Patents Examined by Joshua D Anderson
  • Patent number: 11678473
    Abstract: A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: June 13, 2023
    Assignee: Concord Electronics, Inc.
    Inventors: Agustin Flores, Richard Guiterrez, Omar Gonzalez
  • Patent number: 11677372
    Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include a dielectric protection layer (DPL) that protects the piezoelectric layer from etching processes that can produce rough surfaces and reduces parasitic capacitance around the perimeter of the resonator when the DPL's dielectric constant is lower than that of the piezoelectric layer. The DPL can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, or both.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: June 13, 2023
    Assignee: Akoustis, Inc.
    Inventors: Dae Ho Kim, Frank Zhiquang Bi, Mary Winters, Abhay Saranswarup Kochhar, Emad Mehdizadeh, Rohan W. Houlden, Jeffrey B. Shealy
  • Patent number: 11653483
    Abstract: Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: May 16, 2023
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Julian M. Alzate, Cameron Scott Soller, Bryan Gentry, Kyle Ellis Hildenbrand
  • Patent number: 11652460
    Abstract: Provided is a method of manufacturing a bulk acoustic wave resonator, which includes: providing a piezoelectric substrate for forming a piezoelectric layer; forming a first electrode structure on the portion of the piezoelectric substrate for forming the piezoelectric layer; forming a dielectric layer on the first electrode structure, and performing a patterning process on the dielectric layer to form a patterned dielectric layer comprising a sacrificial dielectric part and a periphery dielectric part; forming a boundary layer on the patterned dielectric layer, the boundary layer covering a surface of the patterned dielectric layer and surrounding the sacrificial dielectric part; thinning the piezoelectric substrate to form the piezoelectric layer, the first electrode structure being located at a first side of the piezoelectric layer; forming a second electrode structure on a second side of the piezoelectric layer; and removing the sacrificial dielectric part to form a resonant cavity.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: May 16, 2023
    Assignee: Newsonic Technologies
    Inventor: Jian Wang
  • Patent number: 11631957
    Abstract: The invention relates to a crimping pliers die (1) comprising two die half units (2, 3). The die half units (2, 3) are guided by a guide (51) relatively to each other over the crimping stroke. Crimping surfaces (40, 41) of the die halves (5) are formed by front surfaces of engaging ribs (37). The guide (51) comprises a guiding rod (43) formed by an end-sided thickening (42) of a rib (37) and/or the guide (51) comprises a guiding recess (50) formed by a guiding recess section (45) which connects two ribs (37) to each other. The crimping pliers die (1) can be used for crimping pliers which can e. g. be used for crimping wire end sleeves.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 18, 2023
    Assignee: WEZAG GmbH & Co. KG
    Inventors: Thomas Glockseisen, Roman Zinser
  • Patent number: 11617288
    Abstract: The feeder management device is a device that manages selection of a tape feeder to be set at each set position defined for each component in a component feeding unit of a component-mounting device. The feeder management device includes a memory unit and a feeder selection management unit. The memory unit stores list information indicating, for each component, whether or not to use a tape feeder of a special type among a plurality of tape feeders different in method of supplying the component storage tape, the tape feeder of the special type supplying the component storage tape easily. The feeder selection management unit refers to the list information stored in the memory unit, and manages selection of the tape feeder for each component, the selection corresponding to each set position in the component feeding unit of the component-mounting device.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 28, 2023
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Masaki Higashino, Toshihiro Michizoe
  • Patent number: 11612089
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: March 21, 2023
    Assignee: Assembleon B.V.
