Abstract: A resin composition includes: an ethylene-vinyl ester copolymer saponified product (A); and fatty acid metal salts, wherein the fatty acid metal salts include at least two fatty acid metal salts selected from a fatty acid metal salt having 3 to 12 carbon atoms (B), a fatty acid metal salt having 13 to 20 carbon atoms (C), and a fatty acid metal salt having 21 to 29 carbon atoms (D), and wherein at least one of the fatty acid metal salts selected from the fatty acid metal salts (B), (C), and (D) includes a zinc salt. The resulting resin composition is capable of forming a multilayer structure that has suppressed occurrence of appearance failure and minimized color tone deterioration at the time of its melt molding.

Abstract: The present invention relates to a window cover film and a flexible display panel including the same. More particularly, the present invention relates to a window cover film including a base layer, a hard coating layer, and an anti-fingerprint layer, and a flexible display panel including the same.

Abstract: A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.

Abstract: A container having a barrier layer is provided. The container may be of thermoplastic and the barrier may inhibit materials from leaching from the thermoplastic material or from extraction of compounds from medicants by the thermoplastic. A process is also described that allows for molding thin barrier layers as container lines and for forming thermoplastic containers with barrier liners.

Abstract: A flexible substrate and a manufacturing method thereof and a display device are provided. The flexible substrate has a bending region. The flexible substrate includes a base substrate, and a first organic layer and a second organic layer which are sequentially laminated on the base substrate, and a surface where the first organic layer contacts the second organic layer in the bending region includes a concave-convex structure.

Abstract: The present application can provide a composite material which comprises a metal foam, a polymer component and an electrically conductive filler, has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity, and is also capable of controlling electrical conductivity characteristics.

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.

Abstract: A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.

Abstract: The present invention relates to a polymer film (P) containing a polyamide composition (PC) that comprises an amorphous polyamide (A) and a semicrystalline polyamide (B) and to a method for producing the polymer film (P). The present invention further relates to a method for packaging food products with the polymer film (P).

Abstract: The present invention addresses the problem of providing a desiccant that can be used for passivation of an electronic device such as an organic electroluminescence element against moisture permeation, as well as an organic thin film including the desiccant, an organic layered film in which the organic thin film is layered, and an electronic device that is provided therewith. This desiccant is characterized by including a compound that emits a hydrophobic substance by absorbing water. This organic thin film is characterized by including this desiccant.

Abstract: A display module is provided, which encloses a display assembly by using a flexible cover, thereby sealing a first gap between a backlight housing and a support structure and a second gap between the support structure and a display panel. It can isolate external water vapor and dust from entering an interior of the display assembly, thereby improving the dustproof and waterproof capabilities of the display module, and further improving the reliability of the display module.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.

Abstract: Described are sealing primer compositions that can be used to reduce paint defects such as pops or vapor boil on painted plastic substrates, as well as related methods for sealing plastic substrates, and sealed plastic substrates. Sealing primer compositions of the invention include a functionalized polydiene polymer such as a hydroxylated or other functional-group-containing polybutadiene polymer.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: To provide a laminated stretched polyamide film having excellent an excellent water-resistant adhesive property (water-resistant laminate strength), impact resistance, and pinhole resistance. A laminated stretched polyamide film in which an easily adhesive layer (layer B) is laminated on at least one surface of a base layer (layer A), wherein the layer A contains not less than 70% by mass of polyamide 6, and the layer B contains 0 to 40% by mass of polyamide 6 and 60 to 100% by mass of a polyamide 6 copolymer in which a ratio of a copolymerization component in the copolymer is 3 to 35% by mass.

Abstract: Provided is a composite laminate having excellent releasability from a mold during a production process and having excellent surface appearance (surface smoothness). A composite laminate 1 including an A layer 2 and a B layer 3, the A layer 2 being provided on one or both sides of the B layer 3, the A layer 2 containing inorganic fibers (a1) with an average fiber length of 1 ?m to 300 ?m and a thermoplastic resin (a2), the B layer 3 containing reinforcing fibers (b1) with an average fiber length of 1 mm or more and a thermoplastic resin (b2).

Abstract: An active energy ray-curable resin composition containing: a reaction product (X) of a component (A) and a component (B) below: (A) at least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine; (B) at least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (1) and derivatives of the unsaturated carboxylic acids: wherein, in the formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbon atoms, an aryl group having from 6 to 12 carbon atoms, or an aralkyl group having from 7 to 13 carbon atoms; (C) a compound having at least one group selected from the group consisting of a glycidyl group and an isocyanate group, and an ethylenically unsaturated bond-containing group; and (D) a phosphoric acid derivative having an ethylenically unsaturated bond-containing group.

Abstract: A member for semiconductor manufacturing apparatuses, which includes a ceramic electrostatic chuck and a cooling plate bonded together with a thermosetting sheet, is provided. The thermosetting sheet is made of a cured epoxy-acrylic adhesive. The adhesive contains (A) an epoxy resin capable of hydrogen transfer type polyaddition, (B) an acrylate or methacrylate polymer, and (C) a curing agent.