Abstract: A method is provided that integrates an autonomous energy harvesting capacity in vehicles in an aesthetically neutral manner. A unique set of structural features combine to implement a hidden energy harvesting system on a surface of the vehicle to provide electrical power to the vehicle, and/or to electrically-powered devices in the vehicle. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: A magnetic-core assembling tool may include first and second compression plate alignment guides configured to be respectively fitted to first and second compression plates of a magnetic-core assembly, a plurality of semiannular tension bars, and a clamping plate. The semiannular tension bars may be attached at a first end to the first compression plate alignment guide and at a second end to the clamping plate. The clamping plate may include a plurality of compression shoes configured to apply a variable amount of compression to the magnetic-core assembly. A method of assembling a magnetic-core assembly includes assembling a plurality of lamination stacks, staging the plurality of lamination stacks to provide a magnetic-core assembly, assembling a magnetic-core assembling-tool around the magnetic-core assembly, and injecting magnet retention adhesive into a plurality of magnet retention slots in the magnetic-core assembly housed in the magnetic-core assembling tool.

Abstract: A refurbished rotor of a wound rotor machine. The refurbished rotor includes a plurality of windings assembled to the rotor core, each manufactured from two separate bars: a top coil and a bottom coil. The top coil is positioned in a rotor core slot at a position radially outward of a position of the bottom coil within another rotor core slot. Each top coil and each bottom coil has a flat rectangular cross-section. On a connection end of the rotor where rotor leads are attached, the top coil has a flat end positioned alongside and in alignment with a flat end of the bottom coil of an adjacent one of the plurality of windings. The top coil and the bottom coil have respective flat ends joined to each other on a non-connection end of the rotor opposite the connection end by a joint for establishing electrical continuity.

Abstract: The present invention provides an inductive component (1a) in several illustrative embodiments and a method for producing such an inductive component. The inductive component (1a) comprises a bus bar (4a) and at least one magnetic core (6a) which is formed along a section of the bus bar (4a) and surrounds the bus bar (4a) in that section at least in part, wherein the at least one magnetic core (6a) is formed as a plastic-bonded magnetic core or a core made of magnetic cement.

Abstract: A system for providing cable support may be provided. The system may comprise a conductor core, a filler that may provide integral core support, and armor. The conductor core may comprise at least one conductor. The filler may be applied around at least a portion of the conductor core. The armor may be applied around at least a portion of the filler. The applied armor may be configured to cause the filler to apply a strong enough force on an exterior of the conductor core configured to keep the conductor core from slipping down an interior of the filler due to a gravitational force. In addition, the applied armor may be configured to cause the filler to apply a strong enough force on an interior of the armor configured to keep a combination of the conductor core and the filler from slipping down the interior of the armor due to the gravitational force.

Abstract: A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle arrives at a position where separating the feeder carriage from the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a release notification indicating that a connection of the feeder carriage is released. The mounting system includes a second processor which causes the connection mechanism to release the connection of the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the release notification upon being informed of completion of the release operation.

Abstract: One aspect is a method of forming a lead for implantation. The method includes forming a distal end assembly, forming a proximal end assembly, and forming a flexible circuit coupling the distal end assembly to the proximal end assembly. The distal end assembly, the proximal end assembly and the flexible circuit are formed over an inner member. An outer member is placed over the combination of the distal end assembly, the proximal end assembly and the flexible circuit. The outer member and circuit are fused adjacent the distal end assembly to the proximal end assembly.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: Methods of forming hermetically-sealed packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

Abstract: A management device includes a management control section configured to create rearrangement disposition information for rearranging recovery feeders in a recovery storage region and rearranging provision feeders in a provision storage region among feeders temporarily stored in a storage section by using storage position information regarding storage positions of the provision feeders and the recovery feeders temporarily stored in the storage section and region information including the recovery storage region and the provision storage region set in the storage section, and output the created rearrangement disposition information.

