Abstract: A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.

Abstract: A reciprocating die roll forming machine for forming a pattern such as a thread form on the outer surface of a cylindrical blank includes at least one set of reciprocating dies operating upon the blank which rotates in place. The machine includes a slide and bearing combination to support the dies belt driven by a servo-motor controlled by a central processing unit. Mechanism is provided to deliver and position a blank for engagement by the dies. In one form, the machine includes multiple die sets to produce multiple parts during one die reciprocation cycle. In another form, the machine employs separate drive mechanisms to independently drive each die of a set.

Abstract: A new heat treatment for Internal-Tin Nb3Sn strands is described. The heat treatment uses Nausite membranes to decrease the volume fraction of the ? phase and therefore minimize its liquefaction—ultimately resulting in better connected Nb3Sn. The heat treatment requires only one stage aside from the final Nb3Sn reaction stage. This heat treatment enables an increase in critical current density (at 16 T) of 28%.

Abstract: The present invention relates to a heterostructure, in particular, a piezoelectric structure, comprising a cover layer, in particular, a layer of piezoelectric material, the material of the cover layer having a first coefficient of thermal expansion, assembled to a support substrate, the support substrate having a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion, at an interface wherein the cover layer comprises at least a recess extending from the interface into the cover layer, and its method of fabrication.

Abstract: A protective layer for use on a sensor during a manufacturing process avoids damage to the sensor and keeps the sensor surface clean during lens fabrication. The protective layer includes a non-cross-linked, water-soluble polymer layer and an anhydrous, cross-linkable, methacrylate-based formulation layer, temporarily applied to a surface of the sensor. The protective layer may be used to protect the sensor during a manufacturing process by applying the non-cross-linked, water-soluble polymer layer and the anhydrous, cross-linkable, methacrylate-based formulation layer consecutively onto the surface of the sensor to form the protective layer; affixing the sensor to a substrate; fabricating a device that includes the substrate; and subsequently removing the protective layer from the surface of the sensor.

Abstract: Systems and methods for measuring the thermal crown of rolls in-situ (e.g., at high temperature) either inside or outside the rolling mill can include sensors that measure propagation times of mechanical waves through the rolls. In some embodiments, one or more sensors are used to measure the propagation times of ultrasonic waves traveling inside the roll and normal to the roll's axis. These measurements can be taken when the roll is still hot and can be used to determine in real-time the thermal expansion at various points along the roll.

Abstract: The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.

Abstract: Disclosed is a tube-propelling apparatus for a tube bending machine. The apparatus comprises a main tube-propelling base mounted on a slide rail mechanism of a tube bending machine tool, wherein a penetrating hole though which both a fixing sleeve and a core rod pass is provided on the main tube-propelling base, the rear end of the fixing sleeve is fixed in the penetrating hole, and the front end of the fixing sleeve is provided with a tube clamping apparatus. The propelling apparatus further comprises a surplus material auxiliary propelling base mounted on the slide rail mechanism of the tube bending machine tool, wherein the surplus material auxiliary propelling base is provided with a through-hole coaxial with the penetrating hole of the main tube-propelling base. An auxiliary pushing sleeve is mounted in the through-hole, and the core rod passes through the auxiliary pushing sleeve.

Abstract: A method for manufacturing an interconnect structure is provided. The method includes the following steps. An opening is through a substrate. A low-k dielectric block is formed in the opening. At least one first via is formed through the low-k dielectric block. A first conductor is formed in the first via.

Abstract: A film bulk acoustic resonator (FBAR) and a method of fabricating the FBAR are disclosed. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the invention, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.

