Abstract: A plank is described and a method for manufacturing the plank. The plank can be produced by mixing polyvinyl chloride powder, coarse whiting and light calcium compound powder, stabilizer, polyethylene wax, internal lubricant, plasticizer, and impact modifier together, and stirring this mixture. The mixture is then extruded through an extruder compound to form a plastic composite base material. A surface layer is then tiled onto the plastic composite base material using thermal compression, without the use of intermediate adhesive materials. The surface layer can be embossed when it is combined with the mixture being extruded.

Abstract: Provided is a semiaromatic polyamide fil having an average linear expansion coefficient in the width direction, measured under conditions of 20 to 125° C., of ?90 to 0 ppm/° C.

Abstract: The present disclosure relates to a cover window for a flexible display device including a polymer substrate including a polyamide resin; and a hard coating layer formed on at least one surface of the polymer substrate, wherein a yellow index of the polymer substrate measured in accordance with STM E 313 is 4.00 or less, and an elastic modulus of the polymer substrate measured at a strain rate of 12.5 mm/min in accordance with ISO 527-3 is 4 to 9 GPa.

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

Abstract: A display device includes: a display panel; a first member disposed on the display panel; a second member disposed on the display panel; a first adhesive layer disposed between the display panel and the first member; and a second adhesive layer disposed between the display panel and the second member. The spacers are disposed in the second adhesive layer.

Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.

Abstract: A multi-layer film includes a skin layer and a seal layer. The multi-layer film may be used to form a package for a food product.

Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

Abstract: The present invention concerns anti-corrosive coating compositions, in particular coating compositions for protecting iron and steel structures. In particular, the present invention relates to coating compositions comprising particulate zinc, conductive pigments, and microspheres. The invention furthermore concerns a kit of parts containing the composition, a method for its application, as well as metal structures coated with the composition.

Abstract: There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

Abstract: Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

Abstract: Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.

Abstract: Provided is a method of preparing a composition for forming a polyimide film which may significantly improve dispersibility of a pigment. Specifically, the method includes preparing a polyamic acid resin in the presence of a pigment dispersion including a blue-based inorganic pigment and a dispersing agent. In addition, an average particle size of the inorganic pigment in the pigment dispersion may be 10 to 100 nm.

Abstract: The present disclosure relates to insulation. Various embodiments thereof may include a solid insulation material and/or a formulation for production of an insulation system. For example, a formulation for an impregnating agent may include: an impregnating resin comprising a cycloaliphatic epoxy resin having a viscosity of less than 1500 mPas at impregnation temperature; and a curing catalyst deposited in the solid insulation material. The curing catalyst may be reactive toward the cycloaliphatic epoxy groups of the cycloaliphatic epoxy resin in the formulation of the impregnating agent but be sufficiently reactively inert with respect to the functional groups of the tape adhesive likewise present in the solid insulation material to confer storage stability to the solid insulation material.

Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.

Abstract: A laminate can contain a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include an isocyanate group containing compound of formula (1): R1—R2—N?C?O (1), with R1 being a functional group different than the isocyanate group, and R2 being substituted or unsubstituted alkyl or aryl. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.

Abstract: Provided is a hard coating film. The hard coating film includes a base layer and a hard coating layer disposed on the base layer and having a pencil hardness of 4H or higher. A surface elongation at break of the hard coating film falls within a predetermined range, as measured by a certain method. The hard coating film shows excellent durability under high-temperature/high-humidity conditions, has no microcracks formed after repeated folding, and shows excellent pencil hardness.

Abstract: Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz.