Abstract: A method for bending a surgical rod using an automated bending system includes receiving an indication of a plurality of line segments defined on the rod and an indication of an angle measurement to be formed between at least two adjacent ones of the plurality of line segments. Bending parameters to perform on the rod to form the angle measurement between the at least two adjacent ones of the plurality of line segments are determined and operation of the automated bending system is controlled using the bending parameters to create an angle having the angle measurement between the at least two adjacent ones of the plurality of line segments.

Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, treating a surface of the metal structure to form a monolayer coating of a selected chemical composition on the surface, and coating the treated surface with an organic material.

Abstract: A winding device for manufacturing an electrode assembly is provided. The winding device includes a main body portion; a winding core for winding an electrode and a separation film; and a foreign particle remover connected to the main body portion and removing foreign particles, wherein the foreign particle remover is formed to surround the winding core while separated from the winding core.

Abstract: An electronic component supply device, comprising: a tape feeder configured to feed out a taped electronic component and supply an electronic component; and a holding mechanism arranged to handle the tape feeder and configured to hold a container for accommodating the taped electronic component supplied to the tape feeder, in which the holding mechanism is configured to hold the container having a width larger than the width of the tape feeder.

Abstract: A method of forming a piezoelectric thin film includes sputtering a first surface of a substrate to provide a piezoelectric thin film comprising AlN, AlScN, AlCrN, HfMgAlN, or ZrMgAlN thereon, processing a second surface of the substrate that is opposite the first surface of the substrate to provide an exposed surface of the piezoelectric thin film from beneath the second surface of the substrate, wherein the exposed surface of the piezoelectric thin film includes a first crystalline quality portion, removing a portion of the exposed surface of the piezoelectric thin film to access a second crystalline quality portion that is covered by the first crystalline quality portion, wherein the second crystalline quality portion has a higher quality than the first crystalline quality portion and processing the second crystalline quality portion to provide an acoustic resonator device on the second crystalline quality portion.

Abstract: Provided is a device for manufacturing a stator, the device including a winding jig configured to wind a coil and to manufacture a winding coil, and an insertion jig configured to receive the winding coil from the winding jig and to insert the winding coil into a stator core, wherein the winding jig comprises a body extending along a longitudinal direction (L1), a power supply unit configured to make the body revolve around a central shaft of the body, and a protrusion formed on a surface of the body.

Abstract: A SAW device manufacturing method includes a piezoelectric ceramic substrate polishing step of polishing a first surface of the piezoelectric ceramic substrate, a support substrate polishing step of polishing a first surface of the support substrate, a bonding step of bonding the first surface of the piezoelectric ceramic substrate to the first surface of the support substrate to thereby form a stacked substrate, a grinding step of grinding a second surface of the piezoelectric ceramic substrate, and a vibration diffusion layer forming step of applying a laser beam to the stacked substrate in the condition where the focal point of the laser beam is positioned inside the piezoelectric ceramic substrate to thereby form a modified layer as a vibration diffusion layer inside the piezoelectric ceramic substrate.

Abstract: A device is provided for aligning a ribbon cable relative to an electrical connector to crimp the electrical connector onto the ribbon cable with a tool. The device includes a side portion and a central piece. The side portion includes an upper end and a cable track having a width sized to receive the ribbon cable. The central piece is coupled to the side portion and includes an upper surface. The upper surface of the central piece and the upper end of the side portion at least partially define a connector retaining segment sized to receive the electrical connector.

Abstract: A method of manufacture for an acoustic resonator device. The method includes forming a nucleation layer characterized by nucleation growth parameters overlying a substrate and forming a strained piezoelectric layer overlying the nucleation layer. The strained piezoelectric layer is characterized by a strain condition and piezoelectric layer parameters. The process of forming the strained piezoelectric layer can include an epitaxial growth process configured by nucleation growth parameters and piezoelectric layer parameters to modulate the strain condition in the strained piezoelectric layer. By modulating the strain condition, the piezoelectric properties of the resulting piezoelectric layer can be adjusted and improved for specific applications.

Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.

Abstract: A packaging method and a packaging structure of a film bulk acoustic resonator are provided. The packaging method includes: providing a resonant cavity main structure including a first substrate and a film bulk acoustic resonant structure having a first cavity formed therebetween; forming a resonator cover by providing a second substrate and forming an elastic bonding material layer containing a second cavity; bonding the resonant cavity main structure and the resonator cover together through the elastic bonding material layer and removing elasticity of the elastic bonding material layer, where the second cavity is at least partially aligned with the first cavity; forming a through-hole penetrating through the resonator cover and exposing a corresponding electrical connection part of the film bulk acoustic resonant structure; and forming a conductive interconnection layer on a sidewall of the through-hole and on a portion of a surface of the resonator cover.

Abstract: A system for separating terminals (e.g., electrical terminals) from a terminal strip includes a shear tool movably mounted to a frame for selectively shearing the terminal from the terminal strip. A primary shear depressor is provided for driving the shear tool from an initial position to an intermediate position during which the terminal is sheared from the terminal strip. A secondary shear depressor is movably mounted to the primary shear depressor for driving the shear tool from the intermediate position after the terminal has been sheared from the terminal strip, to a final position.

Abstract: A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

Abstract: A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.

Abstract: A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

Abstract: Electric coils and a method of insulating electric coils comprises copper wire with insulation, turn tape (e.g., B stage), film tape, and armor tape. In a preferred embodiment, the tape is hot-pressed after application of the B stage turn tape and again just prior to the application of the armor tape.

Abstract: A battery manufacturing method includes forming a unit cell having a positive electrode that is obtained by a positive electrode active material layer containing an electrolytic solution being disposed on a positive electrode current collector, a negative electrode that is obtained by a negative electrode active material layer containing an electrolytic solution being disposed on a negative electrode current collector, and a separator interposed between the positive electrode and the negative electrode. The battery manufacturing method further includes applying pressure to one unit cell or with two or more stacked unit cells from the stacking direction, and charging the one unit cell or the two or more stacked unit cells after applying of the pressure. The method is performed such that the positive electrode and the negative electrode are formed without an application film being subjected to a drying process performed through heating.

Abstract: A bulk acoustic wave resonator and a method of manufacturing the same are provided. The bulk acoustic wave resonator includes: a first carrier substrate; a barrier layer on a main surface of the first carrier substrate and configured to prevent an undesired conductive channel from being generated due to charge accumulation on the main surface; a buffer layer on a side of the barrier layer away from the first carrier substrate; a piezoelectric layer on a side of the buffer layer away from the barrier layer; a first electrode and a second electrode on opposite sides of the piezoelectric layer; a first passivation layer and a second passivation layer, respectively covering sidewalls of the first electrode and the second electrode; a dielectric layer between the first passivation layer and the buffer layer, wherein a first cavity is provided between the first passivation layer and the dielectric layer.

Abstract: A method of forming a piezoelectric thin film can include depositing a material on a first surface of a Si substrate to provide a stress neutral template layer. A piezoelectric thin film including a Group III element and nitrogen can be sputtered onto the stress neutral template layer and a second surface of the Si substrate that is opposite the first surface can be processed to remove that Si substrate and the stress neutral template layer to provide a remaining portion of the piezoelectric thin film. A piezoelectric resonator can be formed on the remaining portion of the piezoelectric thin film.

Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.