Abstract: A nonvolatile memory has a plurality of memory cells, each of the memory cells having a first and a second source/drain areas, a control gate, and an insulating trap layer disposed between the control gate and a channel area lying between the first and the second source/drain areas. The trap layer includes a use bit area in proximity to the first source/drain area, for storing data depending on the presence or absence of electric charge to be trapped, and a non-use bit area in proximity to the second source/drain area, in which the electric charge is trapped while data is held in the use bit area. Preferably, in the state where erasing operation is completed, the non-use bit area is brought into a state where electric charge is trapped therein.

Abstract: A dynamic random access memory (DRAM) has a refresh-control function under control by an internal refresh-control signal. The DRAM includes: a cell array having a plurality of DRAM cells divided into a plurality of blocks, the DRAM cells being driven through word lines for data transfer with bit lines; a decoder to select word lines and bit lines connected to the cell array; a sense amplifier to amplify data on the bit lines; and a refresh controller to limit refresh to the cell array so that at least one externally-accessed block cell among the blocks is refreshed.

Abstract: A method for erasing a flash EEPROM. The flash EEROM includes a number of memory units. First, the flash EEPROM is pre-programmed. Second, the step of erasing the flash EEPROM is performed and the flash EEPROM is then soft-programmed. Subsequently, the final step is performed to determine if the erasing step succeeds.

Abstract: A local sense amplifier drives a global bit line pair by potentials of data storage nodes when a global word line attains an H level. A global sense amplifier amplifies the potential difference of data storage nodes when a global sense enable signal attains an H level. The global sense enable signal is inverted by an inverter to be provided to a global word driver. When the global word line attains an L level by the global word driver, the local sense amplifier suppresses the drive of the global bit line pair.

Abstract: Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.

Abstract: A line selector for a matrix of memory elements, for example a word line selector, comprises a plurality of line group selection circuits, each one allowing the selection of a respective group of matrix lines according to an address; each matrix line group includes at least one matrix line. Flag means are associated with each line group, that can be set to declare a pending status of a prescribed operation, for example an erase operation, for the respective matrix line group. Means are provided for entrusting the flag means with the selection of the respective line group during the execution of the prescribed operation, in alternative to the respective line group selection circuit. The flag means enable, when set, the execution of the prescribed operation on the respective matrix line group.

Abstract: A method for programming and erasing a memory array includes the step of adapting programming or erase pulses to the current state of the memory array. In one embodiment, the step of adapting includes the steps of determining the voltage level of the programming pulse used to program a fast bit of the memory array and setting an initial programming level of the memory array to a level in the general vicinity of the programming level of the fast bit. For erasure, the method includes the steps of determining erase conditions of the erase pulse used to erase a slowly erasing bit of said memory array and setting initial erase conditions of said memory array to the general vicinity of said erase conditions of said slowly erasing bit.

Abstract: Shape dummy cells that are designed to have the same dimensions and structures as MTJ memory cells are additionally provided in the peripheral portion of an MTJ memory cell array in which normal MTJ memory cells for storing data are arranged in a matrix. The MTJ memory cells and the shape dummy cells are sequentially arranged so as to have a uniform pitch throughout the entirety. Accordingly, non-uniformity between MTJ memory cells in the center portion and in border portions of the MTJ memory cell array, respectively, after manufacture due to high and low densities of the surrounding memory cells can be eliminated.

Abstract: The present invention includes a method of fabricating a non-volatile memory device having two transistors for two-bit operations to improve electron trapping efficiency and integration degree of the non-volatile memory device, and a method of driving the non-volatile memory device. The EEPROM device acccording to the present invention comprises a silicon substrate including a first and a second channel area, a first and a second conductive gate on the first and the second channel area, respectively, facing each other, a first and a second insulation layer in the bottom of the first and the second gate, and a first and a second junction area of a second conductive type between the first and the second channel area overlapping with the first and the second conductive gate.

Abstract: A method and structure for a read only memory (ROM) cell array has the first drain of a first transistor connected to a true bitline and a second drain of a second transistor connected to a complement bitline. The first transistor also includes a first source, and the second transistor includes a second source. The connection of the first source or the second source to ground programs the ROM cell. With the invention, only the first source or the second source is connected to the ground and the other is insulated from electrical connections. Further, the connection of the source to ground comprises an electrical connection formed during manufacturing of the first transistor and the second transistor.

Abstract: A tunnel magnetic resistive element forming a magnetic memory cell includes a fixed magnetic layer having a fixed magnetic field of a fixed direction, a free magnetic layer magnetized by an applied magnetic field, and a tunnel barrier that is an insulator film provided between the fixed and free magnetic layers in a tunnel junction region. In the free magnetic layer, a region corresponding to an easy axis region having characteristics desirable as a memory cell is used as the tunnel junction region. A hard axis region having characteristics undesirable as a memory cell is not used as a portion of the tunnel magnetic resistive element.

