Abstract: A ferroelectric memory device includes a plurality of bit line pairs, a plurality of sense amplifiers, a plurality of memory cells, a plurality of reference cells, and a control circuit. Each of the bit line pairs is composed of first and second bit lines. Each of the sense amplifiers amplifies a potential difference across the corresponding bit line pair. The memory cells are provided for the respective bit line pairs and each composed of a transistor and a ferroelectric capacitor. The reference cells are provided for the respective bit line pairs and each composed of a transistor and a ferroelectric capacitor. In addition, each of the reference cells on each of the bit line pairs retains data different from data of a reference cell on the adjacent bit line pair. The control circuit drives the sense amplifiers, the memory cells, and the reference cells. During the drive of the sense amplifier, the control circuit inactivates a reference word line connected to the reference cell.

Abstract: The present invention includes a method of fabricating a non-volatile memory device having two transistors for two-bit operations to improve electron trapping efficiency and integration degree of the non-volatile memory device, and a method of driving the non-volatile memory device. The EEPROM device acccording to the present invention comprises a silicon substrate including a first and a second channel area, a first and a second conductive gate on the first and the second channel area, respectively, facing each other, a first and a second insulation layer in the bottom of the first and the second gate, and a first and a second junction area of a second conductive type between the first and the second channel area overlapping with the first and the second conductive gate.

Abstract: In the first read operation, a read current is supplied to TMR elements connected in parallel in one column or one block to detect initial data. Trial data is then written in a selected memory cell. At the same time of or in parallel with writing of the trial data, the second read operation is performed. In the second read operation, a read current is supplied to the TMR elements connected in parallel in one column or one block to read comparison data. Subsequently, the initial data is compared with the comparison data to determine the data value in the selected memory cell. Finally, rewrite operation is performed for the selected memory cell.

Abstract: The present invention involves a method for fabricating interconnecting lines and vias. According to the invention, copper is grown within the openings in a patterned coating. The patterned coating can be a resist coating or a dielectric coating. Either type of coating can be formed over a copper seed layer, whereby the seed layer is exposed within the pattern gaps. The copper seed layer can also be provided within the pattern gaps after patterning. Copper features are grown within the pattern gaps by plating. Where the patterned coating is a resist, the resist is stripped leaving the copper features in the inverse pattern image. The copper features can be coated with a diffusion barrier layer and a dielectric. The dielectric is polished to leave the dielectric filling the spaces between copper features. The invention provides copper lines and vias without the need for a dielectric or metal etching step.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array which includes nonvolatile memory cells, and a control circuit which responds to a first command by performing a first batch erasure with respect to a selected group of the memory cells, and responds to a second command by performing a second batch erasure with respect to the selected group of the memory cells, the first batch erasure including preprogramming, erasure, and over-erasure correction in this sequence, and the second batch erasure including over-erasure correction, preprogramming, erasure, and over-erasure correction in this sequence.

Abstract: A semiconductor memory device has a first precharge transistor connecting a potential supply line to one end of a bit line when the bit line is precharged and a second precharge transistor connecting the potential supply line to the other end of the bit line when the bit line is precharged. To a gate of the first precharge transistor is inputted a first precharge signal, and to a gate of the second precharge transistor is inputted a second precharge signal generated based on a chip-select signal and the first precharge signal. The second precharge transistor is brought into a cut-off state during a standby state in which a memory cell corresponding to the second precharge transistor does not read nor write data but holds date.

Abstract: The method for using a nonvolatile memory (1) having a plurality of cells (14), each of which stores a datum, is based upon the steps of performing an modification operation of erasing/programming (22) the data of the memory; verifying (23) the correctness of the data of the memory cells; and, if the step of verifying (23) has revealed at least one incorrect datum, correcting on-th-field (46) the incorrect datum, using an error correcting code. The verification (23) of the correctness of the data is performed by determining (23) the number of memory cells storing an incorrect datum; if the number of memory cells storing the incorrect datum is less than or equal to a threshold (46), the erroneous datum is corrected by the error correction code; otherwise, new erasing/programming pulses are supplied.

Abstract: A method for generating an initializing signal capable of preventing inner circuits installed in a semiconductor memory device from being initially unstably operated due to the application of external electric power. The method includes the steps of: (a) receiving a precharge command for precharging the semiconductor memory device; (b) activating the initializing signal to a first level in response to the received precharge command; (c) receiving a refresh command for refreshing the semiconductor memory device after receipt of the precharge command; (d) receiving a mode set command for setting an operational mode of the semiconductor memory device after receipt of the refresh command; and (e) deactivating the initializing signal to a second level in response to the received mode set command.

Abstract: A semiconductor integrated circuit device includes a memory, /CE transition detector, address transition detector, /WE transition detector and controller. The controller includes a timeout circuit. The timeout circuit generates an internal circuit control signal with preset width to control access to the memory based on detection results of the above transition detectors. The operation of the memory is controlled by the timeout circuit at the read time. The operation of the memory is controlled by the timeout circuit when transition of the end of a /WE signal is detected by the /WE transition detector before a timing specified by the timeout circuit at the write time. Further, the operation of the memory is controlled in response to the transition of the /WE signal when the transition of the end of the /WE signal is detected by the /WE transition detector after passage of the above timing.

Abstract: A method for configuring an associative array within a molecular-junction-nanowire crossbar, and nanoscale associative arrays configured by the method Keys are encoded as field-effect transistors selectively configured within the molecular-junction-nanowire crossbar, and values associated with keys are encoded as diodes selectively configured at molecular-junction-nanowire-crossbar junctions. Keys input into key registers result in a current signal indicating whether or not the key is stored within the associative array as part of a key/value pair and, if stored in the associative array, the value associated with the input key is output.

