Abstract: In plan view, a magnet plate (10) has a first magnetic domain (11) and a second magnetic domain (12), a magnetic domain boundary line (14) is inclined to an opening side (26) and is bent or curved, and the magnet plate has magnetic fields that are generated in a respective plurality of different directions.

Abstract: An organic light-emitting display apparatus including a substrate having a display area and a peripheral area outside the display area, a first insulating layer arranged over the substrate throughout the display area and the peripheral area, the first insulating layer including a first opening disposed in the peripheral area, a first electrode arranged over the first insulating layer in the display area, a pixel defining film arranged over the first insulating layer, the pixel defining film including a second opening exposing a portion of the first electrode and a third opening formed at the location of the first opening to form a common opening, an intermediate layer arranged over the first electrode, and a second electrode covering the intermediate layer, the pixel defining film, at least a portion of the third opening, and at least a portion of the first opening.

Abstract: The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.

Abstract: A sensor for an integrated circuit (IC) structure is disclosed. The sensor includes a sensor layer in a layer of the IC structure, the sensor layer including: a first conductive structure disposed proximate a perimeter of the IC structure; and a second conductive structure disposed parallel to the first conductive structure and proximate the perimeter of the IC structure. The sensor also includes a set of interdigitating conductive elements including a first plurality of conductive elements electrically coupled to the first conductive structure interdigitating with a second plurality of conductive elements electrically coupled to the second conductive structure.

Abstract: An object of the invention is to provide a flow rate control valve assembly capable of preventing a flow rate from varying in a direction opposite to the desired direction upon flow rate control As shown in FIG. 1, the flow rate control valve assembly comprises a sliding shaft and a sliding cylindrical surface which fit slidably in with each other in an axial direction, and a moving mechanism for moving the sliding shaft in an axial direction. At least one of the sliding surface of the sliding shaft and the sliding cylindrical surface is provided with one or a plurality of tapered grooves having its specific area defining a fluid passage. The tapered groove is configured such that flow passage resistance increases or decreases gradually along a lengthwise direction, and a cavity formed at an end of the sliding shaft for making sure of a sliding area is formed at a site isolated or shut off from the fluid passage.

Abstract: Provided is a film forming method to minimize decreases in the electrical resistance of an oxide semiconductor film even when a fluorinated silicon nitride film is formed directly on the oxide semiconductor film. The film forming method includes: a surface treatment process in which a substance including an oxide semiconductor film on a substrate is prepared, plasma is generated using a mixed gas of oxygen and hydrogen which contains hydrogen at a rate of 8% or less (not including 0), and plasma is used to treat surface of oxide semiconductor film; a film formation process in which a fluorinated silicon nitride film (a SiN:F film) is subsequently forming on oxide semiconductor film by a plasma CVD method in which plasma is generated using a raw material gas containing silicon tetrafluoride gas and nitrogen gas; and an annealing process in which substrate and film thereon are subsequently heated.

Abstract: Disclosed herein are a display panel capable of reducing the amount of reflected light in a non-display area where an alignment key is disposed, and a display device employing the same. The display panel includes a substrate having a display area and a non-display area, an alignment key disposed on a first surface of the substrate, and a planarization layer disposed on the first surface of the substrate and having a via hole above the alignment key. The display panel also includes a first shielding layer disposed on a second surface of the substrate opposite the first surface and having a first opening hole overlapping with the alignment key in plan view, and a second shielding layer disposed on the planarization layer.

Abstract: The present invention relates to the doping of organic semiconductors and processes for producing layers of p-doped organic semiconductors. Disclosed is a process for p-doping organic semiconductors comprising treating the organic semiconductor with an oxidized salt of the organic semiconductor. A process for producing a layer of a p-doped organic semiconductor comprising producing a p-doped organic semiconductor by treating the organic semiconductor with an oxidized salt of the organic semiconductor; disposing a composition comprising a solvent and the p-doped organic semiconductor on a substrate; and removing the solvent is also described. Also disclosed is a process for producing a layer of a p-doped organic semiconductor comprising: disposing a composition comprising a solvent, the organic semiconductor and a protic ionic liquid on a substrate; and removing the solvent.

Abstract: A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure.

