Abstract: A polyimide resin film includes: a first layer that contains an imide resin, a bond composition ratio of a sum of a C—N bond and a C—O bond to bonds of all C elements that are present in a surface of the first layer being 4 atm % or more; and a second layer that is provided on the surface of the first layer.
Abstract: The present invention relates to a conductive composition containing a conductive metal powder and a resin component, in which the conductive metal powder contains at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape, and the resin component contains an aromatic amine skeleton.
Abstract: A film having high heat resistance and a low total haze value and yellowness index. The film includes a fluorinated polyimide layer having a total haze value of 4 or lower, a yellowness index of 3 or lower, and a total luminous transmittance of 90% or higher.
Abstract: The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.
Type:
Grant
Filed:
May 10, 2019
Date of Patent:
December 21, 2021
Assignee:
E I DU PONT DE NEMOURS AND COMPANY
Inventors:
Thomas Edward Carney, Jeffrey Michael Bartolin, Meredith L Dunbar, Scott John Herrmann
Abstract: The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190° C. or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 ?m and a b* value in the L*a*b* color system of 10 or lower.
Abstract: A multilayer structure comprising a sealant layer which comprises (a) a blend comprising (i) from 80 to 95 percent by weight of at least one ethylene/?-olefin interpolymer composition which comprises a homogeneously branched linear ethylene polymer composition and a heterogeneously branched linear ethylene polymer composition and (ii) from 5 to 20 percent by weight of at least one high pressure ethylene polymer characterized as having a melt index, I2 less than 6.0 g/10 minutes, a density of at least 0.916 g/cc, a Mw/Mn ratio of at least 7.0, wherein the blend has a melt index, I2, of at least 1.0 g/10 minutes; and (b) a low density polyethylene composition which comprises at least two components selected from the group consisting of homogeneously and heterogeneously branched linear ethylene polymers, wherein the composition has density from 0.90 to 0.930 g/cc and an I2 of from 1 to 50 g/10 minutes is provided.
Abstract: Copolymer dispersions containing polyamide segments in aqueous media form binders for coatings for various industrial and construction materials. The copolymers have a high percentage of amide linkages. The copolymers are linked into higher molecular weight species by reactions with polyisocyanates (which forms urea linkages if the other reactant is an amine or a urethane linkage if the other reactant is a hydroxyl group).
Type:
Grant
Filed:
August 7, 2015
Date of Patent:
September 28, 2021
Assignee:
Lubrizol Advanced Materials, Inc
Inventors:
Gabor Erdodi, Naser Pourahmady, Yutao Yang, Jonathan J. Bird, Israel J. Skoff, Darlene D. Rota, Lisa A. Blevins, Anthony D. Pajerski
Abstract: A film including a polyimide-polybenzoxazole copolymer including a repeating unit represented by Chemical Formula 1: wherein in Chemical Formula 1, A1, A1?, A2, A3, m, and n are the same as described in the specification.
Type:
Grant
Filed:
July 13, 2015
Date of Patent:
September 28, 2021
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Hyun Jeong Jeon, Min Sang Kim, Yoon Seok Ko, Byung Hee Sohn
Abstract: The polyimide resin precursor in the present embodiment is a polyimide resin precursor obtained by allowing a diamine component and a tetracarboxylic acid anhydride component to react with each other, wherein based on the whole of the diamine component, the content of p-phenylenediamine is 75 mol % or more; the tetracarboxylic acid anhydride component includes an ester-containing tetracarboxylic acid anhydride represented by formula (1), and at least one biphenyltetracarboxylic acid anhydride selected from the group consisting of 3,4,3?,4?-biphenyltetracarboxylic acid dianhydride, 2,3,3?,4?-biphenyltetracarboxylic acid dianhydride and 2,3,2?,3?-biphenyltetracarboxylic acid dianhydride; and based on the whole of the tetracarboxylic acid anhydride component, (i) the total of the content of the ester-containing tetracarboxylic acid anhydride and the content of the biphenyltetracarboxylic acid anhydride is 75 mol % or more, and (ii) the content of the ester-containing tetracarboxylic acid anhydride is 15 to 80 mo
Abstract: The invention relates to a polyamide-based surface material having fillers which improve the tribologically active properties, wherein the fillers comprise at least one metal sulfide and/or calcium phosphate. The invention further relates to a three-dimensional molded body consisting of a surface material, produced, in particular, as an injection-molded part or extrusion part and or by additive fabrication.
