Abstract: A method for forming a deposition film by introducing a starting gas for formation of a deposition film into a reaction chamber housing a substrate therein and forming a deposition film on the substrate by irradiation with light comprises performing deposition by using a monochromatic light and a continuous polychromatic light in combination and projecting the lights on the substrate on which the deposition film is to be formed.

Abstract: A process for forming a covering film of a synthetic resin on a substrate comprising, under vacuum conditions, evaporating at least two monomers to cause vapors of said at least two monomers to adhere to the substrate, and polymerizing said at least two monomers on said substrate.An apparatus for carrying out the process includes a vacuum chamber and provided therein, means for holding and evaporating at least two raw material monomers for the synthetic resin, means for holding and heating the substrate and a shutter for separating the means for holding the monomers and the means for holding the substrate. The means for holding and heating the monomers can be provided outside the vacuum chamber and a window can be provided in a wall of the chamber to allow the substrate to be irradiated from a light source located outside the chamber.

Abstract: A process for the production of heat-sensitive recording materials is described, comprising the steps of (1) applying to a support a coating composition comprising a color former, a color developer, and at least one of a water-soluble binder and a water-dispersible binder, to form a layer, and (2) irradiating the layer with electron beams. Images recorded on the heat-sensitive recording material exhibit superior stability. The color density of the recorded images remains stable even when the recording material is moistened with water or placed in a high humidity atmosphere. Further, even moistened recorded images do not disappear when rubbed with a finger.

Abstract: A method of making a region exhibiting a range of compositions, comprising plasma spraying various compositions on top of one another onto a base.

Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) poly(phenylene oxide) (PPO) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer containing at least one ethylenically unsaturated group and (c) a mixture of (a) and (b); said liquid reactive plasticizer being capable of solvating the PPO at the fluxing temperature and being present in an amount ranging from 5 to 2,000 parts per 100 parts by weight of (1); and(3) 0.01 to 10% by weight of (2) of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset after the crosslinking reaction.

Abstract: Physical method for the treatment of the surfaces of polyolefinic plastic laminates, polytetrafluoroethylene (PTFE), cardboards and metal sheets such as, particularly, aluminium and tinplate, of any thicknesses and widths, by means of a flame produced by the combustion of a mixture of air-hydrocarbon gas, characterized in that such a mixture is enriched with pure oxygen gas.

Abstract: A boron nitride (BN) film is disclosed having excellent electrical insulating and heat conduction characteristics and capable of acting as seeds for epitaxially growing a semiconductor film thereon which has a crystallizability sufficient to incorporate a semiconductor element therein. The BN film is formed by the growth on a substrate in a manner to be preferentially orientated to a predetermined axis thereof. A process for preparing such film is also disclosed.

Abstract: A process for the reduction of defect formation in conductive layers of semiconductor bodies during patterning, alloying and passivation. A film of low temperature spin-on-glass containing dye is formed on the conductive layer prior to patterning and any high temperature process greater than 200 degrees C. Hermetic passivation is achieved by depositing on the conductive layer a composite film consisting of a lower, tensile layer and an upper, compressive layer with the net force of the passivation film being tensile.

Abstract: Copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium can be deposited by photoredox reaction on semiconductor sulfide powders by irradiating a suspension of semiconductor sulfide powder in the presence of oxygen and optionally CO.sub.2, of an oxidizable system which optionally protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium.

Abstract: The invention comprises an improvement in the process of manufacturing an integrated circuit structure having stepped topography which comprises coating the integrated circuit structure with a polymerizable material in the substantial absence of a solvent and then polymerizing the material to provide a substantially planar surface on the integrated circuit structure.

Abstract: Small, preferably micronsized hollow glass or ceramic spheres or foaming agents for making such micronsized hollow spaces or voids are incorporated into a resin material which is formed into a layer and after curing of the resin layer, it is abraded, sand or grit blasted so as to rupture the outermost layer of spheres or voids to provide a plurality of undercuts or nooks and crannies. A thermally sprayed metal, such as copper, becomes embedded into the undercuts pores, nooks and crannies, such that the bond or adherent strength is greatly improved. This micronsized glass, ceramic spheres and/or pores greatly increases the bond strength by providing better undercuts in the surface to be sprayed by molten metal and provide the capability of depositing thicker layers without jeopardizing the bond.

