Abstract: A wire harness includes one or more electrically-conducting paths, a tubular shielding member configured to collectively accommodate the electrically-conducting paths, a braided shielding member including a cylindrical braided member and connected to an end of the tubular shielding member, and an annular crimping member including a fixing portion which fixedly connects the braided shielding member and the tubular shielding member by crimping, and a bent portion which is formed by bending an open end of the fixing portion to outside of the fixing portion.

Abstract: An improved Ethernet cable with an undulating and folding jacket housing external spatial channels. The undulating housing provides for multiple connection configurations from a flat cable to rectangular block configurations. The cable has a plurality of internal electronic signal channels, each channel having a pair of conductors. Each channel is also further isolated by a multi-layer protective shield, the protective shield encasing the pair of conductors. This unique design meets the new requirements of CAT8 cables, and substantially enhances video and audio streaming and transmission speeds, while eliminating deleterious effects of prior cables.

Abstract: An electrical cable has a plurality of generally rectangular cross-section conductors superposed in a stack, the stack surrounded by a polymer jacket. The stack may be provided with a lubrication layer provided between at least two of the conductors. Conductors of the stack may have a thickness that is greater proximate the middle of the stack than at the top and bottom of the stack and/or a width that is less at the top and the bottom than at the middle. Further stacks may also be provided parallel and coplanar with the first stack, also surrounded by the polymer jacket.

Abstract: An aluminum alloy wire rod includes Mg: 0.1-1.0 mass %, Si: 0.1-1.2 mass %, Fe: 0.10-1.40 mass %, Ti: 0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities. In a cross section parallel to a wire rod lengthwise direction and including a center line of the wire rod, no void having an area greater than 20 ?m2 is present, or even in a case where at least one void having an area greater than 20 ?m2 is present, a presence ratio of the at least one void per 1000 ?m2 is on average in a range of less than or equal to one void/1000 ?m2.

Abstract: An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

Abstract: A non-halogen insulating wire with excellent flame resistance as well as high mechanical characteristics (wear resistance) and electrical insulation characteristics is provided. A non-halogen two-layer insulating wire includes: a conductor; and an insulating layer having an insulating inner layer which covers an outer circumference of the conductor and an insulating outer layer which covers an outer circumference of the insulating inner layer. The insulating inner layer is made of a first non-halogen resin composition which contains metal hydroxide and a base polymer (A) including polyolefin, and has a thickness of 20% to 58% of an entire thickness of the insulating layer. The insulating outer layer is made of a second non-halogen resin composition which contains metal hydroxide and a base polymer (B) including polyester resin and/or polyester elastomer resin.

Abstract: A communication cable may include a plurality of twisted pairs and a plurality of discrete components of insulation material positioned in the interstices between the plurality of twisted pairs. Each of the discrete components may have a largest dimension that is no greater than approximately 250 microns. The discrete components may provide separation between two or more of the twisted pairs. A jacket may be formed around the plurality of twisted pairs and the plurality of discrete components.

Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.

Abstract: An electric wire and a shielding member configured to electrically shield the electric wire by enclosing an outer circumference thereof. A core wire of the electric wire has a single-core portion which is formed by applying pressure to a portion of a conductor obtained by twisting a plurality of strands together to reduce their cross section. This causes the strands to be brought into intimate contact with each other and form a single body, and a stranded wire portion in which the strands remain in a twisted-together state with no pressure having been applied thereto. The shielding member has a first shielding portion enclosing a portion of the electric wire where the core wire constitutes the single-core portion, and a second shielding portion enclosing a portion of the electric wire where the core wire constitutes the stranded wire portion. The second shielding portion has higher flexibility than the first shielding portion.

Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.

Abstract: An electric cable is provided having a plurality of insulated power conductors, a pilot and ground wire assembly and a saddle positioned between the plurality of insulated power conductors with the pilot and ground assembly being positioned within the saddle, where the saddle is constructed from a semi-conductive polymer. An inner sheath surrounds the saddle and the plurality of insulated power conductors, where the inner sheath is constructed from a semi-conductive polymer and where the inner sheath, saddle and the plurality of conductors form a flat cable. An outer insulating sheath disposed around the outside of the inner sheath.

Abstract: A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.

Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Abstract: An insulated electric wire and a method of producing the electric wire are provided. The insulated electric wire includes: a copper wire; and an insulating coating formed on a surface of the copper wire by an electrodeposition method. A cross section shape of the insulated electric wire including the insulating coating is in a hexagonal shape, a chamfered part that suppresses swelling of the insulating coating is formed on each corner part of a hexagonal cross section of the copper wire, a length of the chamfered part is ? to 1/20 of a length of a flat part of the hexagonal cross section, and a void ratio in a wound state is 5% or less.

Abstract: An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (?L) occurring in the protective layer (11) and thus preventing said dimensional change (?L) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

Abstract: A resin multilayer substrate includes a first resin layer, a conductive pattern that covers a portion of the first resin layer, a conductive via connected to the conductive pattern, and a second resin layer that is overlaid on the first resin layer. The second resin layer includes an opening through which the conductive pattern is partially exposed. As seen in plan view, the opening includes an inner peripheral edge including a first portion that is spaced from the conductive via by a first distance, and a second portion that is spaced from the conductive via by a second distance. The conductive pattern has a length that starts from the inner peripheral edge of the opening to outside and extends under the second resin layer. The length of the conductive pattern at the second portion is greater than the length of the conductive pattern at the first portion.

Abstract: An improved electrical system may be provided by electrically isolating horizontal power distribution bus bars of differing phases, disposed along a preconfigured isolated bus support molding, from one another by covering each bus bar with an electrically insulating molded assembly. The electrically insulating molded assembly has contours configured to cover a particular bus bar (with respect to another bus bar or live fastener), arranged within the constraints of the preconfigured isolated bus support molding in the electrical system (such as along the back of the isolated bus support, between the isolated bus support and a wall of the electrical system).

Abstract: A terminated electric wire includes an electric wire that includes a core wire including a metal having an ionization tendency larger than that of copper and being exposed from an end portion of the electric wire, and a terminal that includes copper or a copper alloy and is connected to the exposed core wire. A surface treating layer includes a surface treating agent that is in liquid form or in paste form and whose molecular structure contains an affinity group having an affinity for the terminal and a hydrophobic group having hydrophobicity, and is formed on a surface of the terminal. As a result, the electrolytic corrosion resistance of the terminated electric wire is improved.

Abstract: A wire harness which is wired in an automobile for electrical connection includes one or a plurality of electrical pathways. The electrical pathway includes a plurality of division electrical pathways and one or a plurality of conductive linking members which link the division electrical pathways, and the linking member includes a body part and connecting ends that are located at the two ends of the body part. Further, the linking member is formed as a member whose rigidity is lower than that of the division electrical pathways and is adjustable and bendable in predetermined directions.

Abstract: A power conversion device possesses a capacitor module, a power module, a circuit board on which a control circuit is mounted and which has a ground layer formed in a control circuit mounting region, a noise shielding plate, and a metal housing. The circuit board is above the capacitor module, and the noise shielding plate faces the control circuit mounting region between the circuit board and the capacitor module, in which the noise shielding plate has a plurality of connection parts to be electrically connected to the metal housing. A first end part on the power module side of the noise shielding plate is on the power module side more than a second end part on the power module side of the ground layer, and the connection part which is the closest to the first end part is provided on the power module side more than the second end part.