Patents Examined by Guillermo Egoavil
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Patent number: 9900987Abstract: There are provided a coil component and a board for mounting the same. The coil component includes a magnetic body including first and second coil portions disposed on one surface of a substrate and disposed linearly, based on a central portion of the magnetic body, and third and fourth coil portions disposed on the other surface of the substrate and disposed linearly, based on the central portion of the magnetic body; and first to fourth external electrodes disposed on an external surface of the magnetic body and connected to the first to fourth coil portions. The first coil portion and the third coil portion have a first core portion, and the second coil portion and the fourth coil portion have a second core portion. A peripheral portion disposed outwardly of the first to fourth coil portions has greater permeability than that of the first and second core portions.Type: GrantFiled: April 4, 2016Date of Patent: February 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
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Patent number: 9899819Abstract: Electrical distribution systems and methods comprising a first cable-to-box connector which accepts electrical wires, a first electrical box having a first and a second coupler to connect to the cable-to-box connector; intra-box circuits built in one or more of a plurality of walls of the first electrical box and connecting the first and the second coupler; and a concavity defined by the plurality of walls of the first electrical box that receives a first electrical insert.Type: GrantFiled: October 5, 2016Date of Patent: February 20, 2018Inventor: Robert Holloway
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Patent number: 9894764Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.Type: GrantFiled: April 12, 2016Date of Patent: February 13, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung-Uk Lee, Il-Jong Seo, Jae-Hoon Choi, Yong-Ho Baek
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Patent number: 9887022Abstract: A stranded conductor contains a number of individual wires. The multiple identically designed individual wires are arranged about a central inner wire as outer wires. The individual wires form a composite which is encased by insulation, and the outer wires are uncompressed and have a non-round cross-section such that when seen in cross-section, the outer wires expand radially outwards starting from the inner wire. The composite of individual wires is not compressed such that the composite has a high alternate bending strength.Type: GrantFiled: May 4, 2016Date of Patent: February 6, 2018Assignee: LEONI Kabel Holding GmbHInventors: Markus Schill, Yuecel Sahiner, Wolfgang Stadler
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Patent number: 9881739Abstract: A multilayer ceramic capacitor provided in a multilayer printed wiring board includes a ceramic body with a plurality of ceramic layers and internal electrodes stacked, and an external electrode including a base layer that includes a sintered metal containing a metal and glass and a plated layer provided on the surface of the base layer, which is provided on an end surface of the ceramic body to be connected to the internal electrodes. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The outermost layer of the plated layer includes a Cu plated layer. The ratio of arithmetic mean roughness (Ra) at the surface of the ceramic body/arithmetic mean roughness (Ra) at the surface of the external electrode satisfies a condition: about 0.06?the arithmetic mean roughness (Ra) at the surface of the ceramic body/the arithmetic mean roughness (Ra) at the surface of the external electrode?about 0.97.Type: GrantFiled: September 28, 2015Date of Patent: January 30, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Takehisa Sasabayashi
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Patent number: 9875823Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other in a direction of lamination, and a linear signal line provided in the dielectric element assembly. The dielectric element assembly includes at least one section bent in a plurality of places defining a zigzag shape when viewed in a plan view in the direction of lamination. In the zigzag section of the dielectric element assembly, any portions of the dielectric element assembly that are not adjacent across a bending line do not overlap when viewed in a plan view in the direction of lamination.Type: GrantFiled: September 24, 2014Date of Patent: January 23, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Satoshi Sasaki
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Patent number: 9860994Abstract: A circuit board having a substrate, a first metal layer, a second metal layer and a solder mask layer. The first metal layer and the second metal layer with unequal surface areas spacedly arranged on the substrate and respectively providing a first solderable region and a second solderable region with equal surface areas. The solder mask layer having an opening and covered on the substrate, the first metal layer and the second metal layer to expose the first solderable region and the second solderable region. Besides, the first metal layer further provides a window abutted to the first solderable region, and the opening exposes a first blank region and a second blank region. Thus, the problem of unequal solder regions due to offset of the solder mask layer can be avoided, and improving the yield rate of the fabrication process.Type: GrantFiled: December 2, 2015Date of Patent: January 2, 2018Assignee: Universal Global Technology (Shanghai) Co., Ltd.Inventors: Wan-Chen Chan, Chun-Chi Chiu, Hsun-Fa Li
