Abstract: A modular power distribution system is provided for distributing power within an equipment rack. One particular power distribution system has a control unit that is mounted proximate a rack including a power input for receiving power from a power source located outside the rack. The control unit includes a power converter for converting the received power to an output electrical power, and a plurality of power outlets for providing an electrical connection to the control unit and outputting the output electrical power. This particular power distribution system also includes an extension means mounted proximate the rack and having an electrical power input for input of electrical power to the extension means and a plurality of power outlets adapted to couple with and distribute electrical power to conducting elements that electrically connect the extension means to the mounted equipment.

Abstract: An apparatus for enhancing heat transfer efficiency of an endothermic/exothermic article includes a heat sink disposed on the endothermic/exothermic article to enhance heat transmission, a plurality of fins formed on the heat sink to enhance heat exchange, and a porous medium disposed on the fins to increase cooling efficiency of the endothermic/exothermic article by air flowing between gaps between the fins and the porous medium.

Abstract: A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections.

Abstract: A ventilation system for electrical or electronic equipment installed in an enclosure of a box having an air inlet and an air outlet for establishing a flow of air through said enclosure, the ventilation system having at least two air suction sources, namely a primary source and a secondary source, and a chest for mounting on said box beside the air outlet, said chest defining at least two separate cavities, both for connection to the air outlet, namely a primary cavity connected to the primary source, and a secondary cavity connected to the secondary source, in such a manner as to create two separate air exhaust circuits from the outlet of the enclosure.

Abstract: An adjustable riser assembly for retrofitting an existing panel board enclosure with a replacement interior has a pair of base members secured to the rear wall of the enclosure with base flanges projecting forward. A floating member has end pieces with floating flanges that overlap and are joined to the base flanges by fasteners that engage selected ones of a second set of holes in each floating flange aligned along a first linear axis and a first set of holes in each base flange arranged in two rows each parallel to a second linear axis that is oblique to the first linear axis to adjust the height of the riser assembly. One or two planar members extending between the end pieces have a fourth set of holes that can be selectively aligned with a third set of holes in the end pieces for engagement by second fasteners to adjust the length of the riser assembly.

Abstract: The present invention is based on the theory of forced air convection. In a hermetically sealed access point/computer, by placing a blowing fan perpendicular to the hot elements of the computer and thereby circulating the air around the housing of the computer the present invention speeds the rate of heat transfer from within the housing to the outside of the housing, thereby reducing the heat that the hardware of a computer has to endure within the housing.

Abstract: A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.

Abstract: Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanless high-efficiency cooling device using ion wind comprises a heat sink having a fixing part fixedly attached to a heat-generating part of an electronic product and a plurality of protrusions extending a predetermined height from a bottom surface of the fixing part, a cover that covers the upper part of the heat sink, at least one electric wire for generating ion wind between the corresponding protrusions when high voltage is applied to the electric wire, an electric wire-supporting member that supports both ends of the electric wire, and a power supply that connects a high-voltage terminal to the electric wire and connects a ground terminal to the heat sink to supply high voltage to the electric wire.

Abstract: A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.

Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A socket power supply control structure is controlled by a controller in three stages, e.g. “power on,” “power off”, and “power source disconnected”. By so, unauthorized use of outlet supplying power for working various electrical appliances such as television computer, and microwave oven, by innocent children can be effectively avoided so as to protect their health of eyes and electric safety.

Abstract: An apparatus and method for cooling semiconductor devices. A cooling system for semiconductor devices is disclosed and includes a semiconductor substrate, horizontal channels and a cooling medium. Specifically, the semiconductor substrate is incorporated into a die. Also, one or more horizontal channels are formed in a backside of the semiconductor substrate of the die. The horizontal channels collect thermal energy that is generated by electrical components located on a front side of the semiconductor substrate. A cooling medium circulates within the one or more horizontal channels for transferring the thermal energy away from the die.

Abstract: A collective and restrictive inhalant and radiating device for appliances includes a heat inhaler in a CPU of a computer or other electric appliances, a first heat radiation block connected to the heat inhaler by a pair of first thermic pipes, a second heat radiation block engaged with the left side of the first heat radiation block having a TE modules on left side and an inlaid concave in underside engaged on a horizontal portion of a U-shaped condensation inhaler, a third heat radiation block connected to a fourth heat radiation block by a pair of second thermic pipe and disposed in the condensation inhaler and engaged with a heating surface of the TE modules. Each of the heat radiation blocks has an electric fan on the top or on a lateral side for blowing in or exhausting out the hot air from the blocks.

Abstract: A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A heat producing, fluid cooled assembly that includes a housing made of liquid-impermeable material, which defines a fluid inlet and a fluid outlet and an opening. Also included is an electrical package having a set of semiconductor electrical devices supported on a substrate and the second major surface is a heat sink adapted to express heat generated from the electrical apparatus and wherein the second major surface defines a rim that is fit to the opening. Further, the housing is constructed so that as fluid travels from the fluid inlet to the fluid outlet it is constrained to flow past the opening thereby placing the fluid in contact with the heat sink.

Abstract: A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A cooling system for dissipating heat from a component is disclosed. The cooling system includes a cooling device that includes a core and a plurality of spaced apart fins connected with the core with each fin including at least two vanes. A trailing edge of the fins define a chamber. A fan mount is connected with the vanes and supports a stator of a fan. A rotor connected with the stator includes a plurality of fan blades and the fan mount positions the stator over the chamber with the fan blades submerged in the chamber. A height of the cooling system is reduced because the fan does not include a housing and a substantial portion of the fan is positioned in the chamber. The submerged position of the fan blades allows for a high fan capacity with reduce air shock noise.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.