Abstract: An electrical submersible pump assembly has a motor with a stator stack of limitations. The stack has slots through which magnet wires are wound. An encapsulate surrounds and bonds the magnet wires together within each slot. The encapsulate includes ceramic particles within a polymer adhesive matrix. The polymer matrix may be a fluoropolymer adhesive. Each of the magnet wires may have an electrical insulation layer surrounding a copper core. The ceramic particles are rounded and much smaller than a cross-sectional area of each of the magnet wires. At least some of the magnet wires may be in contact with a perimeter of the slot. The ceramic particles may be porous.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A method of assembling an antenna aperture from a plurality of antenna aperture segments is described. The method may include placing a first aperture segment relative to a second aperture segment to partially form the antenna aperture. Furthermore, an overlap of the first aperture segment overlaps a complementary underlap of the second aperture segment at a seam. The method may also include joining the overlap of the first aperture segment to the underlap of the second aperture segment to partially form the antenna aperture.

Abstract: The present invention provides a device for manufacturing a multi-layer stacked structure and a method for manufacturing a thin film capacitor. The method includes providing a carrier substrate, forming a plurality of first material layers and a plurality of second layers that are alternately stacked on top of one another to form a multi-layer stacked structure, and then forming two terminal electrode structures for respectively enclosing two opposite side portions of the multi-layer stacked structure. One of the first material layer and the second material layer has a plurality of conductive particles randomly distributed therein. The conductive particles are heated to form a spherical structure or a sphere-like structure with low melting point and high surface energy at a temperature that is smaller than the degradation temperature of polymers. Therefore, the dielectric constant of the multi-layer stacked structure and the thin film capacitor can be increased.

Abstract: A scanning antenna including: a TFT substrate including a first dielectric substrate, a TFT, a gate bus line, a source bus line, and a patch electrode; a slot substrate including a second dielectric substrate and a slot electrode formed on a first main surface of the second dielectric substrate; a liquid crystal layer provided between the TFT substrate and the slot substrate; and a reflective conductive plate. The scanning antenna has a tiling structure in which a plurality of scanning antenna portions are bonded together, and each of the plurality of scanning antenna portions includes a TFT substrate portion and a slot substrate portion.

Abstract: A tactile switch on a mobile electronic device having a housing is provided. The tactile switch is comprised of a pressure sensitive interface on an exterior portion of the housing, a switch mechanism, and at least one pathway coupled to the pressure sensitive interface and extending from the pressure sensitive interface to the switch mechanism. The switch mechanism is at a remote location from the pressure sensitive interface. The pathway is formed in an interior portion of the housing. The tactile switch further includes a viscous fluid substantially filling the pathway. The tactile switch is configured such that when pressure is applied to the pressure sensitive interface, the viscous fluid exerts pressure on the switch mechanism, causing the switch to make an electrical contact.

Abstract: With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.

Abstract: An apparatus and method for determining whether a conductive ring is attached to an electrically conductive shaft. The body of the apparatus includes an electrical contact and side magnets positioned in a recess along the circumference of the cavity. When the shaft is received by the body, the electrical contact is in contact with the conductive shaft and the side magnets in the recess are in contact with the ring attached to the shaft, if present. An electrical signal is provided to the shaft and ring via the magnets and an output signal is generated. The output signal is indicative of whether the ring is attached to the shaft.

Abstract: A component mounting machine includes multiple component supply devices which respectively include multiple component supply units and are exchangeably equipped; a component transfer device in which a reference height as a reference of a lifting and lowering operation of a mounting nozzle is set; a height memory section which memorizes a height unique value that is unique for each component supply device and that is a height unique value based on unit heights of each component supply unit when the component supply device is equipped; and a height correction control section which corrects a lowering operation stroke amount of the mounting nozzle based on the height unique value of the equipped component supply device. Accordingly, an error in a height direction can be comprehensively absorbed and the component can be stably picked up by controlling a component pick-up operation of the mounting nozzle based on the height unique value.

Abstract: A shear assisted extrusion process for producing cladded materials wherein a cladding material and a material to be cladded are placed in sequence with the cladded material positioned to contact a rotating scroll face first and the material to be cladded second. The two materials are fed through a shear assisted extrusion device at a preselected feed rate and impacted by a rotating scroll face to generate a cladded extrusion product. This process allows for increased through wall strength and decreases the brittleness in formed structures as compared to the prior art.