Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: A cushion pin device for a press having a cushion pad in which a blank holder is seated on the top thereof outside a lower mold, and locks a blank holder to an upper mold while pressurizing an edge of a molded panel, includes: a cushion support disposed below the cushion pad, a cushion cylinder connected with a lower part of the cushion pad to move up or down the cushion pad from the cushion support, a linear scale mounted between the cushion pad and the cushion support to measure the position of the cushion pad, a main pressure control unit that keeps internal pressure of each cushion cylinder similarly, and a sub pressure control unit that is interconnected with the main pressure control unit so as to control the locking position of the cushion pad when each cushion cylinder operates.

Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Abstract: The use of supermalloy-like materials such as NiFeMe where Me is one or more of Mo, Cr, and Cu for the side and top shields of a magnetic bit sensor is shown to provide better shielding protection from stray fields because of their extremely high permeability. Moreover, the side shield may comprise a stack in which a Ni, Fe, Co, FeNi, CoFe, or FeCo is sandwiched between two NiFeMe layers to enhance the bias field on an adjacent free layer. Including NiFeMe in a side shield results in an increase in readback amplitude under the same asymmetric sigma. For these sensors, the signal to noise ratio was higher and the bit error rate was lower than with conventional materials in the side shield. A method is disclosed for forming a magnetic bit sensor having supermalloy-like materials in the side shields.

Abstract: Conductor cover applicators may define a mouth, or may incorporate movable jaws that open and close a mouth, for receiving a cable. The applicators may have a separator for spreading open a conductor cover, so that the cover can be fed through the applicator onto the cable. Methods of use and other variations are disclosed.

Abstract: This disclosure provides a method for filling printing ink in an electrowetting display substrate and a method for producing the electrowetting display panel. The electrowetting display substrate comprises a first substrate. The first substrate has pixel grids formed by pixel walls. The method for filling printing ink in an electrowetting display substrate comprises steps of: filling a mixture of an oil-containing printing ink and a solvent into the pixel grids, wherein the solvent has a boiling temperature lower than that of the oil, and the printing ink is soluble in the solvent; and vaporizing the solvent at a temperature that is lower than the boiling temperature of the oil and higher than or equal to the boiling temperature of the solvent. The method may adjust the filling height of the printing ink effectively, and allow the filling heights of the printing ink in all pixel grids to be substantially the same, so as to enhance the display effect of the electrowetting display panel.

Abstract: A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

Abstract: A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit (10) for separating a flip-chip (200) from a carrier (100) and providing the flip-chip (200), the supply unit (10) including flipping device (11); a transfer unit (20) for receiving the flip-chip (200) from the flipping device (11); a position adjustment unit (30) for adjusting the positions of flip-chips (200) on the transfer unit (20); a bonding unit (40) for bonding the flip-chips (200) on the transfer unit (20) onto a substrate (400); a transportation unit (50) for transporting the transfer unit (20); and a control unit (60) for controlling the movement of the preceding units. The transfer unit (20) is capable of receiving multiple flip-chips (200) and allows the flip-chips (200) to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput.

Abstract: A current transformer includes first and second bobbins, and a secondary winding. The first bobbin includes a first tube defining a first longitudinal axis. First and second flanges are disposed on first and second ends of the first tube. The first tube, the first and second flanges collectively define a first slit along the first longitudinal axis. The first slit allows receipt of a primary conductor into the first tube. The second bobbin includes a second tube rotatably received about the first tube. The second tube defines a second slit along the second longitudinal axis. The second slit allows receipt of the primary conductor into the first and second tubes. The secondary winding is wound about the first bobbin and extends along the first longitudinal axis, passing through the first tube and over the first and second flanges. The second tube rotates about the second longitudinal axis relative to the first tube.

Abstract: A memory connector retention apparatus is disclosed. The memory connector retention apparatus may comprise a retention body having a top portion, a bottom portion, two side portions, an end portion, and a fastening portion. In an example, the top portion and the bottom portion may be open, forming a cavity in the retention body to allow a memory connector and a memory module to be positioned within the retention body. The fastening portion may allow the retention body to secure the memory module within the memory connector by keeping memory snap arms of the memory connector fixed in a closed configuration when the fastening portion is in a tightened position. In an example, the fastening portion may comprise a hole such that a tightening element, e.g., a screw or peg, may fit into the hole.

Abstract: Embodiments involve rotors for axial flux induction rotating electric machines that use a soft magnetic composite for the rotor core. A first embodiment is directed to a rotor for a rotating electrical machine that transmits magnetic flux parallel to a shaft of the rotor. The rotor includes a rotor winding and a plurality of cores. The rotor winding consists of a solid piece of conductive material that comprises a plurality of cavities. Each core is placed in a respective cavity and comprises a highly resistive isotropic ferromagnetic powder.

Abstract: Provided is a round billet capable of reducing damage on a piercing plug in a method of producing a seamless metal tube with a Mannesmann process. The round billet (5), for use in a seamless metal tube, to be produced into a seamless metal tube with a Mannesmann process includes a body having a hole (6) formed in an axial direction of the body. The hole (6) includes an aperture (6a) opening at least at one end face of the round billet (5), and a tapered portion (61) continued to the aperture (6a) and having a diameter gradually increasing toward the aperture (6a).

Abstract: A shell, a container employing the shell, and tooling and associated methods for forming the shell are provided. The shell includes a center panel, a circumferential chuck wall, an annular countersink between the center panel and the circumferential chuck wall, and a curl extending radially outwardly from the chuck wall. The material of at least one predetermined portion of the shell is selectively stretched relative to at least one other portion of the shell, thereby providing a corresponding thinned portion. The tooling includes a pressure concentrating forming surface.

Abstract: A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Abstract: The present invention discloses an apparatus and a method for manufacturing molding inductor. The apparatus mainly comprises a mold and at least one magnetic force generating unit. Particularly, the mold is designed to have one or more accommodation spaces to correspondingly receive one or more coils. On the other hand, the magnetic force generating unit is configured to apply a magnetic force to the accommodation spaces after a molding material doped with magnetic ferrite powder is filled into the accommodation spaces receiving with the coil therein. Consequently, the molding material is forced by a molding stress provided by the applied magnetic force to move effectively downward in the accommodation space, such that a molded body is eventually formed in the accommodation space.

Abstract: A device and a method for connecting sheet metal parts to form lamination stacks are demonstrated, in which sheet metal parts are stamped out of an electrical steel strip by means of at least one stamping stage, which has a die and a cutting edge that cooperates with the die, and the stamped-out sheet metal parts are stacked and at least integrally joined to form a plurality of lamination stacks; at least between a first sheet metal part of the stacked sheet metal parts and the subsequent second sheet metal part of the stacked sheet metal parts, a separating element is provided in order to facilitate the separation of the integrally joined sheet metal parts in lamination stacks.

Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: A method of making a part comprising stacking a plurality of uncured composite sheets to form an uncured composite stack. The method also comprises interposing a resistor wire between an adjacent two of the uncured composite sheets of the uncured composite stack. The method further comprises applying heat to the uncured composite stack externally of the uncured composite stack to at least partially cure the plurality of uncured composite sheets. The method additionally comprises transmitting an electric current through the resistor wire to generate heat, from the resistor wire, internally within the uncured composite stack to at least partially cure the plurality of uncured composite sheets. Applying heat to the uncured composite stack externally and generating heat internally converts the plurality of uncured composite sheets into a plurality of cured composite sheets and converts the uncured composite stack into a cured composite stack.