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Patent number: 9859056Abstract: A multilayer ceramic capacitor includes an external electrode on an end surface of a ceramic body to be connected to internal electrodes including a base layer including a sintered metal containing Cu and glass and a Cu plated layer on the base layer. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The Cu metal of the Cu plated layer is present in the base layer to a position of about ? or more of the thickness of the base layer from a surface layer of the external electrode. The metal thickness of the external electrode is about 8.7 ?m or more and about 13.9 ?m or less.Type: GrantFiled: September 28, 2015Date of Patent: January 2, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Akihiro Yoshida
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Patent number: 9852827Abstract: A novel data cable achieves good transmission quality in automotive Internet applications. The data cable has a transmission core with only a single stranded conductor pair or four conductors stranded together to form a quad. The transmission core is surrounded by a jacket having a high air content. The jacket may be a foamed sheath, or alternatively at least one spacer element that defines an annular sheath space with air gaps around the transmission core.Type: GrantFiled: April 11, 2016Date of Patent: December 26, 2017Assignee: LEONI Kabel Holding GmbHInventors: Erwin Koeppendoerfer, Rainer Poehmerer, Stefanie Pfister
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Patent number: 9824792Abstract: A wiring harness has a waterproof structure in which a waterproof agent covers a conductor exposed portion-and outer peripheral surfaces of end portions of wire covering members of a plurality of insulated wires in succession, the portion including a splice portion where portions of the members of the insulated wires are removed and the exposed conductors are spliced together and a bundle of the exposed conductors of the insulated wires, the end portions being adjacent to the portion, whereby the portion is sealed with the waterproof agent, wherein the waterproof agent is a cured product of an ultraviolet curable adhesive agent that contains (A) an ester acrylate having a linear or branched C2-C12 alkyl group, (B) a (meth)acrylate compound comprising at least two urethane bonds in one molecule, and (C) a photopolymerization initiator.Type: GrantFiled: October 9, 2015Date of Patent: November 21, 2017Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Kyushu UniversityInventors: Kazuo Nakashima, Takehiro Hosokawa, Tatsuya Hase, Kenji Ito, Makoto Mizoguchi
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Patent number: 9826645Abstract: The present application provides a circuit substrate and a method of managing the placement of one or more groupings of a plurality of capacitors coupled to a circuit substrate. Each capacitor has a pair of terminals, as well as a component shape which changes as a voltage difference is selectively applied across the pair of terminals. When a voltage difference is applied across the pair of terminals, the component shape of the capacitor will contract in a first direction and expand in a second direction, where the second direction is substantially orthogonal to the first direction. When the voltage difference is removed from the pair of terminals, the component shape of the capacitor will return to an uncontracted state in the first direction and an unexpanded state in the second direction. Each of the plurality of capacitors in a particular grouping is driven by a complementary signal.Type: GrantFiled: December 15, 2015Date of Patent: November 21, 2017Assignee: Motorola Mobility LLCInventors: Robert Zurek, Robert M Netz
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Patent number: 9824796Abstract: An oxide superconductor includes: a substrate made of a metal; an insulating intermediate layer provided on the substrate; an oxide superconducting layer provided on the intermediate layer; a metal stabilizing layer provided on the oxide superconducting layer; and a plurality of dividing grooves which divide the metal stabilizing layer and the oxide superconducting layer along a longitudinal direction of the substrate, reach the inside of the intermediate layer through the oxide superconducting layer from the metal stabilizing layer, and do not reach the substrate. The metal stabilizing layer and the oxide superconducting layer are divided to form a plurality of filament conductors by the plurality of dividing grooves, and in each dividing groove of the plurality of dividing grooves, a width of a groove opening portion of the dividing groove is equal to or greater than a width of a groove bottom portion of the dividing groove.Type: GrantFiled: May 28, 2014Date of Patent: November 21, 2017Assignees: FUJIKURA LTD., SWCC SHOWA CABLE SYSTEMS CO., LTD., FURUKAWA ELECTRIC CO., LTD.Inventors: Takato Machi, Tomo Yoshida, Tatsunori Nakamura, Kota Katayama, Koichi Nakao, Keiichi Tanabe
