Abstract: A cooling array for cooling of an electronic component includes the electronic component, a housing which at least partially enclosing the electronic component, a heat sink support connected to the housing in a fluid-tight manner, and a heat sink which is accommodated in the heat sink support. The heat sink is thermally coupled to the electronic component in order to disperse heat generated by the electronic component.

Abstract: A heat-dissipating device includes a casing and a heat dissipating fin set. The casing has a first hole structure. The heat dissipating fin set includes a protruding fin, a sheltering component and a bridging component. A hollow chamber of the protruding fin has a first opening and a second opening adjacent to each other. The first opening is connected to an inner space of the casing. The sheltering component is disposed on the protruding fin to shelter the second opening. The bridging component is connected to the protruding fin and fixed onto the first hole structure.

Abstract: A modular heat exchanger for battery thermal management having a plurality of similarly constructed heat exchange elements affixed to a cover plate and fluidly coupled with one another via a single external manifold structure that functions as both an inlet manifold and an outlet manifold for each of the heat exchange elements. Rigidity is improved with alternating tabs or overlapping tabs between adjacent elements, and/or side edges between adjacent elements having cutouts for receiving stiffening ribs formed in the cover plate. The external manifold structure provides additional stiffening for the interconnected heat exchange elements.

Abstract: A heat dissipation fin includes a body and an airflow guiding structure. The body has a first surface and a second surface opposite to each other and an airflow hole penetrating the first surface and the second surface. The airflow guiding structure is obliquely joined on the first surface of the body and covers part of the airflow hole. An airflow passage is formed between the airflow guiding structure and the first surface. Part of an airflow is adapted to pass along the first surface through the airflow passage to flow away. Part of the airflow passes in a direction from the second surface through the airflow hole to flow away.

Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.

Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.

Abstract: A device for controlling a battery for a vehicle is provided to maintain a battery temperature representing the optimal charging efficiency when the battery reaches a charging time point. The device determines the charging time point of a battery used in a hybrid vehicle and an electric vehicle, and adjusts the battery temperature based on a status of charge (SoC) of the battery at the determined charging time point.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A refrigerator according to an embodiment of the present invention includes: a compressor configured to compress a refrigerant; and an inverter module configured to control the compressor, wherein the inverter module includes: a heatsink provided with a cooling passage through which coolant passes; a coolant inlet connected to the heatsink to communicate with an inlet of the cooling passage; a coolant outlet connected to the heatsink to communicate with an outlet of the cooling passage; at least one insulated gate bipolar transistor (IGBT) disposed on a top surface of the heatsink; and at least one diode disposed to be spaced apart from the IGBT on the top surface of the heatsink, wherein the cooling passage includes: an IGBT cooling passage that is closer to the coolant inlet among the coolant inlet and the coolant outlet; and a diode cooling passage that is closer to the coolant outlet among the coolant inlet and the coolant outlet, wherein the diode cooling passage is disposed behind the IGBT cooling passa

Abstract: Embodiments of the present disclosure include systems and methods for controlling the direction of cooling air flow across components of an electronic devices. In one or more embodiments, a device or information handling system includes an air flow generator that is able to generate air flow in different directions by activation of a button, a controller, or both. In one or more embodiments, a sensor measures air temperatures of air when the air flows in different directions, and an air flow direction is selected using the air temperature measurements.

Abstract: A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.

Abstract: A damper controller may be configured to send damper control commands to open and close an outdoor air damper to provide free cooling as necessary to satisfy a temperature setpoint inside the building. In some cases, the damper controller may initiate a damper fault test to determine if a damper fault is present. The damper fault test may be based, at least in part, on an outdoor air temperature input, a discharge air temperature input, a commanded damper position, and a damper fault temperature threshold. If a damper fault is determined, the damper controller may send an alert indicative of a detected damper fault. In some cases, the damper fault test results may be weighted to reduce the false positives alerts.

Abstract: An example sensor bracket assembly can include one or more cold plates forming a core bracket structure, wherein the core bracket structure and the one or more cold plates provide structural support for the sensor bracket assembly; a housing enclosing the core bracket structure; one or more sensor mounts for mounting one or more sensors on the sensor bracket assembly; and one or more attachment portions for attaching the sensor bracket assembly to a body of a vehicle.

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

Abstract: A liquid to refrigerant heat exchanger includes an enclosed coolant volume that is at least partially defined by a plastic housing and by a metal closure plate. The metal closure plate can be part of a brazed assembly containing a continuous refrigerant flow path. The refrigerant flow path is disposed within the coolant volume, where heat can be transferred between the refrigerant within the refrigerant flow path and the liquid within the coolant volume. The plastic housing can at least partially surround the refrigerant flow path to at least partially bound a liquid flow path along a portion of the coolant volume. An inlet diffuser and an outlet diffuser can be mounted to the housing to direct the liquid through the housing. The plastic housing is sealingly joined to the closure plate along an outer periphery of the closure plate.

Abstract: A thermal management system for high power electrical equipment includes temperature adjustment means, sensing means, and a microcontroller. The temperature adjustment means includes small and large temperature adjustment units and a selection device, wherein the small and large temperature adjustment units are thermally connected to the battery cells and the battery enclosure, respectively. The sensing means includes temperature sensors for measuring the temperatures of the battery cells, and capacity sensors for measuring the remaining capacities of the battery cells available for the electrical equipment, wherein the temperature and capacity sensors can output corresponding signals. The microcontroller receives the signals from the temperature and capacity sensors, and enables or disenables the temperature adjustment means according to the temperature signals.

Abstract: An air conditioner includes a housing having a blowing port, a first guide configured to cover a portion of the blowing port, a second guide configured to cover another portion of the blowing port, a motor configured to rotate the first guide and the second guide, a first gear configured to be connected to the first guide, a guide holder configured to be connected to the second guide, and a second gear configured to connect the first gear to the motor.

Abstract: A bent heat exchanger is provided. The bent heat exchanger includes: a first header and a second header; a plurality of flat tubes, two ends of the flat tube being connected to the first header and the second header respectively; and fins, each disposed between adjacent flat tubes, extending in a corrugated shape along a length direction of the flat tube. The first header and the second header each have a slot running through a wall thereof and a protrusion arranged to an inner surface of the wall thereof. The protrusion includes an arc portion connected to the edge of the slot, and an extension portion protruding inwards from the arc portion. An arc radius of the arc portion is less than or equal to and greater than 0.6 times a thickness of a wall of the corresponding first header or second header.

Abstract: A cooling system includes a shared path; a first path connected to the shared path and having a first pump and a first heat exchanger exchanging heat with an inverter; a second path connected to the shared path in parallel with the first path and having a second pump and a second heat exchanger exchanging heat with a battery. The first and second paths are configured to be able to switch a flow state between a first state where the heat media flow through the shared path, and a second state where one of the heat media does not flow through the shared path. The control device controls the outputs of the pumps so that when switching the flow state between the first and second states, flow rate of the heat medium flowing through the first path becomes temporarily larger than the target flow rate.