Patents Examined by Guillermo Egoavil
  • Patent number: 9743523
    Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: August 22, 2017
    Assignee: TRIPOD TECHNOLOGY CORPORATION
    Inventors: Bo-Shiung Huang, Wei-Hsiung Yang, Han-Ching Shih, Cheng-Feng Lin
  • Patent number: 9734931
    Abstract: It is an objective of the invention to provide a high-power supply cable characterized in that even when mounted in a narrow space where the cable undergoes a repetitive bending motion, any undesirable deformation out of the bending plane is small. There is provided a power-supply cable including: an electric wire including an electrical conductor and a resin sheath covering the electrical conductor, the electric wire having a tendency to generate a curl under a no-load condition, the curl having a curling direction, the curling direction being a normal to the curl, the electric wire having one or more longitudinal ends; a connecting terminal disposed at one of the longitudinal ends of the electric wire; and a curling tendency direction indicator showing the curling direction, the indicator being disposed along a normal line to the curl of the electric wire.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: August 15, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Tomohisa Suzuki, Takeshi Terasaki, Fumihito Oka, Hirotaka Eshima, Naofumi Chiwata
  • Patent number: 9734935
    Abstract: A wire harness comprises one or a plurality of electrically conductive paths, a tubular body into which the one or plurality of electrically conductive paths are to be inserted, and a protector to be engaged with a terminal of the tubular body, wherein the protector has a terminal engagement section to be engaged with the terminal of the tubular body, and a roll prevention portion which serves as an area that is mounted on a predetermined mounting surface without rolling, is formed in the terminal engagement section.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: August 15, 2017
    Assignee: YAZAKI CORPORATION
    Inventors: Hiroyuki Yoshida, Eiichi Tohyama, Tatsuya Oga, Shinichi Inao, Masaaki Suguro
  • Patent number: 9736948
    Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: August 15, 2017
    Assignee: Viasystems Technologies Corp., L.L.C.
    Inventors: Rajesh Kumar, Monte P. Dreyer, Michael J. Taylor
  • Patent number: 9721699
    Abstract: A water-stop structure including a water-stop tube is provided in which the water-stop tube can be brought into intimate contact with a water-stop region in a wire harness having a steep thickness gradient and thus water-stop performance is improved. The wire harness includes a first portion and a second portion that is thinner than the first portion. An inner water-stop tube covers the water-stop region ranging from the first portion to the second portion in a state where the inner water-stop tube is heated and shrunk. An outer water-stop tube covers the inner water-stop tube at a position between a portion on the first portion side and a portion on the second portion side in the water-stop region in a state where the outer water-stop tube is heated and shrunk.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: August 1, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Gen Shiba, Kazuhiro Hoshino
  • Patent number: 9722368
    Abstract: Embodiments generally relate to a cable that substantially forms itself into a cylindrical shape when not extended, yet can be extended with a slight force to provide an electrical coupling as, for example, for earphones used with a mobile device such as a mobile phone.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: August 1, 2017
    Inventor: Charles J. Kulas
  • Patent number: 9711259
    Abstract: The invention relates to an electrical cable (100) for exchanging communication signals between two devices, particularly a cable (100) that can be integrated into a catheter or a guidewire (5). The cable (100) comprises at least one pair (120, 130) of differential wires (D1+, D1?, D2+, D2?) that are, during operation, supplied with opposite voltages, thus defining a voltage-neutral plane (VNP) between them. Moreover, the cable (100) comprises at least one set (140) of single-ended wires (S11, S12; S21, S22; S31, S32) that is arranged symmetrically with respect to said voltage-neutral plane (VNP). Optionally a core wire (110) may be used for providing mechanical stability and additional electrical functionality. Electromagnetic disturbances from the differential wires to the single-ended wires (and vice versa) are minimized due to the particular arrangement of wires.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: July 18, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Antonia Cornelis Van Rens, Vincent Adrianus Henneken, Ronald Dekker
  • Patent number: 9711874
    Abstract: A terminal (10) is to be connected to an electric wire (W) which includes a core wire made of a fiber conductor (1). In a state of inserting a bare part of the fiber conductor in a barrel portion (11) of the terminal, the barrel portion is swaged while a swage amount is gradually increased as progressing in an electric wire insertion direction, which gradually expands the barrel portion in a width direction (D).