Abstract: A nebulization system, which creates a uniform fog of tiny suspended liquid droplets, to lubricate the surfaces of MEMS devices. These droplets fall over the edge of a baffle and are then mixed with an umbrella-like sheet of N2 turbulation gas to generate a uniform cloud of droplets that fill a passivation chamber. The MEMS device is then positioned in this uniform cloud of lubricant droplets for a specified amount of time, thereby uniformly lubricating all the surfaces of the device. The system uses a laser monitoring approach to control the uniformity of the lubricant cloud by providing feedback to the system to control the flow of gases. The system also equalizes the pressure around the sample device seal to prevent gases from entering or exiting the chamber and thereby influencing the environment inside the chamber.

Abstract: A read operation and a write operation are synchronized via one port of a memory cell to avoid contention between such operations while doubling the bandwidth of such operations. Data is read from and data is written to a memory cell through a single port of the cell. A memory cell having a port is provided, and a clock signal is also provided for clocking the memory cell. The clock signal has a leading edge and a lagging edge within a clock signal cycle. During a single clock cycle, an enable read control signal is asserted in response to the clock signal, and an enable write control signal is asserted in response to the clock signal. In response to the enable read control signal, read data stored within the memory cell is read through a port of the cell. In response to the enable write control signal, write data is written to the memory cell through the port.

Abstract: A shielding arrangement for protecting a circuit containing magnetically sensitive materials from external stray magnetic fields. A shield of a material having a relatively high permeability is formed over the magnetically sensitive materials using thin film deposition techniques. Alternatively, a planar shield of relatively high permeability is affixed directly to a surface of semiconductor die containing an integrated circuit structure with magnetoresistive memory cells.

Abstract: Method and apparatus are described for providing memory cells enhanced for resistance to single event upsets. In one embodiment, transistors are coupled between cross coupled inverters of a latch, thus in a small area providing both single-event-upset resistivity most of the time, and high speed during writing to the memory cell. Alternatively, inductors coupled between inverters of a latch may be used.

Abstract: A flash memory device can include a first redundancy circuit configured to provide read repair information for read operations to the flash memory. The flash memory device can also include a second redundancy circuit, separate from the first redundancy circuit, configured to provide write repair information for write operations to the flash memory. The flash memory device can include a dedicated-read operation redundancy circuit configured to provide read repair information and a dedicated-write operation redundancy circuit configured to provide write repair information. The flash memory device can include also include a first redundancy circuit configured to store an address of a defective memory cell in the flash memory and a second redundancy circuit, separate from the first redundancy circuit, configured to store the address of the defective memory cell.

Abstract: A current reference for providing a stable current output across a range of temperatures and input power supply voltages by summing signals from a first and second current generation subcircuits which generate temperature dependent signals having in inverse relationship. The first current generation subcircuit includes two NMOS transistors and a resistor and has a negative thermal coefficient. The second current generation subcircuit includes two bipolar transistors and a resistor and has a positive thermal coefficient.

Abstract: A sensing circuit. The circuit includes an integrator to sense charge release from a passive electronic device and a comparator to interpret the charge release as one of at least two data states. The circuit also includes a compensation module to generate a compensation signal as needed and a self-timing module to adjust timing of the integrator sensing based upon a predefined voltage level.

Abstract: A NVM device encompasses a MOS select transistor including a select gate electrically connected to a word line, a first source doping region electrically connected to a source line, and a first drain doping region. A MOS floating gate transistor is serially electrically connected to the MOS select transistor. The MOS floating gate transistor comprises a floating gate, a second source doping region electrically connected to the first drain doping region of the MOS select transistor, and a second drain doping region electrically connected to a bit line. The second source doping region and the second drain doping region define a floating gate channel. When the MOS floating gate transistor is programmed via a hot electron injection (HEI) mode, the floating gate is a P+ doped floating gate; when the MOS floating gate transistor is programmed via a hot hole injection (HHI) mode, the floating gate is an N+ doped floating gate.

Abstract: An integrated circuit memory device can include a memory cell circuit configured to store data and a sense amplifier circuit configured to sense and amplify the stored data provided as a first input to the sense amplifier circuit in comparison to a reference voltage provided as a second input to the sense amplifier circuit. A bit line electrically can be coupled to the memory cell circuit and indirectly electrically coupled to the first input of the sense amplifier circuit and configured to provide the stored data to the sense amplifier circuit. A reference voltage line can also be indirectly electrically coupled to the second input of the sense amplifier circuit and configured to provide the reference voltage to the sense amplifier circuit.