Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

Abstract: A method of manufacturing an acoustic wave device is disclosed. The method includes attaching a support layer to a ceramic layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The method also includes bonding a piezoelectric layer to a surface of the ceramic layer. The method further includes forming an interdigital transducer electrode over the piezoelectric layer.

Abstract: Portable, hand-held, battery operated, hydraulic tools are provided with a tool frame, a force sensor, and a location detector. A piston actuated by a hydraulic system within the tool frame applies force to the working head to perform a task, such as to apply a crimp to an electrical connector. The tool determines the maximum force applied to the crimp and records that maximum force along with the geographic location of the tool when the crimp was formed. The maximum force provides an indication of the quality of the crimp and the recorded location allows a potentially defective crimp to be located.

Abstract: A method of producing a radio frequency member to construct a radio frequency confinement device based on a waffle iron structure includes providing an intermediate work of a plate shape or a block shape, the intermediate work including a main surface which is shaped as a plane or a curved surface and a plurality of rods extending away from the main surface. An interval between a side surface of one of the plurality of rods and a side surface of another rod that is adjacent to the one rod monotonically increases in a direction away from the main surface. The method also includes forming an electrically-conductive plating layer on the main surface and at least the side surface of the plurality of rods by immersing at least a portion of the intermediate work in plating solution.

Abstract: An ultrasonic transducer device for use in an acoustic biometric imaging system, the ultrasonic transducer device comprising: a first piezoelectric element having a first face, a second face opposite the first face, and side edges extending between the first face and the second face; a first transducer electrode on the first face of the first piezoelectric element; a second transducer electrode on the second face of the first piezoelectric element; and a spacer structure leaving at least a portion of the first transducer electrode of the first piezoelectric element uncovered.

Abstract: A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

Abstract: A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.

Abstract: A method of connecting electrical substation wiring in an electrical substation provides pre-bundled yard cables configured to connect between field devices in the substation and a yard interface connection cabinet. The yard interface connection cabinet has an outside plug bulkhead plate that is accessible from outside of a control house that houses the yard interface connection cabinet. The outside plug bulkhead plate has a plurality of connectors configured to mate with the yard cables. The yard interface connection cabinet further has internal wires extending from an inside plug bulkhead plate and terminating at a terminal block. The connections and wires in the yard interface connection cabinet are tested with the yard cables before installation of the yard interface connection cabinet and yard cables in the substation. The yard cables are connected between the field devices and the outside plug bulkhead plate from outside of the control house.

Abstract: A shape cutting device of a skin electrode patch includes: a substrate conveyor for transmitting a coated substrate portion and a conductive adhesive portion; a positioning conveyor; a fitted shape cutting module installed in a successive portion of the positioning conveyor and having two pressing wheels and a shape cutting unit, and the two pressing wheels being provided for pressing the coated substrate portion and the conductive adhesive portion, and the shape cutting unit including a roller body with at least one cutting knife which is in a geometrical shape and includes two side cutters and a first-end cutter at an axial end, and opposite ends of the first-end cutter having two second-end cutters, and a gap being formed in the two second-end cutters. The cutting knife has a design that integrates the transmission feature and the efficiency of the whole production line.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a piezoelectric device including a piezoelectric membrane and a plurality of conductive layers. The method includes forming the plurality of conductive layers in the piezoelectric membrane, the plurality of conductive layers are vertically offset one another. A masking layer is formed over the piezoelectric membrane. An etch process is performed according to the masking layer to concurrently expose an upper surface of each conductive layer in the plurality of conductive layers. A plurality of conductive vias are formed over the upper surface of the plurality of conductive layers.

Abstract: A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

Abstract: This application provides a planar transformer and a switching power adapter. The planar transformer includes a PCB winding and two magnetic cores. The two magnetic cores wrap two sides of a winding body of the PCB winding to form a closed magnetic loop. A first group of welding points is disposed on a primary-side wire side of the PCB winding, and a second group of welding points is disposed on a secondary-side wire side of the PCB winding. The planar transformer is directly welded to an external circuit board by using the first group of welding points and the second group of welding points. In this way, no pin needs to be welded on the PCB winding board. In addition, the planar transformer can be vertically installed on the external circuit board by using the first group of welding points and the second group of welding points.

Abstract: A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.

Abstract: An assembly comprises a compression member configured to receive a force input from a compression tool and a frame including a cradle at one end, an end fitting at the other, and at least one structural member linking the cradle to the end fitting. The cradle is configured to engage one end of the connector and receives the prepared end of the coaxial cable. The end fitting is configured to detachably connect the frame to the compression tool and includes an aperture for receiving the force input from the compression tool. The structural member defines at least one surface configured to guide the compression member along the axis in response to the force input. The compression member imposes an axial force on the other end of the connector and is guided along the axis by the guide surface of the frame.

Abstract: The present invention discloses an ion beam lithography method based on an ion beam lithography system. The ion beam lithography system includes a roll-roll printer placed in a vacuum, and a medium-high-energy wide-range ion source, a medium-low-energy wide-range ion source and a low-energy ion source installed on the roll-roll printer. The ion beam lithography method includes: first coating a polyimide (PI) substrate with a dry film, etching the dry film according to a preset circuit pattern, then using the ion beam lithography system to deposit a wide-energy-range metal ion on the circuit pattern to form a film substrate, and finally stripping the dry film off the film substrate to obtain a printed circuit board (PCB).

Abstract: A system includes a magnetic material supply for regulating a magnetic material flow rate of a magnetic material and a binder material supply for regulating a binder material flow rate of a binder material. A nozzle is configured for depositing a deposition mixture of the magnetic material and the binder material on a surface and a preheater is configured to preheat the deposition mixture before depositing on the surface. A controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater. The controller is configured to receive an inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core, move the nozzle to one or more deposition locations, and adjust the magnetic material flow rate to the binder material flow rate to achieve a deposition mixture having a desired magnetic permeability at the deposition locations.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: The invention relates to a method and a robot system (23) for producing transformer cores (12), sheets of metal (16) from which a transformer core is constructed being received on at least two stacking tables (18) by means of a multiaxial robot (22) of the robot system, the sheets of metal being supplied to the robot and stacked adjacent to the robot in at least two storage positions (31) for different sheets of metal by means of a conveyor device (29), the robot and the conveyor device being controlled by a control device (17), sheets of metal being collected from the storage positions and being stacked on the stacking tables by means of the robot disposed between and above the stacking tables.

Abstract: A method of manufacturing a winding-type electronic component using stranded wires which can suppress a disconnection of a winding when a plurality of windings is twisted. The method of manufacturing a winding-type electronic component includes: a preparation step of allowing a chuck to hold a core having a winding core portion (14) and flange portions; a first step of fixing a portion of each of windings supplied from nozzles (N1, N2) to the flange portion; and a second step of twisting the windings by rotating the chuck.