Abstract: A process and product is presented for obtaining selective areas of distinctive appearance, i.e., matting on synthetic coverings. The process includes, depositing a polymeric coating which contains at least one radiation initiator for polymerization onto at least a first selected area or zone on an expandable or non-expandable support substrate. Next, at least one second coating comprised of a crosslinkable monomer is deposited onto a second selected area on the substrate. This second area or zone may encompass at least a portion of the first area. Thereafter, pre-gelling is performed on the deposited material followed by a graining operation which is carried out over at least a portion of the substrate surface. The synthetic covering in the first zone or area is then polymerized by radiation initiation wherein the particular appearance thereof is fixed to the substrate. Thereafter, gelling is carried out wherein the polymer which has not been fixed by radiation initiation will flow, i.e.

Abstract: A method of depositing a semiconductor alloy film onto a substrate by activating groups of free radicals and incorporating desired ones of the activated groups into the film.

Abstract: A method for recording and storing information in a hydrogenated amorphous silicon device, comprising: depositing hydrogenated amorphous silicon on a substrate to form a charge-collection device; and generating defects in the hydrogenated amorphous silicon device, wherein the defects act as recombination centers that reduce the lifetime of carriers, thereby reducing charge-collection efficiency; and thus in the charge-collection mode of scanning probe instruments, regions of the hydrogenated amorphous silicon device that contain the defects appear darker in comparison to regions of the device that do not contain the defects, leading to a contrast formation for pattern recognition and information storage, in the device, which darkened areas can be restored to their original charge-collection efficiency by heating the hydrogenated amorphous silicon to a temperature of about 100.degree. C. to 250.degree. C. for a sufficient period of time to provide for such restoration.

Abstract: Edge termination of monolithic capacitors having thin electrode layers bonded in dielectric resin is accomplished by ashing away some resin to expose electrode edge surfaces, plating the edge surfaces by vapor deposition, and depositing a conductive layer on the coating by electroless plating, schooping or applying conductive epoxy.

Abstract: An absorber plate designed to be located in a gap between fuel rod bundles in the core of a boiling water reactor is manufactured by anchoring a burnable neutron-absorbing material to at least one sheet by spraying the absorbing material in finely-divided melted or plastically-formable state onto the sheet, to create a solidified layer of the absorbing material, and by enclosing the absorbing material, thus anchored, in a protective casing.

Abstract: A process of manufacturing a high-efficiency, stable CdS-Cu.sub.2 S solar cell using a thick film methodology, which process comprises the steps of: A--preparing a CdS slurry from a Cd-doped, CdS powder; B--depositing a 10-15.mu. thick layer of the CdS slurry onto a substrate plated with thin layers of Zn and Cd; C--drying the CdS layered substrate and subjecting it to heat treatment; D--pressing the heat-treated substrate; E--subjecting the pressed, CdS layered substrate to another heat treatment to cause CdS recrystallisation and annealing; F--forming a thin layer of Cu.sub.x S wherein the value of x is from 1.996 to 2, onto the surface of the heat-treated, CdS layered substrate under an inert atmosphere to produce a CdS-Cu.sub.x S layered assembly; G--subjecting the CdS-Cu.sub.x S layered assembly to heat treatment under a H.sub.2 atmosphere in the presence of CaO; H--providing an upper conductor onto the upper surface of the heat treated assembly to complete the desired, stable CdS-Cu.sub.

Abstract: Complex shapes are coated with material at least in part evaporated from an elongated electrode shaped to conform to the substrate and juxtaposed therewith over the length of the electrode. An arc is struck at one end and depositions occur over a surface of the electrode which recedes from the arc. The other end of the electrode is heated to maintain the electrode during deposition at a constant temperature.

Abstract: A laser or other light beam is directed onto an optical substrate while an optical coating is being vacuum deposited thereon. The laser has a wavelength at or near that at which a reduced absorptance of the coating is desired. In one embodiment, the substrate is heated electrically. Thin film optical coatings having a substantially lowered absorptance are made in this manner.

Abstract: A coating of wear resistant tungsten carbide is applied to a photo-etched roto-gravure cylinder, the coating having a thickness in the range of from 15 to 35 microns. Tungsten carbide powder is supplied to a plasma flame spray gun by means of a powder feeder which supplies powder particles at a uniform density and at given sizes. The feeder comprises a hopper having air inlet and outlet passages and vertically spaced porous membranes which confine the powder and permit the passage of air. Air flow through the hopper suspends the powder particles of a desired diameter range adjacent a spray gun feed conduit. When copper cylinders are to be coated, the surface is allowed to oxidize to promote a chemical bonding of the coating to the surface.