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • Patent number: 11596090
    Abstract: The control device of a tape feeder, during the loading processing, in a case in which carrier tape that is preadjusted such that a length from a first cavity, which houses the electronic component and which is first from the leading end of the carrier tape among the multiple cavities, to the leading end of the carrier tape is a regulated length is inserted into the insertion section, starts conveyance of the carrier tape and makes a position of the first cavity a specified position in the feeder main body in accordance with a detection result of the detection sensor.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: February 28, 2023
    Assignee: FUJI CORPORATION
    Inventors: Hiroyasu Ohashi, Hiroki Murase
  • Patent number: 11569790
    Abstract: Methods for forming a film bulk acoustic resonator (FBAR) are provided. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the disclosure, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 31, 2023
    Assignee: Ningbo Semiconductor International Corporation
    Inventor: Xiaochuan Wang
  • Patent number: 11570941
    Abstract: There is provided a component feeding device including multiple component replenishing devices configured to replenish with components having different shapes; multiple stages on which the components replenished from the multiple replenishing devices are scattered, and a control section configured to cause the multiple replenishing devices to replenish the components to the respective stages at an arbitrary timing. There is provided a component feeding method for supplying components, having different shapes and being respectively replenished onto multiple stages from multiple replenishing devices, to a component mounting device with the components being respectively scattered on the multiple stages, wherein amounts of the components is capable of being respectively changed for each of the multiple stages.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: January 31, 2023
    Assignee: FUJI CORPORATION
    Inventor: Shinya Terasawa
  • Patent number: 11569716
    Abstract: A coil forming apparatus includes: a coil winding jig being configured to wind the belt-shaped coil by inserting the plurality of straight portions of the belt-shaped coil into a respective one of the plurality of comb-shaped grooves; a coil conveying mechanism that pivotally conveys the belt-shaped coil; and guide members that guide the belt-shaped coil in an arc shape while being in contact with the side ends of the belt-shaped coil, and further allow the plurality of straight portions to be inserted into a respective one of the plurality of comb-shaped grooves in a second half portion of the belt-shaped coil upon pivot conveying. The coil conveying organizer includes a conveying rail that provides a conveying path pivotally conveying the belt-shaped coil along the coil winding jig, and a conveyor that moves along the conveying rail in a state gripping the plurality of straight portions of the belt-shaped coil.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: January 31, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shuhei Okuda, Eishi Yoshida
  • Patent number: 11569791
    Abstract: The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: January 31, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lieng Loo, Kahkeen Lai, Yilei Wu
  • Patent number: 11561253
    Abstract: There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: January 24, 2023
    Assignee: FUJI CORPORATION
    Inventors: Michihiko Tajima, Teruyuki Ohashi, Tetsuya Kako
  • Patent number: 11551854
    Abstract: A three-phase AC reactor according to an embodiment of the present invention includes three-phase coils that are not arranged in parallel, an input and output terminal block having an input and output unit having a parallel arrangement, and an external connection position change unit disposed between a coil end of each of the three-phase coils and the input and output terminal block to connect the coil end to the input and output terminal block.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: January 10, 2023
    Assignee: Fanuc Corporation
    Inventors: Kenichi Tsukada, Kaname Matsumoto, Makoto Takeshita, Yuuichi Yamada, Masatomo Shirouzu
  • Patent number: 11545801
    Abstract: A device is provided for aligning a ribbon cable relative to an electrical connector to crimp the electrical connector onto the ribbon cable with a tool. The device includes a side portion and a central piece. The side portion includes an upper end and a cable track having a width sized to receive the ribbon cable. The central piece is coupled to the side portion and includes an upper surface. The upper surface of the central piece and the upper end of the side portion at least partially define a connector retaining segment sized to receive the electrical connector.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: January 3, 2023
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Mark E. Davidsz, Michael S. Baran, Shravan Rajmohan, Douglas J. Carpiaux, Scott H. Micoley
  • Patent number: 11547032
    Abstract: A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: January 3, 2023
    Assignee: FUJI CORPORATION
    Inventor: Shotaro Hibino
  • Patent number: 11545881
    Abstract: The coil winding apparatus is for manufacturing a coil by winding a wire rod around a winding core rotated by a rotating mechanism, wherein the winding core has a base plate and a plurality of winding pins erected on the base plate, and a circumferential groove into which a wire rod are put is formed on the periphery of the plurality of winding pins. The rotation mechanism is provided with a rotatable rotating plate, a drive mechanism for rotating the rotating plate, and a pair of columnar members erected on the rotating plate so as to put a rotation center with between a pair of the columnar members. An inner base plate is mounted to a tip of the pair of columnar members, and the coil winding apparatus is provided with an outer winding core moving mechanism.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: January 3, 2023
    Assignee: NITTOKU CO., LTD.
    Inventors: Ryuto Tominaga, Takayuki Hasebe
  • Patent number: 11547033
    Abstract: A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 3, 2023
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Dae Sung Koo, Woo Young Lim, Yong Kim
  • Patent number: 11534811
    Abstract: A process for forming extruded products using a device having a scroll face configured to apply a rotational shearing force and an axial extrusion force to the same preselected location on material wherein a combination of the rotational shearing force and the axial extrusion force upon the same location cause a portion of the material to plasticize, flow and recombine in desired configurations. This process provides for a significant number of advantages and industrial applications, including but not limited to extruding tubes used for vehicle components with 50 to 100 percent greater ductility and energy absorption over conventional extrusion technologies, while dramatically reducing manufacturing costs.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: December 27, 2022
    Assignee: Battelle Memorial Institute
    Inventors: Vineet V. Joshi, Scott A. Whalen, Curt A. Lavender, Glenn J. Grant, Md. Reza-E-Rabby, Aashish Rohatgi, Jens T. Darsell
  • Patent number: 11517952
    Abstract: A shear assisted extrusion process for producing cladded materials wherein a cladding material and a material to be cladded are placed in sequence with the cladded material positioned to contact a rotating scroll face first and the material to be cladded second. The two materials are fed through a shear assisted extrusion device at a preselected feed rate and impacted by a rotating scroll face to generate a cladded extrusion product. This process allows for increased through wall strength and decreases the brittleness in formed structures as compared to the prior art.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: December 6, 2022
    Assignee: Battelle Memorial Institute
    Inventors: Vineet V. Joshi, Glenn J. Grant, Curt A. Lavender, Scott A. Whalen, Saumyadeep Jana, David Catalini, Jens T. Darsell