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: July 18, 2017
    Assignee: YAZAKI CORPORATION
    Inventor: Hisashi Hanazaki
  • Patent number: 9701859
    Abstract: Polymeric compositions having a slip agent comprising a silicone and a fatty acid amide. Such polymeric compositions can exhibit lower coefficients of friction when compared to polymeric compositions containing either silicone or fatty acid amide alone. Such polymeric compositions are suitable for use in various articles of manufacture, including, for example, wire and cable jackets.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: July 11, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Buo Chen, Mohamed Esseghir, Jeffrey M. Cogen, Chester J. Kmiec, Anny L. Flory, Saswati Pujari
  • Patent number: 9692218
    Abstract: A connecting plate to an electrical, or other, conduit and that may act as an end cap to the conduit, as a means of electrical and electronic interconnection through the conduit, as a tamper-resistant end cap lock and combinations thereof.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: June 27, 2017
    Assignee: SCUINT CORPORATION
    Inventor: Steven B. Snidow
  • Patent number: 9693453
    Abstract: A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: June 27, 2017
    Assignee: NGK SPARK PLUS CO., LTD.
    Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito
  • Patent number: 9693457
    Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 27, 2017
    Assignee: International Business Machines Corporation
    Inventor: Brian Samuel Beaman
  • Patent number: 9679679
    Abstract: An electrical line exterior structure for a wire harness is provided that allows water accumulated in a gap formed between adjacent electrical lines or between an exterior member and a group of electrical lines to quickly drain. A tape-like exterior member is wrapped around insulated electrical lines. The exterior member includes a base layer having multiple water suction openings open on the inner circumferential surface that faces the electrical lines, and multiple water suction tube portions that protrude on the outer circumferential surface side of the base layer, and a capillary structure having water suction holes in communication with the water suction openings. When water comes into contact with the electrical lines, negative pressure is generated by capillary action of the water suction holes on the base layer side, and water inside the water suction holes is vaporized on the protruding end side of the water suction tube portions.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: June 13, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Masataka Wakabayashi, Minoru Fukuda
  • Patent number: 9672960
    Abstract: An exterior member which covers the circumference of an electric wire, which is wired between electrical components, along the electric wire, and is supported by a supporting body while one side in a circumferential direction is exposed, includes an exterior member body that is formed into a long cylindrical shape and which has a predetermined background color, and an identifying mark that is provided on the outer surface of the exterior member body and which has another predetermined color different from the background color. The exterior member body is formed with at least one bent part which is bent at a middle position in a longitudinal direction, and the identifying mark is provided to face the one side while the exterior member is supported by the supporting body.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: June 6, 2017
    Assignee: Yazaki Corporation
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 9668361
    Abstract: A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate, and a through-hole conductor formed in the hole such that the conductor is connecting the first and second conductive layers. The conductor has a seed layer on inner wall of the hole, a laminated plated layer on the seed layer and a filled plated layer on the laminated layer, the laminated layer is formed such that the laminated layer is closing center portion of the hole and forming recess at end of the hole, the filled layer is formed such that the filled layer is filling the recess, and the laminated layer includes multiple electrolytic plated films laminated along the seed layer and each having thickness which is less at edge than at center.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: IBIDEN CO., LTD.