Abstract: Provided is a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, wherein the capacitance portion has an opening which extends in a lamination direction in which the plurality of electrode layers and the dielectric layer are laminated and through which one electrode layer of the plurality of electrode layers is exposed, the one electrode layer has an exposed portion exposed at a bottom surface of the opening, the exposed portion is in contact with a wiring layer connecting the one electrode layer and an electrode terminal, and a thickness of the exposed portion of the one electrode layer is smaller than a thickness of other portions of the one electrode layer and is 50% or more of the thickness of the other portions of the one electrode layer.

Abstract: The present invention relates to a method for producing a high-frequency connector. The method includes producing a basic body part from a dielectric material by means of an additive manufacturing method. The basic body part has a bushing between a first end and a second end of a longitudinal extent of the basic body part and an end face at the first end for making contact with a mating connector. In addition, the method includes coating the dielectric basic body part with an electrically conductive layer and removing the electrically conductive layer in a region surrounding the bushing in each case at the end face at the first end and at the second end of the basic body part so as to form an electrically conductive coating on the outer conductor side and an electrically conductive coating on the inner conductor side. The present invention also relates to a high-frequency connector.

Abstract: A crimping machine includes a storage arrangement having a plurality of feeding bowls for separated contact elements. The crimping machine further includes a device for transporting the contact elements to a crimp head. At least some of the feeding bowls are designed with a common vibration driver and can be driven via a common control unit.

Abstract: A method comprises forming a single-crystal-like metal layer on a metal seed layer, the metal seed layer formed on a carrier wafer. The method comprises forming a first bonding layer on the single-crystal-like metal layer. The method also comprises forming a second bonding layer on a dielectric layer of a target substrate, the target substrate comprising one or more recording head subassemblies. The bonding layers may include diffusion layers or dielectric bonding layers. The method further comprises flipping and joining the carrier wafer with the target substrate such that the first and second diffusion layers are bonded and the single-crystal-like metal layer is integrated with the recording head as a near-field transducer.

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: The present application relates to the technical field of circuit board fabricating, and provides a method for fabricating an asymmetric board, the method includes fabricating a master board, fabricating a second sub-board, thermal compression bonding the master board and the second sub-board, and milling an asymmetric board; further includes at least one of the following three steps: laying copper on the connection areas of the master board except for the second copper layer of an outermost layer to obtain laying copper area, removing copper on the connection areas of the third copper layer, and after the step of milling the asymmetric board, on each of the sub-boards, performing depth control milling at the connection areas from a side of the second sub-board on each sub-board to obtain a depth control groove.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: Provided is a device for manufacturing a stator, the device including a winding jig configured to wind a coil and to manufacture a winding coil, and an insertion jig configured to receive the winding coil from the winding jig and to insert the winding coil into a stator core, wherein the winding jig comprises a body extending along a longitudinal direction (L1), a power supply unit configured to make the body revolve around a central shaft of the body, and a protrusion formed on a surface of the body.

Abstract: A method for making ultrasound transducers and ultrasound probes includes providing a piezoelectric layer having a first surface and a second surface, where the second surface is on an opposite side of the piezoelectric layer from the first surface. The method includes fabricating a plurality of conductive through vias extending from the first surface to the second surface of the piezoelectric layer, where fabricating the plurality of conductive through vias comprises cutting a plurality of trenches through the piezoelectric layer and filling each of the plurality of trenches with a conductive material. The method includes cutting the piezoelectric layer into a plurality of transducer units after fabricating the plurality of conductive through vias and cutting each of the transducer units into a plurality of transducer elements.

Abstract: PROBLEM TO BE SOLVED: To provide a laser jointing method that joints two materials while imparting a sufficient strength thereto and minimizing heat influence. SOLUTION: The method overlaps first and second materials (V1, V2) on each other and irradiates the surface of the first material (V1) with a laser light (103) from the side of the first material (V1). When jointing both materials (V1, V2), the method intermittently irradiating an overlapped part of the first and second materials (V1, V2) with the laser light while moving the laser light (103) to form a welding bead (1) on the surface of the first material (V1), wherein the length of the welding bead (1) is formed gradually shorter.