump may be continuously or intermittently operated to drain water from a sump of the dishwasher; following the drain operation, executing a fill operation for a predetermined fill time during which a fill valve may be continuously or intermittently activated to add water to the dishwasher; and following the fill operation, executing a circulation operation during which a circulation pump may be continuously or intermittently operated to remove the clogging condition. A dishwasher and a control system for handling a clogging condition are also provided.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.

Abstract: Method and systems for managing clear-down are provided. The method can include generating a clear-down trigger associated with an ion mobility spectrometer and operating the ion mobility spectrometer in fast clear-down mode in response to the clear-down trigger. Methods and systems can further provide that where the ion mobility spectrometer operates in fast-switching mode, the ion mobility spectrometer alternating a plurality of times between operation according to a positive ion mode and operation according to a negative ion mode, and further operating according to the positive ion mode for less than about 1 second before switching to the operation according to the negative ion mode, and operating according to the negative ion mode for less than about 1 second before switching to the operation according to the positive ion mode.

Abstract: A machine tool chip removal device including a coupling interface to couple with a rotatable spindle of a machine tool to facilitate rotation of the machine tool chip removal device about an axis at a rotational speed. The chip removal device can also include a main fluid channel with an opening to receive pressurized fluid from the machine tool. The chip removal device can further include a first fluid delivery channel and a second fluid delivery channel to direct fluid in different directions. Each fluid delivery channel can be in fluid communication with the main fluid channel. In addition, the chip removal device can include one or more valves associated with the first and second fluid delivery channels to selectively allow fluid passage from the main fluid channel to the fluid delivery channels. The one or more valves can be actuated by varying fluid pressure and/or rotational speed.

Abstract: In a hydraulic circuit including a ball circulation pump skid, a single pump, and a set of valves in a manifold of the ball circulation pump skid, the pump and valves are operated to move all fluid in the hydraulic circuit alternately along two paths through an operative device and a ball collection capsule in the manifold, so that none of the balls ever enter the pump. The first path enables (a) ball-containing fluid flow from the operative device to the ball collection capsule and (b) ball-free fluid flow from the ball collection capsule to the exactly one pump and back to the manifold. The second path provides for (c) ball-free fluid flow from the pump to the ball collection capsule and (d) ball-entraining flow from the ball collection capsule to the operative device.

Abstract: An embodiment of the present subject matter including a FOUP body and a FOUP cover includes: a loading and unloading part configured to load or unload the FOUP; a standby part which is provided at one side of the loading and unloading part and on which the FOUP body and the FOUP cover are separated from or coupled to each other; a cleaning chamber configured to clean the FOUP body and the FOUP cover using steam; and a robot configured to transport the FOUP body and the FOUP cover between the standby part and the cleaning chamber.

Abstract: A conventional substrate processing apparatus for generating plasma cannot generate plasma with high density and thus throughput of substrate processing is low. In order to solve this problem, provided is a substrate processing apparatus including a reaction vessel having a tubular shape and provided with a coil installed at an outer circumference thereof; a cover installed at a first end of the reaction vessel; a gas introduction port installed at the cover; a first plate installed between the gas introduction port and an upper end of the coil; a second plate installed between the first plate and the upper end of the coil; a substrate processing chamber installed at a second end of the reaction vessel; and a gas exhaust part connected to the substrate processing chamber.

Abstract: An extreme ultraviolet (EUV) mask is received. The EUV mask has an EUV pellicle disposed thereover. The EUV pellicle is coupled to the EUV mask at least in part via glue that is disposed on the EUV mask. The EUV pellicle is removed, thereby exposing the glue. A localized glue-removal process is performed by targeting a region of the EUV mask on which the glue is disposed. The localized glue-removal process is performed without affecting other regions of the EUV mask that do not have the glue disposed thereon. The localized glue-removal process may include injecting a cleaning chemical onto the glue and removing a waste chemical produced by the cleaning chemical and the glue. The localized glue-removal process may also include a plasma process that applies plasma to the glue. The localized glue-removal process may further include a laser process that shoots a focused laser beam at the glue.

Abstract: A particle removal apparatus is provided. The particle removal apparatus includes a reticle holder configured to hold a reticle. The particle removal apparatus further includes a robotic arm. The particle removal apparatus also includes a particle removal device disposed on the robotic arm, and the particle removal device includes a solution spraying module. In addition, the robotic arm and the particle removal device are configured to align with a particle on a backside of the reticle, and the solution spraying module is configured to spray a solution onto the particle to remove the particle.

Abstract: A method for removing a coating including a rare earth silicate from a substrate including a ceramic or ceramic matrix composite may include contacting a coating comprising a rare earth silicate with a liquid comprising an active species. The active species may include at least one of a mineral acid or a base. The method also may include working the coating to cause removal of at least a portion of the coating.

Abstract: An apparatus for washing a set of objects. The apparatus includes a washing chamber and a ROX generator fluidically connected to the washing chamber via a fluid conduit having a distal end that terminates at the washing chamber. The ROX generator is configured to provide reactive oxidizers to a carrier liquid to form a cleaning liquid with ROX cleaning bubbles, wherein the cleaning liquid is transported through the fluid conduit and into the washing chamber.

Abstract: A substrate processing system includes multiple assemblies framed and including such that each of the assemblies includes a substrate processing apparatus which supplies a processing fluid to a substrate and processes the substrate, a fluid supply control apparatus including a fluid control device which controls flow of the processing fluid supplied to the substrate processing apparatus, and a drive equipment apparatus including a drive device which drives movement of the fluid control device in the fluid supply control apparatus.