Abstract: A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the heat-in sections of the plural heat pipes arranged in parallel, and a large number of radiating fins crossing over the heat pipes are fitted to the heat-out sections of the heat pipes protruding from the block.

Abstract: A removable modular housing for providing and maintaining electromagnetic shielding, produceability and servicability of circuits producing and sensitive to RF energy.

Abstract: The invention relates to a fastener assembly for use in attaching articles to printed circuit boards, and include a fastener, which has a generally tubular body, flanged at one end, is adapted to receive a screw. The fastener has a polygonal cross-section over a portion of its length. The flange which is located at one end of the tubular body, has an integral spring washer and includes indentations which allow solder to flow from one side of the printed circuit board to the other. The fastener with its integral spring washer provides improved clamping characteristics and avoids problems associated with large coefficients of thermal expansion of printed circuit board material in a direction perpendicular to the board.

Abstract: An enclosed, electronic system has a plurality of lower power-dissipating electronic components mounted on a chassis. The components are positioned adjacent each other to form low volume fluid ducts therebetween. A low volume fluid duct is formed between one side of the plurality and one end enclosure of the system. At least one higher power-dissipating electronc component is also mounted on the chassis, forming a high volume fluid duct between one of its sides and one side of the last of the lower power-dissipating electronic components, and a high volume fluid duct also formed between the other side of the higher power-dissipating electronic component and the other end enclosure. Air is caused to blow through the low volume fluid duct and then to be exhausted through the high volume fluid ducts. The rate of air flow through the high volume ducts is one half of the minimum required to cool the higher power-dissipating component.

Abstract: A semiconductor chip carrier and contact array package having an apertured dielectric bottom layer (11), one or more chip connection layers such as wire bond layers (16, 17) insulated from one another, at least one chip-holding recess (24) in the wire bond layers and a heat conductive copper heat sink insert (26) extending across the aperture of the dielectric layer and forming a base adapted to be in heat-conductive contact with the bottom of an integrated circuit chip (27) to be attached thereon whereby heat flux generated by the chip is quickly and efficiently removed from the chip body. The wire bond layers (16, 17) contains metallization patterns (29) for bonding to the chip and a grid array of contacts or connection pins (20) connected to plated through-holes in the wire bond layer(s) for plugging the carrier to a circuit board or the like.

Abstract: The subject invention relates to an integrated electronic assembly comprising a power supply and as associated electronics unit powered thereby. The integral power supply housing is pivotal with respect to the electronics unit housing. Protruding from the power supply is a plug (pair of prongs) for insertion directly into a standard electrical outlet to permit the entire assembly to be physically supported thereby. A detent is provided for holding the power supply at predetermined orientations with respect to the electronics unit. Electrical connections are maintained between the power supply and the electronics unit while they are pivoted at various orientations with respect to each other.

Abstract: An electrical enclosure including a box and a cover is molded largely of plastic, but is intended for use with metallic conduit. One or more metallic inserts is molded within the box, and also another insert is molded within the cover, to provide ground continuity to all fully or partially contained wiring or control devices as well as to provide ground continuity to conduit leading into the box. The electrical enclosure optionally is explosion proof, requires a minimum of machining, provides means for the harmless run-off of all static electrical charges, and exposes a minimum of metallic surface area to the surrounding atmosphere which may contain metal degrading contaminants.

Abstract: A control device which contains parts that generate heat which comprises a box made of an aluminum die cast having radiator fins, and a cover plate that covers the open portion of the box. Cut-away portions are formed in the top surface and in the bottom surface of the box, and covers with or without windows are fitted to the cut-away portions, to permit construction of the control device in either a completely sealed form or shielded form housing.

Abstract: A terminal assembly for connecting a line cable to the bus conductor of a circuit interrupter or similar device by means of a locking screw that extends through the top wall of a metal lug component and clamps the inserted ends of the cable and bus conductor in overlapping relationship with each other and positive electrical contact with the bottom wall of the lug component. The bus conductor is held in slip-fitted interlocked position at the bottom of the lug component opening by the coaction of a pair of undercut grooves in the side walls of the lug component that accommodate the side edges of the bus conductor and cooperates with a coupling screw which extends through the bottom wall of the lug component and engages an unthreaded hole in the inserted end of the bus conductor.

Abstract: A package for housing a semiconductor wafer includes a case having a plurality of thermal conductive pads disposed on an inner surface thereof for supporting the wafer. A printed circuit board is equipped with a plurality of contact pins and further includes a plurality of electrically conductive plastic pads which engage contact pads on the wafer when the printed circuit board is disposed on the wafer. The remainder of the cavity within the case is filled with a sealant such as epoxy. If desired, additional electronic components may be positioned on the printed circuit board.

Abstract: A power control apparatus for distributing power to electrical loads. The apparatus contains in a casing a plurality of vertically arranged control units. In the casing, there are provided bus conductors for power source to feed electric power to each of the control units, a vertical control bus device comprising a plurality of control bus conductors each having connecting points for each of the control units, and branch lines which connect each of the connecting points in the control bus conductors with the corresponding control units to form a control circuit for cross-wiring. The construction of the power control apparatus enables easy wiring operations for the control units.