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Patent number: 9819164Abstract: An intermediate member that enables enhancement of ease of fabrication of a wire harness and a wire harness including such an intermediate member are provided. A wire harness is divided into an intermediate member placed in an intermediate portion of the wire harness and two terminal members placed at respective terminals of the wire harness and to be connected to equipment. After being separately fabricated, the intermediate member and the two terminal members are connected together, whereupon fabrication of the wire harness is completed. The intermediate member includes one or a plurality of intermediate conducting paths, intermediate routing path retaining means retaining a cable routing path geometry of the intermediate conducting paths; intermediate shield means covering and shielding the intermediate conducting paths; and intermediate protection means covering and protecting the intermediate conducting paths.Type: GrantFiled: June 9, 2014Date of Patent: November 14, 2017Assignee: YAZAKI CORPORATIONInventors: Hidehiro Ichikawa, Makoto Katsumata
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Patent number: 9814140Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.Type: GrantFiled: April 5, 2016Date of Patent: November 7, 2017Assignee: International Business Machines CorporationInventor: Brian Samuel Beaman
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Patent number: 9814128Abstract: A multiple board standoff for interconnecting a plurality of electronic boards, such as printed circuit boards, having at least one keyhole slot. The standoff comprises a plurality of major diameter portions, a plurality of minor diameter portions each disposed between two of the plurality of major diameter portions, and a plurality of abutment surfaces each transversely extending from one of the major diameter portions to one of the minor diameter portions. At least one of the minor diameter portions is configured to be inserted into the keyhole slot when the standoff is in a first orientation with respect to the electronic board and being retained within the keyhole slot when the standoff is in a second orientation with respect to the electronic board.Type: GrantFiled: March 10, 2017Date of Patent: November 7, 2017Assignee: Crestron Electronics, Inc.Inventors: Agnieszka Wynar, Stan Wisniewski, Michael Campagna, Scott Wisniewski
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Patent number: 9814131Abstract: An interconnection substrate includes: a substrate having a first surface and a second surface opposite the first surface; and a transmission line including two parallel through-hole interconnections that are exposed to the first and second surfaces and are formed inside the substrate. Also, at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface.Type: GrantFiled: December 29, 2014Date of Patent: November 7, 2017Assignee: FUJIKURA LTD.Inventor: Yusuke Uemichi
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Patent number: 9799425Abstract: The present invention relates to a high speed transmission cable that includes a first conductor set, a dielectric film at least partially concentrically disposed around the first conductor set and a pinched portion forming an insulating envelope around the first conductor set. The dielectric film includes a base layer having a plurality of first protrusions formed on a first major surface of the base layer, wherein the dielectric film is disposed such that the base layer is partially concentric with the conductor set and wherein a portion of the first protrusions is disposed between the first conductor set and the base layer in a region where the base layer is concentric with the first conductor set.Type: GrantFiled: May 2, 2016Date of Patent: October 24, 2017Assignee: 3M Innovative Properties CompanyInventor: Douglas B. Gundel
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Patent number: 9786418Abstract: A cable splitter includes a main body. The main body includes a top wall and an end portion. The top wall defines a splitting slot, a first guide slot, a second guide slot running through the top wall. The end portion includes a first guide arm and a second guide arm extending from the end portion and corresponding to the first guide slot and the second guide slot.Type: GrantFiled: April 29, 2016Date of Patent: October 10, 2017Assignees: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Ming-Tao Wang, Hua-Qi Wang
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Patent number: 9788413Abstract: An assembly and method provides improved electromagnetic interference shielding, particularly where the assembly includes a shield with a shield opening. The shield opening may be provided to permit the escape of thermal energy from an electronic component on a substrate under the shield or to receive at least a part of a thermal pad, electronic component, or conductive chassis. The assembly includes a first conductive gasket disposed around the shield opening, and a second conductive gasket disposed radially outward from the first conductive gasket. The first conductive gasket and the second conductive gasket have one or more gasket characteristics including a respective first characteristic and second characteristic that are of the same type but have different values. The first characteristic and the second characteristic may be one or more of different attenuation frequency ranges, compression amounts, compressive forces, and dimensions.Type: GrantFiled: November 9, 2015Date of Patent: October 10, 2017Assignee: MOTOROLA SOLUTIONS, INC.Inventors: Yaakov Moseri, Alexander J. Gomelsky, Lionid Kodner
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Patent number: 9773583Abstract: Continuously transposed conductor (“CTC”) cables are described. A CTC cable may include a plurality of electrically insulated strands connected in parallel at their ends. Additionally, each strand may include one or more conductors and an extruded insulation layer formed at least partially around the one or more conductors.Type: GrantFiled: April 24, 2014Date of Patent: September 26, 2017Assignee: Essex Group, Inc.Inventors: Matthew Leach, Gregory S. Caudill