Abstract: A method for depth controlled ion milling, the method may include (a) ion milling a calibrated area and a target area; wherein the ion milling comprises exposing an interior of the calibrated area to provide an exposed interior of the calibrated area; wherein the target area comprises a buried region of interest that is positioned at a certain depth; wherein the calibrated area comprises a certain layer that is positioned at the certain depth; wherein the certain layer is visually distinguishable from another layer of the calibrated area that is precedes the certain layer; (ii) monitoring a progress of the milling by viewing the exposed interior of the calibrated area; and (iii) controlling of the ion milling based on an outcome of the monitoring.

Abstract: A method for forming a SiC film on a target substrate by ALD, comprises: activating a surface of the target substrate by activation gas plasma which is plasmatized an activation gas; and forming a SiC film by supplying a source gas containing a precursor represented by a chemical formula RSiX13 or RSiHClX2 onto the target substrate whose the surface is activated by activating the surface of the target substrate, where, R is an organic group having an unsaturated bond, X1 is selected from a group consisting of H, F, Cl, Br and I, and X2 is one selected from a group consisting of Cl, Br and I.

Abstract: A sputtering method of forming a thin film by allowing a target material to react with a gas includes narrowing down film deposition conditions from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.

Abstract: The present invention relates to an equipment and method for producing polymer pellets which comprise one or more polymer components and one or more further components, wherein in said process at least one of said one or more further components is incorporated into pellets by applying a liquid, which comprises said at least one component, onto said pellets.

Abstract: A method of using a flowable binder for construction or repair comprises providing a binder mixture including an alkali metal silicate, fly ash, slag, and added water, where a total water-to-solids mass ratio of the binder mixture is in a range from about 0.2 to 0.5. The binder mixture is mixed together with inert particles to form a flowable mortar. The flowable mortar is distributed over a bed of coarse aggregate, and the mortar seeps into interstices of the coarse aggregate. Upon curing, a composite comprising reinforcement material embedded in a cured binder is formed.

Abstract: The invention discloses a method for adhering a metal layer to a polymer substrate. The metal layer is deposited on a sacrificial substrate of a mold to form part of an interior surface of the mold, and a solution of monomers is deposited on the metal layer. The monomers are then polymerized together to form the polymer substrate on the metal layer. Then the polymer substrate is removed from the mold such that the metal layer is removed from the mold and adhered to the polymer substrate.

Abstract: The present invention provides a color film and a method of forming the same. In some embodiments, only one titanium target is used, and a flowrate of nitrogen gas, a working pressure, a sputtering power and a sputtering time are adjusted, so as to form single-layered titanium oxynitride color films having different colors and thicknesses. The color film has satisfactory adhesivity, a flat surface and metallic luster.

Abstract: The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

Abstract: A method and associated system for repairing a reinforced polymer-infused fiber composite. The method includes providing a resin infusion device having resin components contained in a flexible, sealed container, positioning a dry fiber reinforcement onto a base layer repair location, providing at least one resin conduit connecting the resin container to a first end of the dry fiber reinforcement, providing at least one vacuum conduit connecting a vacuum source to a second end of the dry fiber reinforcement, covering and sealing the base layer repair location with a vacuum enclosure affixed to the base layer repair location, creating a vacuum environment at the base layer repair location via the vacuum conduit, infusing the dry fiber reinforcement with a reactive mixture of the resin components under vacuum conditions via the resin tubing to form a resin-infused fiber reinforcement, and curing the resin-infused fiber reinforcement inside the vacuum enclosure.

Abstract: A galvanically decorated component made of plastic has a galvanically applied chrome layer, wherein the chrome layer is processed with a laser in such a way that a mechanically applied brush structure or structure is reproduced on the surface. The component decorated in this way satisfies all requirements in accordance with the respective test specifications of the planned area of application. A method produces a plastic component having a structured surface. Components of this type made of plastic for the automotive industry are substantially decorative and operative elements.

Abstract: The disclosure relates to a sequential infiltration synthesis for treatment of infiltrateable material. Examples of the disclosure provide a method of forming a structure that includes providing the substrate with a infiltrateable material in a reaction chamber and infiltrating the infiltrateable material with infiltration material during one or more infiltration cycles.

