Patents Examined by Gustavo A Hincapie Serna
  • Patent number: 11346617
    Abstract: The present disclosure relates to a wick structure accommodated in a container of a heat pipe having plural foils and a structure holding portion for fixing the foils. The respective foils are held by the structure holding portion, whereby the foils are positions and arrange in parallel. The foil is connected to the other foils including the other adjacent foils via the structure holding portion.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: May 31, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomomi Kaibuchi, Tomoaki Toratani
  • Patent number: 11329329
    Abstract: Various arrangements for a battery module cooling system are presented. A thermal tower may be contoured to contact one or more battery cells. The thermal tower may include a holding member and a cooling member. A hollow interior region having a top aperture may be defined by the holding member. A portion of each of the one or more battery cells may be contacted by the cooling member to provide localized cooling to each of the one or more battery cells. A seal may be formed between the holding member and the cooling member by positioning the cooling member on the top aperture of the holding member. Optionally, the portion that the cooling members may contact to provide localized cooling may include a hot region having a higher temperature than other portions of each of the one or more battery cells.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: May 10, 2022
    Assignee: CHONGQING JINKANG POWERTRAIN NEW ENERGY CO., LTD.
    Inventor: Jiaxian Wang
  • Patent number: 11320207
    Abstract: A heat transfer plate (10) for a plate heat exchanger (100) includes: a plate body (11) having a first side (111) and a second side (112) opposite to the first side (111); a gasket groove (12) formed on the plate body (11), depressed from the plate body (11) in a direction from the first side (111) towards the second side (112), and having a bottom wall (120), the bottom wall (120) having a bottom wall body (121); and a recess (20, 20?) formed on at least one segment (125, 125?) of the bottom wall body (121) in a length direction of the bottom wall body (121), depressed from the bottom wall body (121) in the direction from the first side (111) towards the second side (112), and extending along the segment (125, 125?) of the bottom wall body (121) of the gasket groove (12).
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: May 3, 2022
    Assignee: Danfoss A/S
    Inventor: Benny Andersen
  • Patent number: 11316216
    Abstract: A modular heat exchanger for battery thermal management having a plurality of similarly constructed heat exchange elements affixed to a cover plate and fluidly coupled with one another via a single external manifold structure that functions as both an inlet manifold and an outlet manifold for each of the heat exchange elements. Rigidity is improved with alternating tabs or overlapping tabs between adjacent elements, and/or side edges between adjacent elements having cutouts for receiving stiffening ribs formed in the cover plate. The external manifold structure provides additional stiffening for the interconnected heat exchange elements.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: April 26, 2022
    Assignee: Dana Canada Corporation
    Inventors: Garreth D. G. Graves, Benjamin A. Kenney, Michael A. Martin, Kenneth M. A. Abels, Lee M. Kinder
  • Patent number: 11300370
    Abstract: A method and apparatus for heat transfer. In some embodiments, a heat transfer apparatus includes a body defining an inner volume; an inlet coupled to a vapor source; a coolant channel extending through the heat transfer apparatus; a condensing surface on which a vapor condenses, wherein the condensing surface is configured to cause the vapor to form as one or more drops on the condensing surface; and an actuator configured to excite the one or more drops at a resonant frequency of the one or more drops to remove the one or more drops from the condensing surface.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: April 12, 2022
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Christopher Phillip Migliaccio, Nathan Scott Lazarus
  • Patent number: 11293700
    Abstract: A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.
    Type: Grant
    Filed: September 6, 2020
    Date of Patent: April 5, 2022
    Assignee: Cooler Master Co., Ltd.
    Inventor: Chang-han Tsai
  • Patent number: 11264658
    Abstract: A heat exchanger for cooling multiple rows of battery cells has a plurality of longitudinal flow sections defining at least first and second U-shaped flow areas, each underlying a row of battery cells. The flow sections includes inlet and outlet flow sections, and at least two intermediate flow sections. Inlet and outlet ports are in flow communication with the respective inlet and outlet flow sections, and a first bypass channel extends between the inlet port and at least one of the intermediate flow sections. The first bypass channel supplies relatively cold heat transfer fluid from the inlet to mix with warmer fluid in a second or subsequent U-shaped flow area, to improve temperature uniformity between the rows of battery cells. A second bypass channel may extend around the outer periphery of the heat exchanger, from the inlet flow section to a second or subsequent U-shaped flow area.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: March 1, 2022
    Assignee: Dana Canada Corporation
    Inventors: Garreth D. G. Graves, Sina Kaiser-Krug
  • Patent number: 11262143
    Abstract: The present invention relates to a compact heat exchange device, applicable to either EGR (Exhaust Gas Recirculation) systems for reducing nitrogen oxide emission, or to WHRS systems (Waste Heat Recovery Systems), both in internal combustion engines. The design of the heat exchanger is characterized by a configuration that incorporates technical solutions intended for compensating for the differential expansions between the tube bundle and the shell, as well as other variables relating to thermal fatigue, where said solutions result in a compact device.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 1, 2022
    Inventors: Julio Abraham Carrera Garcia, Xoan Xose Hermida Dominguez
  • Patent number: 11240932
