Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.

Abstract: A cooler for use in a computer or server is disclosed to include a holder frame, which has a plurality of wind holes and a rail extended along one long side of the flat elongated frame base thereof, and a fan module, which includes a rack with a sliding groove coupled to the holder frame and movable along the rail to one of a series of positions corresponding to the wind holes, a fan, and a locating frame holding the fan and insertable into the rack.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Abstract: A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

Abstract: An apparatus and method for cooling semiconductor devices. A cooling system for semiconductor devices is disclosed and includes a semiconductor substrate, horizontal channels and a cooling medium. Specifically, the semiconductor substrate is incorporated into a die. Also, one or more horizontal channels are formed in a backside of the semiconductor substrate of the die. The horizontal channels collect thermal energy that is generated by electrical components located on a front side of the semiconductor substrate. A cooling medium circulates within the one or more horizontal channels for transferring the thermal energy away from the die.

Abstract: A frame of a heat sink for a CPU in a computer includes a quadrilateral frame member and four stop plates. One of two opposite sides of the quadrilateral frame member has an opening block step with a length being equal to the width of the heat sink and the bottom of the block step is the same elevation as the top of the second side. The distance between two of the stop plates, which are disposed at both ends of the first side, is equal to the length of the first side. A reinforcing rib is disposed between another two of the stop plates, which are disposed at both ends of the second side, and is parallel to the second side with an elevation higher than the top of the second side and a distance between the inner surface of the reinforcing rib and the block step is equal to the depth of the heat sink for increasing strength and rigidity of the frame against deformation and preventing the heat sink from swaying.

Abstract: A fan module for use in a computer or server is disclosed to include a rack, which defines a holding chamber and has a plurality of guiding grooves symmetrically disposed at two sides inside the holding chamber, and a plurality of locating plates insertable into the rack at different elevations to carry a respective fan in the holding chamber, each locating plate having two guiding portions symmetrically disposed at two sides and insertable into two sliding grooves at same elevation inside the rack without the use of any tool.

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract: The invention relates to a cooling system for equipment and network cabinets and to a method for cooling such cabinets, together with the electronic modules located therein. In order to achieve with extremely simple means and particularly low capital and operating expenditure a high power cooling for densely packed cabinets and cabinet arrangements, particularly server cabinets in data processing centers and the like, an air ducting is provided in a substantially airtight cabinet with equally long airflow paths and therefore equal flow resistances, together with a uniform supply air temperature. The circulated airflow is cooled with the aid of an air-water heat exchanger in the lower cabinet area. The heated exhaust air is collected in a collecting duct with a rising flow, reversed and supplied in a falling flow to the heat exchanger.

Abstract: A liquid cooling system, enabling protection from corrosion due to liquid coolant for a long time-period (5–10 years) while cooling a heat-generation body effectively, comprises a pump 108, a heat-receiving jacket 107, a radiator for radiating heat into an outside, being made up with a heat-radiation pipe 201 and a heat-radiation plate 202, and further a tank 203 for accumulating the liquid coolant 209 within an inside thereof, wherein those are connected in a closed-loop, so as to circulating the cooling liquid therein, thereby cooling the heat-generation of a CPU 106, being a heat-generation element, effectively, through the heat-receiving jacket 107, and further a water-permeable bag 204 is disposed in a portion of flow path of the cooling liquid, which receives microcapsules 10 therein, each enclosing in an inside thereof anti-corrosion agent 20 for suppressing the corrosion due to the cooling liquid, including such as, a water, etc.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A distributor is provided for selectively connecting with a plurality of voltage sources a plurality of electrical load devices, such as the sensors or actuators of an electrical and mechanical installation. A pair of voltage supply connectors mounted on a housing include first pins that are connected to continuously supply power from a first voltage source to the internal electronics circuitry of the distributor, and second pins that are connected via a jumper switch to selectively connect a second voltage source with the groups of electrical load devices.

Abstract: A heat dissipation device (30) includes a heat dissipation member (31), a positioning member (33) and a mating member (34). The heat dissipation member includes a fin set (311) and a post (312) in the fin set. The post extends through the positioning member and is mated with the mating member so that the positioning member is positioned between the fin set and the mating member.

Abstract: A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.

Abstract: A memory heat-dissipating device embodying two heat-conducting films, two heatsinks and two clip members, wherein the two heatsinks mutually clip together, and which thereby forms a space between inner side surfaces of the heatsinks that proffers a memory to be disposed and contained therein. Furthermore, the heat-conducting films are separately attached and so configured to an inner side surface of each of two heatsinks. Inverted U-shaped clip brace portions, center of which are open-mouthed, are configured as protrusions on each outer side surface of fins of each of the heatsinks respectively, in addition, an inwardly press-folded anti-dust strip is configured between clip support mounts configured on top edges of two sides of the heatsinks, and which are utilized to prevent dust and impurities from penetrating the heatsinks, thereby influence on effectiveness of the memory and the heatsinks is avoided.

Abstract: A distributor is provided for selectively connecting with a voltage source a plurality of electrical load devices, such as the sensors or actuators of an electrical and mechanical installation, characterized by the provision of an illuminating field that illuminates the addressing switches and/or the changeover switches of the distributor.

Abstract: A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base so as to increase a contact area for transmitting heat and therefore improve a heat dissipation efficiency thereof. The heat fins includes at least one upper heat fin and at least one lower heat fin to couple to the L-shaped heat pipe via a round opening and a long opening respectively. The heat dissipation device therefore reduces a volume thereof and save an occupation space in an electrical device.

Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.

Abstract: A locking device for mounting a heat dissipating device to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and a retainer. The back plate includes a plurality of posts extending upwardly through the circuit board and engaging with screws thereat. The retainer includes a mounting section attached to the heat dissipating device and a plurality of spring locking sections extending radially from the mounting section. The locking sections are downwardly pressable to engage with the respective posts and screws whereby the retainer mounts the heat dissipating device to the electronic component.