Abstract: The electronic device module includes a sealing part sealing an electronic component therein, and an external connection terminal disposed on one surface of the sealing part. The electronic device module also includes a dummy bonding part configured on a surface of the sealing part and spaced apart from the external connection terminal.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor substrate including a conductive pad disposed thereon; disposing a polymeric material over the semiconductor substrate and the conductive pad; patterning the polymeric material to form an opening exposing at least a portion of the conductive pad; disposing a conductive layer over the polymeric material and the portion of the conductive pad; and forming a conductor over the portion of the conductive pad and within the opening.

Abstract: Disclosed is a display device that may include a thin film transistor array substrate that includes a plurality of first sub-pixels and a plurality of second sub-pixels, wherein one of the plurality of first sub-pixels includes a first emission region and a first non-emission region, and one of the plurality of second sub-pixels includes a second emission region and a second non-emission region; a first bank pattern in the first and second non-emission regions, the first bank pattern including a hydrophilic material; and a second bank pattern on an upper surface of the first bank pattern, the second bank pattern includes a hydrophobic material.

Abstract: An organic light-emitting apparatus includes a substrate including an active area, a dead area, and a pad area, a display unit disposed in the active area and including thin-film transistors, pixel electrodes, and a portion of a common electrode, a first voltage supply unit disposed on the dead and pad areas and electrically contacting the common electrode, a second voltage supply unit overlapping the common electrode, and spaced apart and electrically insulated therefrom, and an insulating layer disposed between the common electrode and the second voltage supply unit, in which a portion of the common electrode that overlaps the first voltage supply unit is closer to the pad area than that of a portion of the common electrode that overlaps the second voltage supply unit, and an end portion of the insulating layer contacts an end portion of the first voltage supply unit adjacent to the active area.

Abstract: A thin film transistor array panel according to an exemplary embodiment of the present invention includes: an insulating substrate; a polycrystal semiconductor layer formed on the insulating substrate; a buffer layer formed below the polycrystal semiconductor layer and containing fluorine; a gate electrode overlapping the polycrystal semiconductor layer; a source electrode and a drain electrode overlapping the polycrystal semiconductor layer and separated from each other; and a pixel electrode electrically connected to the drain electrode.

Abstract: A device and method of making such a device that includes a flexible OLED layer comprising a light emitting side and a self-oscillating layer disposed on the light emitting side of the flexible OLED layer. The self-oscillating layer comprises an elastic polymer matrix containing a photo-responsive element and independently self-oscillating gel islands. The photo-responsive element in the elastic polymer matrix causes synchronization of the independently self-oscillating polymer gel islands in response to light emitted from the flexible OLED layer.

Abstract: The present disclosure relates to a semiconductor device with multiple heterojunction bipolar transistors (HBTs) that have different emitter ballast resistances. The disclosed semiconductor device includes a substrate, a first HBT and a second HBT formed over the substrate. The first HBT includes a first collector, a first base over the first collector, a first emitter over the first base, and a first cap structure over the first emitter. The second HBT includes a second collector, a second base over the second collector, a second emitter over the second base, and a second cap structure over the second emitter. Herein, the first cap structure is different from the second cap structure, such that a first emitter ballast resistance from the first cap structure is at least 1.5 times greater than a second emitter ballast resistance from the second cap structure.

Abstract: An organic light emitting diode including a structure of a flexible printed circuit board installed on a substrate is provided.

Abstract: A display device includes pixels, each pixel including a first electrode, a first organic layer disposed on the first electrode, and a second electrode disposed on the first organic layer, in which the first electrode includes a first overlapping electrode portion overlapping each of the first organic layer and the second electrode, and a first non-overlapping electrode portion not overlapping the first organic layer and the second electrode, and connected to the first overlapping electrode portion.

Abstract: A display panel includes a substrate, a plurality of first electrode series, a plurality of first electrode series and a plurality of conducting wires. The substrate is divided into a first display area and a second display area. The first display area and the second display area are respectively divided into light emitting zones and interval zones. The first electrode series are disposed in the first display area and the second display area. The second electrode series are disposed in the first display area and the second display area. Each first electrode series extends along a first direction. Each second electrode series extends along a second direction. The connection portion of each first electrode series extends into the interval zone of the first display area. The conducting wires are respectively coupled to the second electrode series in the first display area.