Abstract: A semiconductor device comprises a memory cell array, bit line, /bit line complementary to the bit line, reference voltage generating circuit and sense amplifier. The bit line is connected to the memory cells and applied with a voltage read from each memory cell of the memory cell array. The /bit line is supplied with a reference voltage. The reference voltage generating circuit generates the reference voltage that has temperature dependence for compensating a change in the voltage, read to the bit line, due to temperature. The reference voltage generating circuit controls the reference voltage such that the reference voltage assumes a midpoint of trails of a signal value distribution indicative of “0” data and a signal value distribution indicative of “1” data. The sense amplifier compares the voltage, read to the bit line, with the reference voltage supplied to the /bit line, and amplifies the difference therebetween.

Abstract: An MRAM includes a magnetoresistance element configured to store data, an electric current drive line configured to selectively apply a magnetic field to the magnetoresistance element, and a magnetic circuit configured to hold the magnetic field applied from the electric current drive line. The electric current drive line includes a first side facing the magnetoresistance element, a second side reverse to the first side, and two lateral sides between the first and second sides. The magnetic circuit includes a pair of film members consisting essentially of a ferromagnetic material and extending along the two lateral sides of the electric current drive line, such that portions facing the first and second sides of the electric current drive line are left open.

Abstract: The invention includes an apparatus and a method that provides a memory back-up system. The memory back-up system includes a first memory cell, and a non-volatile memory cell that is interfaced to the first memory cell. Control circuitry allows data to be written to either the first memory cell or the non-volatile memory cell, and provides transfer of the data from either the first memory cell or the non-volatile memory cell, to the other of either the first memory cell or the non-volatile memory cell. The memory back-up system can also include a plurality of first memory cells, and a plurality of non-volatile memory cells that are interfaced to the first memory cells. Control circuitry allows data to be written to either the first memory cells or the non-volatile memory cells, and that provides transfer of the data from either the first memory cells or the non-volatile memory cells, to the other of either the first memory cells or the non-volatile memory cells.

Abstract: The disclosure is a non-volatile semiconductor memory device including a bias circuit that generates a bias voltage for controlling an NMOS transistor connected to both a bit line and a page buffer circuit. The bias circuit generates a first voltage, which is greater than a power source voltage, as the bias signal in a precharge period of a read operation. The bias circuit also generates a second voltage, which is less than the power source voltage, as the bias signal in a sensing period of the read operation.

Abstract: Structures and methods for write once read only memory employing charge trapping are provided. The write once read only memory cell includes a metal oxide semiconductor field effect transistor (MOSFET) in a substrate. The MOSFET has a first source/drain region, a second source/drain region, and a channel region between the first and the second source/drain regions. A gate insulator is formed opposing the channel region. The gate insulator includes a number of high work function nanoparticles. A gate is formed on the gate insulator. A plug is coupled to the first source/drain region and couples the first source/drain region to an array plate. A transmission line is coupled to the second source/drain region. The MOSFET is a programmed MOSFET having a charge trapped in the number of high work function nanoparticles in the gate insulator adjacent to the first source/drain region.

Abstract: A semiconductor device and its manufacturing method with which the connection reliability can be improved without complicating the manufacturing process. Semiconductor chip 102 is mounted on the principal surface of insulated substrate 104, and a conductive paste containing a heat-curing epoxy resin is supplied to via holes 116 from the back of insulated substrate 104. Then, solder balls 118 are transferred onto the conductive paste of insulated substrate 104, and reflow soldering is applied in order to bond solder balls 118 to insulated substrate 104. During the reflow soldering, the heat-curing epoxy resin forms resin parts 120 around solder balls 118.

Abstract: A method for erasing a bit of a memory cell in a non-volatile memory cell array, the method comprising applying an erase pulse to at least one bit of at least one memory cell of the array, waiting a delay period wherein a threshold voltage of the at least one memory cell drifts to a different magnitude than at the start of the delay period, and after the delay period, erase verifying the at least one bit to determine if the at least one bit is less than a reference voltage level.

Abstract: A memory cell matrix with a plurality of associative memory cells and match lines are respectively divided into two in the direction of the match line. A first memory cell matrix is provided with a match line pre-charge circuit that pre-charges the match line in the first memory cell matrix, and a match line sense amplifier that detects the potential of the match line. A second memory cell matrix is provided with a match line pre-charge circuit that pre-charges the match line in the second memory cell matrix, a match line sense amplifier that detects the potential of the match line in the second memory cell matrix, and a second match line control circuit. The second match line control circuit operates the match line pre-charge circuit in the second memory cell matrix, to pre-charge the match line, only when the data comparison result in the first memory cell matrix indicates agreement.

Abstract: A method and apparatus operable to provide pseudo 2-port RAM functionality using 1-port memory cells. A pseudo 2-port RAM functionality is provided using an array of 1-port memory cells to perform read and write operations during a single clock cycle. Control logic is used to determine when the read and write operations occur. The pseudo 2-port RAM uses the control logic to divide the clock cycle into four phases in accordance with a preferred embodiment. The first phase is used to set up the addresses and register values, the second phase is used to prepare for the read operation, the third phase is used to perform the read operation and prepare for the write operation, and the fourth phase performs the write operation.

Abstract: A method for fabricating chalcogenide materials on substrates, which reduces and/or eliminates agglomeration of materials on the chalcogenide materials; and system and devices for performing the method, semiconductor devices so produced, and machine readable media containing the method. One method disclosed includes forming a first layer, forming a second layer on the first layer, forming a third layer on the second layer, wherein the third layer is essentially transparent to irradiation, and irradiating the second layer through the third layer to cause the second layer to diffuse into the first layer thereby creating an integral layer of materials from the first and second layers.