Abstract: An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

Abstract: The unloading operation of winding the carrier tape on the component supply reel by driving the component supply reel to extract the component supply reel from the tape feeder is performed. That is, the carrier tape removed from the tape feeder is wound on the component supply reel. Thus, it is possible to suppress the interference of the preceding tape removed from the tape feeder with the succeeding tape.

Abstract: A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.

Abstract: The present invention discloses a grain boundary diffusion method of an R—Fe—B series rare earth sintered magnet, an HRE diffusion source, and a preparation method thereof, comprising the following steps: engineering A of forming a dry layer on a high-temperature-resistant carrier, the dry layer being adhered with HRE compound powder, the HRE being at least one of Dy, Tb, Gd, or Ho; and engineering B of performing heat treatment on the R—Fe—B series rare earth sintered magnet and the high-temperature-resistant carrier treated with the engineering A in a vacuum or inert atmosphere and supplying HRE to a surface of the R—Fe—B series rare earth sintered magnet. The method can reduce the consumption of heavy rare earth element and control the loss of residual magnetism Br while increasing the coercivity.

Abstract: The method and apparatus comprise the following features: —forming coil members (21) by bending an electric conductor (20) externally coated with an outer insulation (20?); wherein the bending is made at predetermined lengths from a reference position (16?), and wherein each one of the coil members (21), when formed, comprises at least one head portion (21?) and leg portions (21?) extending from said at least one head portion (21?); —feeding the electric conductor (20) to accomplish the bending; —cutting the electric conductor (20) to detach a formed coil member (21) from said electric conductor (20); —inserting the leg portions (21?) of the coil members (21) into slots of the stator, so that parts of said leg portions (21?) extend from one end of the stator and the head portions (21?) extend from an opposite end of the stator; —arranging at least one laser beam (13?a, 13?b) to remove the insulation (20?) from predetermined areas (20a, 20b) of the electric conductor (20); —radiating the surface of the electri

Abstract: A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.

Abstract: A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.

Abstract: A method of making a data centre is disclosed, comprising making a data centre in an existing building (3010) having a floor, walls and a roof, an air inlet and an air outlet. The method includes: installing prefabricated data centre elements by (a) connecting to the inlet an air handling module (3001, 3002); and (b) installing cold aisle services modules (3011) each having one or more integrated blanking portions and one or more data centre services extending along its length terminating with a connection to an adjacent module (3011); and installing racks of IT equipment arranged in parallel rows; the method being so performed that the floor, racks, and cold aisle services modules (3011) together define parallel cold aisles for entraining cooling air flows to the IT equipment. Also disclosed are a data centre, a service carrying frame and a cold aisle services module for a data centre and a supporting frame for supporting prefabricated data centre elements.

Abstract: An apparatus (102) for holding at least one elongated workpiece (106) to be crimped, wherein the apparatus comprises a holder frame (122), a guide member (124) and a locator element (114) having at least one holder surface (116) defining an elongated cavity (118) for receiving and holding the workpiece. The holder frame is arranged to hold the guide member and the locator element, the at least one elongated cavity having a longitudinal main extension (120). The locator element is movable in a first guide (126) in the direction (127) of the longitudinal main extension. The guide member is movable in a second guide (128) in relation to the locator element in a direction (129) perpendicular to the direction (127) of the longitudinal main extension. The guide member and the locator element are slidably engaged with one another.

Abstract: A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.

Abstract: A die clearance monitoring system includes a light source, a light detector, and a controller. The light source is disposed along a front side of a die set of a crimping device and emits light towards the die set. The die set includes a first crimp die and a second crimp die that engage and crimp an object along a crimp stroke. The light detector is disposed along a rear side of the die set. The light detector receives the emitted light from the light source that traverses across the die set through a gap defined between the first and second crimp dies and generates light absorption data based on the emitted light that is received. The controller is communicatively connected to the light detector. The controller processes the light absorption data to determine a relative spacing between the first crimp die and the second crimp die.