Type:
Grant
Filed:
November 22, 2017
Date of Patent:
August 24, 2021
Assignee:
KS Gleitlager GmbH
Inventors:
Rolf Reinicke, Ruediger Bickle, Steffen Dick
Abstract: A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (<0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.
Type:
Grant
Filed:
August 17, 2012
Date of Patent:
August 10, 2021
Assignee:
Akron Polymer Systems, Inc.
Inventors:
Limin Sun, Dong Zhang, Jiaokai Jing, Frank W. Harris
Abstract: A method of forming a film is provided, which includes providing a sheet from a polyamide composition; and biaxial stretching of the sheet to form a film, wherein the polyamide composition includes a blend of a first polyamide and a second polyamide. The first polyamide has a repeating unit of and the second polyamide has repeating units of The second polyamide is a crystalline random copolymer. The sheet of the polyamide composition is biaxially stretched at a rate of 20 mm/sec to 100 mm/sec.
Type:
Grant
Filed:
December 24, 2018
Date of Patent:
August 10, 2021
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Abstract: A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.
Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
Abstract: A double coating, curing method, cured coating, and kit are provided. A first layer of the double coating can be a first cure coating composition, which has a first hydroxy-functional resin, a first crosslinking agent, and a first catalyst. A second layer of a second cure coating composition can have a low hydrophilicity acrylic resin as a second hydroxy-functional resin, a second crosslinking agent, and a second catalyst. The first catalyst catalyzes crosslinking between the second hydroxy-functional resin and crosslinking agent, and not between the first hydroxy-functional resin and crosslinking agent. The second catalyst catalyzes crosslinking between the first hydroxy-functional resin and crosslinking agent, and not between the second hydroxy-functional resin and crosslinking agent. The first and/or second hydroxy functional resins can facilitate catalyst migration from one layer to the other. The separate compositions can be shelf-stable and/or the curing can occur at low temperature.
Type:
Grant
Filed:
July 26, 2017
Date of Patent:
June 15, 2021
Assignee:
BASF Coatings GmbH
Inventors:
Timothy S. December, Timothy Clark, Adam M. Ozvald, Donald H. Campbell
Abstract: A tape having a first face comprising a continuous surface of mica paper and a second face comprising a support layer, wherein the mica paper comprises 70 to 99 weight percent mica and 1 to 30 weight percent binder and the support layer comprises a film, a paper, a nonwoven fabric, or a woven fabric; wherein the initial elongation of the support layer is equal to or less than the initial elongation of the mica paper; and wherein the support layer is demountably attached to the mica paper such that when a delamination force of 10 N/10 mm or less is imposed on the support layer it can be separated from the mica paper.
Abstract: The invention relates to a ski boot with an element in shell form, which at least partially consists of a plastics compound material, wherein the compound material comprises a mixture of caprolactam polyamide and ionomers, and to a method for the production thereof, such that cations and anions of the ionomers form ion bonds, wherein elastic components of the compound material form a physical network that is soluble between 60° C. and 100° C., and so the element in shell form of the ski boot that at least partially consists of the compound material can undergo thermoforming below 100° C.
Abstract: Provided is such a conductive member that a change in its electrical resistance value caused by its long-term use is reduced to the extent possible. The conductive member has a conductive support and a conductive layer, the conductive layer contains a rubber composition formed of a modified epichlorohydrin rubber, and the modified epichlorohydrin rubber has a unit represented by the following formula (1). In the formula (1), R1, R2, and R3 each independently represent hydrogen or a saturated hydrocarbon group having 1 to 18 carbon atoms.
Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.