Abstract: Methods of and systems for dispensing dust suppressant are provided. The methods comprise forming an aqueous dispersion stream by delivering a surfactant composition to an aqueous liquid stream. The aqueous dispersion stream is mixed to form a dust suppressant. The dust suppressant is dispensed to a surface at a pressure sufficient to provide coverage of the surface. Surface tension of the dust suppressant is measured via a tensiometer, and the measurement is relayed to a controller. The forming of the aqueous dispersion stream is adjusted according to the measured surface tension relayed to the controller. The systems are configured to carry out one or more of the provided methods.

Abstract: An insulator-type substrate is positioned on a support surface of a substrate support structure in exposure to a plasma. An initial clamping voltage is applied to an electrode within the substrate support structure to rapidly accumulate electrical charge on the support surface to hold the substrate. A backside cooling gas is flowed to a region between the substrate and the support surface, and a leak rate of the backside cooling gas is monitored. A steady clamping voltage is applied to the electrode, and the steady clamping voltage is adjusted in a step-wise manner to maintain the monitored leak rate of the backside cooling gas at just less than a maximum allowable leak rate. Or, a pulsed clamping voltage is applied to the electrode, and the pulsed clamping voltage is adjusted to maintain the monitored leak rate of the backside cooling gas at just less than the maximum allowable leak rate.

Abstract: A coating device has: a die head that is provided with a supply port into which a coating slurry is supplied, a manifold that stores the coating slurry, and a slit that dispenses the coating slurry; a supply pipe that is connected to the supply port of the die head; and a cover plate that is provided in the supply port or the supply pipe and that reduces the flow rate of the coating slurry at the center of a cross-section that is orthogonal to the direction in which the coating slurry in the supply port or the supply pipe flows into the die head.

Abstract: A method of controlling a position of an adjustable nozzle includes depositing a film on a surface of a wafer. The method includes measuring a thickness profile of the surface of the wafer. The method includes comparing the measurement of the thickness profile with a reference value using a control unit. The method includes transmitting a control signal to the adjustable nozzle to alter the position of the adjustable nozzle based on the result of the comparison. The adjustable nozzle includes a base having a hollow center portion for conducting gas, the base configured for connection to a gas source. The adjust nozzle includes a tip coupled to the base and having an opening for conducting gas from the base to the exterior of the nozzle, wherein the base is configured for pivoting about a longitudinal axis of the base in response to the control signal.

Abstract: A method of processing a material layer on a substrate is provided. The method includes delivering RF power from an RF power source through a match network to a showerhead of a capacitively coupled plasma chamber; igniting a plasma within the capacitively coupled plasma chamber; measuring one or more phase angles of one or more harmonic signals of the RF power relative to a phase of a fundamental frequency of the RF power; and adjusting at least one phase angle of at least one harmonic signal of the RF power relative to the phase of the fundamental frequency of the RF power based on the one or more phase angle measurements.

Abstract: A monolithic method of forming an electrochromic (EC) pane unit, the method including: forming a first electrode via a solution deposition process, on a first conductive layer disposed on a transparent first substrate, forming an electrolyte layer on the first electrode via a sol-gel process, forming a second electrode on the electrolyte layer via a solution deposition process, and forming a second conductive layer on the second electrode.

Abstract: The present disclosure relates to an apparatus for manufacturing flexible printed circuit board (FPCB) and method for manufacturing the FPCB, having no limitations of length of a circuit pattern being formed on a base film.

Abstract: A method for manufacturing a capacitive deionization electrode exhibits enhanced ionic material adsorption efficiency. The method includes (a) kneading an electrode active material while adding a solvent to the electrode active material; (b) adding a solvent to the mixture obtained after (a) and stirring the result; and (c) preparing an electrode slurry by adding a binder to the mixture obtained after (b) and stirring the result. According to the method, a problem of a binder blocking electrode pores, which used to occur when using existing methods, is resolved by increasing mixing efficiency of the binder while using an electrode active material having a high specific surface area. A capacitive deionization electrode having very superior ionic material adsorption efficiency may be manufactured using the method.

Abstract: The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.