Abstract: A pair of crimping pliers for crimping, in particular for crimp joining, workpieces, has two oppositely arranged pressing jaws and two pliers jaws, wherein one pliers jaw is stationary and the associated pressing jaw is fastened to this stationary pliers jaw by means of a spring-loadable holder part. The holder part is fixedly connected at its end farthest from the pressing jaw to the pliers jaw. Between the stationary connection and the end of the holder part closest to the first pressing jaw, a stop connection is formed between the stationary pliers jaw and the holder part and comes into effect when a predetermined pressing force is exceeded.

Abstract: A method of fabricating a bonded wafer with low carrier lifetime in silicon comprises providing a silicon substrate having opposing top and bottom surfaces, modifying a top portion of the silicon substrate to reduce carrier lifetime in the top portion relative to the carrier lifetime in portions of the silicon substrate other than the top portion, bonding a piezoelectric layer having opposing top and bottom surfaces separated by a distance T over the top surface of the silicon substrate, and providing a pair of electrodes having fingers that are inter-digitally dispersed on a top surface of the piezoelectric layer, the electrodes comprising a portion of a Surface Acoustic Wave (SAW) device. The modifying and bonding steps may be performed in any order. The modified top portion of the silicon substrate prevents the creation of a parasitic conductance within that portion during operation of the SAW device.

Abstract: A feeder including: a feeder main body with a supply position, the feeder being configured to supply an electronic component from an electronic component housing section that houses many of the electronic components one by one to the supply position; and a handle attached to an upper surface of the feeder main body, the handle being made from a flexible strip member so as to be able to change shape.

Abstract: The invention relates to a method for producing stranded wires, including the steps of applying an insulation layer to lines, separating the insulated lines, individually removing the insulation layer from the separated lines along a partial length of the lines, and bringing the lines together to form a stranded wire, wherein the partial lengths are arranged at the same level at least in sections for the purpose of forming a non-insulated contact region.

Abstract: A work machine including: a tape feeder with taped lead components having multiple leads to supply the lead components in a state of being detached from the taped components extended to a supply position; a mounting head to mount the lead components supplied by the tape feeder onto a board; an imaging device; and a control device having an imaging section to image an identification object, the identification object being on the taped components and capable of identifying the polarity of each of the multiple leads, and a determination section to determine whether an actual polarity disposition, which is the polarity disposition of each of the multiple leads, and a set polarity disposition, which is the polarity disposition of each of the multiple leads set in advance, match each other based on image data obtained by imaging with the imaging section.

Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.

Abstract: The invention relates to pressing or crimping pliers (1). According to the invention a spring device (35) (which is e.g. embodied as U-shaped leaf spring (36)) is used in the crimping pliers. In an equilibrium position (48) the leaf spring (36) is trapped between stops (49, 50). If the pressing or crimping pliers (1) are moved from the equilibrium position (48) in closing direction the leaf spring (36) is biased by a follower (54) such that the leaf spring (36) generates an opening force. In reversed direction the opening movement of the pressing or crimping pliers (1) from the equilibrium position (48) leads to a bias of the leaf spring (36) by a follower (55) such that the leaf spring is able to generate a closing force. According to the invention it is possible to provide that the pressing or crimping pliers (1) automatically and elastically open when reaching the closed position.

Abstract: A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.

Abstract: A method of forming a piezoelectric thin film includes sputtering a first surface of a substrate to provide a piezoelectric thin film comprising AlN, AlScN, AlCrN, HfMgAlN, or ZrMgAlN thereon, processing a second surface of the substrate that is opposite the first surface of the substrate to provide an exposed surface of the piezoelectric thin film from beneath the second surface of the substrate, wherein the exposed surface of the piezoelectric thin film includes a first crystalline quality portion, removing a portion of the exposed surface of the piezoelectric thin film to access a second crystalline quality portion that is covered by the first crystalline quality portion, wherein the second crystalline quality portion has a higher quality than the first crystalline quality portion and processing the second crystalline quality portion to provide an acoustic resonator device on the second crystalline quality portion.