    Inventor: Kazuki Kajihara
  • Patent number: 9668333
    Abstract: A transparent conductive article includes a transparent substrate, a thin electrically conductive grid, and a carbon nanolayer. The grid is disposed on the substrate, and the carbon nanolayer is also disposed on the substrate and in contact with the grid. The conductive grid and the carbon nanolayer may have thicknesses of no more than 1 micron and 50 nanometers, respectively. The carbon nanolayer has a morphology that includes graphite platelets embedded in nano-crystalline carbon, and can be produced with a buffing procedure using dry carbon particles without substantially damaging the grid structure. The article may have a visible light transmission of at least 80%, and a sheet resistance less than 500 or 100 ohms/square. The transparent substrate may comprise a flexible polymer film. The disclosed articles may substantially maintain an initial sheet resistance value when subjected to flexing.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 30, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Ranjith Divigalpitiya, Mark J. Pellerite, John P. Baetzold, Gary A. Korba, Mieczyslaw H. Mazurek
  • Patent number: 9667041
    Abstract: A terminal assembly may be provided which utilizes an electrically insulating cover to electrically isolate upper portions of screw terminals. The electrically insulating cover could be made from plastic, rubber or some other electrical insulator, and could be mounted on a frame configured to engage with a frame supporting the screw terminals. While lower portions of the screw terminals may continue to electrically connect with electrical connectors for receiving load stab conductors (from a unit), upper portions of the screw terminals may be electrically isolated to protect from short-circuit, and/or shock, such as while a door or access panel of a wire-way is removed. The electrically insulating covers may also include cable glands for circumferentially surrounding wires leading to the screw terminals. A retainer clip may also be used to securely hold the electrically insulating covers to the frame supporting the screw terminals.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 30, 2017
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Jacek Tomasz Pochopien, Troy M. Bellows, Pawel Kokula
  • Patent number: 9666336
    Abstract: A termination unit for a superconductor network. Including a primary system that includes a first superconductor cable. Also a first superconducting coil and a first auxiliary magnetizing coil, each coil wound around the first superconductor cable. Also a terminal including a first leg, the first leg including an aperture configured to receive the first superconductor cable. The first leg defining a clearance about the first superconductor cable at ambient temperature and arranged to firmly clamp onto the first superconductor cable at a cryogenic temperature. The termination unit including a cooling system arranged to enclose and cool the primary system to cryogenic temperatures.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: May 30, 2017
    Assignee: ROLLS-ROYCE plc
    Inventors: Stephen Mark Husband, Paul Robert Miller, Alexander Charles Smith, Peter Malkin
  • Patent number: 9659680
    Abstract: A composite core for use in electrical cables, such as high voltage transmission cables is provided. The composite core contains at least one rod that includes a continuous fiber component surrounded by a capping layer. The continuous fiber component is formed from a plurality of unidirectionally aligned fiber rovings embedded within a thermoplastic polymer matrix. The present inventors have discovered that the degree to which the rovings are impregnated with the thermoplastic polymer matrix can be significantly improved through selective control over the impregnation process, and also through control over the degree of compression imparted to the rovings during formation and shaping of the rod, as well as the calibration of the final rod geometry. Such a well impregnated rod has a very small void fraction, which leads to excellent strength properties. Notably, the desired strength properties may be achieved without the need for different fiber types in the rod.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: May 23, 2017
    Assignee: Ticona LLC
    Inventors: Sherri M. Nelson, David W. Eastep, Timothy L. Tibor, Timothy A. Regan, Michael L. Wesley, Richard Steihm
  • Patent number: 9649998
    Abstract: A wire harness includes conducting paths, a metal pipe into which the conducting paths are inserted, and a conducting path protective cap which includes a through hole for the conducting paths, and an engaging part which is engaged with a terminal part of the metal pipe. The terminal part of the metal pipe has a ring-like cap engagement space formed by crushing the terminal part towards a predetermined direction from a pipe outer surface of the metal pipe. The ring-like cap engagement space includes a reduced space and an enlarged space formed due to a crushing of the terminal part. The reduced part is formed by narrowing a part of a gap between the conducting paths and the pipe inner surface due to the crushing, and the enlarged space is formed by enlarging a part of the gap in accordance with a formation of the reduced space.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: May 16, 2017
    Assignee: Yazaki Corporation
    Inventors: Tatsuya Oga, Hiroyuki Yoshida