Abstract: A housing for an electronic circuit board includes a housing member and identical top and bottom cover members. Inwardly extending ribs located on the interior sidewalls of the housing member align and support the circuit board, and provide convection cooling channels which allow air to circulate freely over the circuit board. The housing member is preferably an integrally cast member formed with integral fin surfaces which dissipate heat for the protection of temperature sensitive electronic components within the housing.

Abstract: A direct-current arc furnace has a vessel with a floor and a cover, at least two vault electrodes projecting down into the vessel through the cover, and a hearth electrode exposed in the vessel generally in the floor below the vault electrodes. A scrap-metal charge is melted in this furnace by first energizing the vault electrodes with direct-current voltage of opposite polarity while displacing them downward through the charge from an upper position spaced relatively far from the hearth electrode to a lower position spaced relatively close to the hearth electrode and thereby passing an electric current through the charge to melt the charge and form a puddle of molten metal on the floor of the vessel at the hearth electrode.

Abstract: An article for dissipating heat generated by an alphanumeric display which is mounted on an electronic circuit board. The article includes a heat sink which is coupled to the underside of the alphanumeric display. The heat sink has at least one transfer member which extends through the electronic circuit board and is coupled to a dissipation plate. The dissipation plate is exposed to an environment which is removed from the immediate environment of the electronic circuit board. Heat generated by the alphanumeric display is transferred to the heat sink and through the transfer member(s) to the dissipation plate. The heat is then dissipated in an environment which is removed from that of any electronic components mounted on the electronic circuit board.

Abstract: An insulator used in connecting heat generating electrical components to heat sinks. Fasteners which include insulators of the present invention include flexible engaging means for preassembling an insulating washer portion to a conductive fastener element. The insulators may be made of high performance plastic material or of a coated metal. The fasteners used with the insulators preferably have integral spring washers to maintain thermal conductivity between the components and the associated heat sinks. The insulator preferably have integral bosses which prevent arcing between the conductive fasteners and the heat sinks.

Abstract: A glass melting furnace which uses Joule effect heating between electrodes, has a parallel attachment of electrodes to a single power source. The electrodes are arranged in rows of four electrodes across the width of the furnace. Multiple rows of electrodes spaced along the length of the furnace are used. The electrodes within a row are connected in a parallel format such that the current flow within a row can only be between two electrodes which are adjacent to each other. A current limiting controller and thermal currents within the molten glass balancing the temperature within the molten glass.

Abstract: An improved draw-out circuit breaker assembly for use in a switchboard with means for automatically tripping the breaker upon removal of the breaker from a fully engaged position within the switchboard and maintaining the breaker in the "TRIP" position until the terminal connectors of the breaker are separated by a predetermined distance from respectively associated connectors of the switchboard. A cam operated pivotable arm is connected to a push-to-trip button of the breaker and is biased to a first position. A cam link having an edge portion engaged with the arm and also including a cam surface is biased in a first position by the arm. A barrier surface is mounted within the switchboard to deflect the cam surface and move the link to a second position which in turn moves the pivotable arm against the bias to a second position, moving the push-to-trip button to its tripping position, which effects tripping of the circuit breaker.

Abstract: To provide an axially variable means of fixation, an electrode for electric arc furnaces is held via a spacing means comprising radially movable contact elements and metallic spacers. The contact elements may be pressed radially inwards against the electrode by means of clamping jaws, thus constituting a solid mechanical and electrical contact between the electrode clamp and the electrode proper.

Abstract: A metallurgical ladle furnace has a ladle for containing the melt, an arcing electrode positioned on the ladle's axis, and a melt electrode in the ladle's lower portion and substantially symmetric with respect to the arcing electrode. DC power applied to the electrodes results in an arc between the arcing electrode and the melt for heating the melt and incidentally causing the melt to stir in vertical directions, the melt moving downwardly in the middle below the arc, upwardly along the walls of the melt and inwardly towards the arc. A DC powered coil surrounds the ladle horizontally at half the ladle's height or higher, around the upper portions of the melt. The field of this coil in cooperation with a DC flow in the melt caused by the current flow between the electrodes, provides a substantially tangential stirring force on the melt which is in addition to the stirring force of the electrode current in the melt.

Abstract: A tamperproof, moisture proof data readout enclosure is comprised of a base plate adapted to be secured to a support structure and has channels formed in its rear surface. A cover adapted to be secured to the base plate has a sealing lip in its interior which cooperates with a seal on the base plate to provide a chamber within the enclosure which is sealed from the exterior environment when the cover is mounted on the base. The cover also has a peripherally extending wall which extends rearwardly from the front surface of the base plate and overlies the ends of the channels when the cover is secured in position. Openings are provided in the wall which register with the ends of the channels and locking pins are provided which project through the openings and the channels to prevent the removal of the cover from the base. Holes are provided on the locking pins to accommodate wires, the ends of which are sealed together to prevent removal of the locking pins without destruction of the integrity of the seal.