    Abstract: This technology relates to a cooling system for reducing the amount of heat within a sensor housing. The system comprising a cold plate containing an interior liquid cooling channel containing a cooling fluid, a heat exchanger attached to the cold plate, and at least one fan configured to generate an air flow loop. The heat exchanger is configured to draw heat from the air flow loop and pass the drawn heat to the cold plate, which in turn, passes the drawn heat to the cooling liquid.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: February 1, 2022
    Assignee: Waymo LLC
    Inventor: Justin Matthew Andrade
  • Patent number: 11230968
    Abstract: A frameless cooling module includes a first and a second shroud panel arranged at opposing sides of the module and extending from the front of the module to the back of the module. At least one L-shaped stiffener bracket extends between the panels at an intermediate location along both the height direction and the depth direction of the module. One or more heat exchangers is arranged within the cooling module between the L-shaped stiffener bracket and the front of the module, and is at least partially secured within the cooling module by being mounted to the L-shaped stiffener bracket.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: January 25, 2022
    Assignee: Modine Manufacturing Company
    Inventors: Ryan Hankwitz, Allison M Kirklin, Zachary T Ouradnik, Eric Lamberton
  • Patent number: 11215406
    Abstract: A waste heat recovery unit includes a duct for hot gas. The duct is divided into first, second and third adjacent and parallel channels each with an inlet and an outlet. A heat exchanger is located in each of the first and third channels. The second channel is located between the first and third channels and provides a bypass channel. A damper system is operable to selectively open and close the inlets of the three channels. This provides a more compact waste heat recovery unit configuration which is more straightforward to manufacture and maintain.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: January 4, 2022
    Inventor: David Champneys
  • Patent number: 11209215
    Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: December 28, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Adrian Chiriac, Jorge Luis Rosales
  • Patent number: 11209216
    Abstract: A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: December 28, 2021
    Inventors: Doug Vanderwees, Shuding Lin, Mike St. Pierre
  • Patent number: 11209219
    Abstract: A heat exchanger is disclosed that includes a cold heat exchange zone including a foam material having an annular geometry and having fluid distribution and collection slots configured to distribute a cooling fluid circumferentially through the foam material.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: December 28, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Dennis L. Youchison
  • Patent number: 11199344
    Abstract: A heat exchanger and an air-conditioning apparatus that exhibit high performance, and also provide reliability in strength and corrosion resistance. The heat exchanger includes a plurality of fins each including a fin collar formed in a short cylindrical shape by perforating a flat base plate, the plurality of fins being stacked by serially connecting fin collars of the respective fins, the serially connected fin collars being bonded to form a conduit line and a fin core, the conduit line including a resin layer formed on an inner surface thereof. The heat exchanger also includes a reinforcing member having a length corresponding to a length of the conduit line from one end to the other end thereof, to improve rigidity of the conduit line.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: December 14, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kosuke Miyawaki, Takahiro Hori, Norihiro Yoneda, Susumu Yoshimura, Yoji Onaka, Takashi Matsumoto, Ryota Akaiwa, Yasuhiro Yoshida, Kazuhiro Miya
  • Patent number: 11193717
    Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: December 7, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Takahiko Kiso
  • Patent number: 11187465
    Abstract: A heat exchanger (1; 1*; 100) includes a bundle of tubes (8), each extending in a respective elongation direction (X1) and defining a flow path for a working fluid that extends in the elongation direction, wherein each tube (8) of the bundle of tubes can be supplied with a working fluid; a matrix (6) of thermally conductive material that houses the tubes (8) of the bundle and that is configured, in use, for promoting heat exchange between working fluids that run through corresponding tubes (8) of the bundle; and a shell (4) made of thermally insulating material arranged around the matrix (6), wherein: the matrix (6) is made up of a plurality of sections (10; 10*) arranged aligned in the elongation direction (X1) and alternated by thermal interruptions (12) that extending transversely to the elongation direction (X1).
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: November 30, 2021
    Assignee: Archimede S.R.L.
    Inventors: Alberto Brucato, Giuseppe Caputo, Gianluca Tumminelli, Gaetano Tuzzolino, Calogero Gattuso, Roberto Rizzo
  • Patent number: 11187429
    Abstract: A heat recovery ventilator (HRV) and/or energy recovery ventilator (ERV) that integrates with a residential capacity air handling unit (AHU) is embodied in a small footprint HRV or ERV unit that connects directly to the return side of an AHU and to outdoor air inlet and exhaust ducts. The ventilator includes a control system incorporating a processor and sensors that control the operation of the system to provide desired ventilation flow rates under varying conditions.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: November 30, 2021
    Assignee: Steven Winter Associates, Inc.
    Inventors: Srikanth Puttagunta, Robb Aldrich, Barnett Cleary
  • Patent number: 11181124
    Abstract: In order to give an especially compact, cost-effective and electromagnetically compatible design to a cooling device with a heat sink and a radial fan arranged in or on the receiving area of the heat sink, the bushing is adhesively bonded onto the heat sink in or on the receiving area, or the bushing is integrally designed with the heat sink.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 23, 2021
    Assignee: ELEKTROSIL GMBH
    Inventor: Hendrik Niemann
  • Patent number: 11175707
    Abstract: A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: November 16, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida